Patents by Inventor Hirosuke Watanabe

Hirosuke Watanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060280942
    Abstract: A two-step method for dipping a synthetic fiber includes the fiber being first dipped with an aqueous pre-dip composition followed by a dip with resorcinol-formaldehyde latex (RFL) composition, wherein the pre-dip composition includes a blocked isocyanate having at least tri-functional isocyanate groups and a latex wherein the ratio by weight of blocked isocyanate and latex is in the range of 9 to 0.7, preferably in the range of 4 to 1. A pre-dip composition for dipping a synthetic fiber includes a blocked at least tri-functional isocyanate compound and a latex, further including water, an emulsifier, and 2-vinyl pyridine copolymer and to a fiber, cord, and composite article of rubber and fiber or cord, wherein the fiber or cord has distributed over at least a surface portion thereof (1) blocked tri-functional isocyanate compound, preferably HDI-trimer; (2) an RFL adhesive; and (3) an in situ vulcanized rubber compound.
    Type: Application
    Filed: September 4, 2004
    Publication date: December 14, 2006
    Applicant: TEIJIN TWARON B.V.
    Inventor: Hirosuke Watanabe
  • Patent number: 6528113
    Abstract: An adhesive-treated polyester fiber cord having a high adhesion to non-vulcanized rubber, a high resistance to separation of fibers or filaments from each other, and being useful as a reinforcing cord for producing a rubber composite material such as belt having high dimensional stability and power transmission property, is produced by first impregnating a material cord a first adhesive liquid containing a polyepoxide compound and a blocked polyisocyanate compound in solid weight ratio of 1/3-1/15, by heat treating it at 160-240° C., by second treating the treated cord with a second adhesive liquid containing a resorcinol-formaldehyde resin and a rubber latex in a solid weight ratio of 1/3-1/15, by heat treating it at 180-240° C., by third treating the treated cord with a third adhesive liquid containing a resorcinol formaldehyde resin (resorcinol/formaldehyde molar ratio: 1/0.6-1/1.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: March 4, 2003
    Assignee: Teijin Limited
    Inventors: Hirosuke Watanabe, Shoji Makino, Toshimasa Kuroda
  • Patent number: 5776597
    Abstract: There is provided a speaker damper for use in an acoustic output device, which exhibits excellent shape retaining property at the time of molding, is highly safe to work environment and has excellent water resistance, heat resistance an durability. The speaker damper is obtained by impregnating cloth formed of mixed yarn of a wholly aromatic polyamide fiber and an aromatic polyester fiber with a polyester resin, and molding the cloth under heat and pressure.
    Type: Grant
    Filed: February 22, 1996
    Date of Patent: July 7, 1998
    Assignees: Teijin Limited, Matsushita Electric Industrial Co., Ltd.
    Inventors: Hirosuke Watanabe, Takeo Kimura, Masatoshi Okazaki, Shinya Mizone
  • Patent number: 5240770
    Abstract: A surface-modified wholly aromatic polyamide fiber having an enhanced bonding property, surface tenacity and durability and a reduced friction, comprises a fiber matrix of a wholly aromatic polyamide material, fine particles of a cation-exchanging inorganic material distributed on and in a surface portion of the matrix and an additive comprising a cationic organic compound or a multi-functional organic silicone compounds, and attached to the fine organic particles.
    Type: Grant
    Filed: September 11, 1991
    Date of Patent: August 31, 1993
    Assignee: Teijin Limited
    Inventors: Hiroyuki Moriga, Shoji Makino, Akira Kimura, Hirosuke Watanabe, Tadashi Hirakawa
  • Patent number: 4414272
    Abstract: A shaped polyester composite material having an excellent bonding property to rubber, comprises a shaped substrate comprising an aromatic linear polyester matrix and 0.3 to 15%, based on the weight of the matrix, of silicon dioxide fine particles having an average size of 5 to 100 millimicrons and dispersed in at least a surface portion of the substrate, and;a surface coating layer formed on the fine particle-containing surface portion of the substrate and comprising a surface-activating material consisting of at least one member selected from silane coupling compounds and organic titanium compounds, the surface coating layer having been heat treated at a temperature of 50.degree. C. or more but at least 10.degree. C. below the melting point of the polyester matrix.
    Type: Grant
    Filed: September 16, 1981
    Date of Patent: November 8, 1983
    Assignee: Teijin Limited
    Inventors: Hirosuke Watanabe, Tadahiko Takata