Abstract: An IC card comprises a thermoplastic resin core sheet and an IC chip bearing a conductive projection formed on an electrode of the IC chip, the IC chip being embedded in the core sheet in such a manner that the exposed top surface of the conductive projection is made flush with the main surface of the core sheet. A conductive layer pattern formed on the main surface of the core sheet is extended for contact with the exposed top surface.

Abstract: An IC card comprises a thermoplastic resin core sheet and an IC chip bearing a conductive projection formed on an electrode of the IC chip, the IC chip being embedded in the core sheet in such a manner that the exposed top surface of the conductive projection is made flush with the main surface of the core sheet. A conductive layer pattern formed on the main surface of the core sheet is extended for contact with the exposed top surface.

Abstract: In an IC card according to the present invention, a base sheet formed of thermoplastic material is sandwiched between a substrate sheet and a dummy sheet both formed of nonplastic material lower in thermoplasticity than the base sheet. The substrate sheet is fitted with at least one IC chip and input/output terminals electrically connected to the IC chip. First and second cover sheets formed of thermoplastic material are put individually on the outer surfaces of the substrate sheet and the dummy sheet. The cover sheet on the substrate sheet is formed with apertures through which the input/output terminals are exposed to the outside.

Abstract: A circuit board is prepared such that at least two resin substrates are laminated and bonded by thermocompression, a circuit pattern made of a resin composition containing a conductor material is formed on at least one of opposing surfaces of the substrates, a region of the substrate which corresponds to a specific portion of the circuit pattern is recessed, the specific portion of the circuit projects into the recess in accordance with plastic deformation of the substrates and the circuit pattern which is caused by thermocompression bonding, and the specific portion of the circuit pattern constitutes an exposed portion. Multilayer or three-dimensional wiring can be easily achieved in the circuit board.

Abstract: There is disclosed a wiring substrate comprising a wiring circuit pattern formed on a metal substrate with an insulating resinous layer interposed therebetween. In this wiring substrate, the insulating resinous layer is formed of a high molecular composition comprising thermosetting 1,2-polybutadiene containing 5 to 30% by weight of a high molecular softening agent such as hydrogenated polybutadiene. A method of manufacturing such a wiring substrate is also disclosed, wherein a light-reflecting pigment is included in the insulating resinous layer for the convenience of the subsequent laser trimming.

Abstract: A conductor path is formed by providing an insulating substrate having a surface region which is formed of an insulating composition. The insulating composition contains an organic polymeric material and at least one metal source. The metal source is a metallic powder and/or an organic compound chemically combining a metal or metals. The surface region of the substrate is selectively heated along a predetermined pattern, thereby decomposing and evaporating the organic polymeric material at the heated portion and welding the metal in the heated portion so as to form a conductor path formed of the metal.

Abstract: Terminal-equipped electronic elements, such as chip resistors and chip diodes, are arranged such that one surface of each terminal contacts one surface of a support board, the support board being placed to face a flat plate through a spacer. An electrically insulative liquid synthetic resin is injected between the support board and the flat board and cured to form a synthetic resin layer burying the electronic elements. The support board, flat board and spacer are peeled from the electronic elements and the synthetic resin layer to expose one surface of the terminal of each electronic element on one surface of the synthetic resin layer. A conductive pattern is formed on the synthetic resin layer by screen printing to connect the terminals of the electronic elements.

Abstract: A resistor is formed by locally heating an insulating material layer between conductors to convert the heated material into a first resistor element. A second resistor element is formed to contact the first resistor element while measuring the resistance between the conductors, until a desired resistor composed of the first and second resistor elements and having a predetermined resistance value is obtained.

Abstract: A method for producing a capacitor includes the steps of: forming on a dielectric layer formed on a first electrode, an insulating composition, e.g., an organic polymeric compound containing a metal powder or an organometallic compound as a metal source, which is rendered conductive upon heating by radiation; and locally and gradually heating the insulating composition layer so as to form a second conductive electrode while measuring an increase in a capacitance between a conductor end portion for measuring a capacitance and the first electrode. According to this method, a capacitor having a precise capacitance can be formed.

Abstract: A method for manufacturing a hybrid integrated circuit device comprising a step of forming an Al.sub.2 O.sub.3 layer on a metal substrate, a step of forming on the Al.sub.2 O.sub.3 layer a resist layer having a pattern opposite to that of a copper layer which will be formed on the Al.sub.2 O.sub.3 layer by a later step, a step of forming the copper layer on the Al.sub.2 O.sub.3 layer using the resist layer as a mask, a step of impregnating thermosetting material into both the Al.sub.2 O.sub.3 layer and the copper layer, and a step of providing at least one semiconductor element on the copper layer.