Abstract: In a DC-DC converter module, a first through-hole conductor provided in a substrate as a first lead for electrically connecting a terminal as a voltage output terminal of an IC and a first terminal of an inductor component to each other and a second through-hole conductor provided in the substrate as a second lead for electrically connecting a terminal as a switching terminal of the IC and a second terminal of the inductor component to each other oppose each other in a direction intersecting a direction in which the first and second terminals oppose each other in the inductor component (i.e., the longitudinal direction of the substrate and inductor component).

Abstract: An electronic component module is configured by a passive component mounted on a built-in IC substrate. The passive component is provided with a passive element inductor, and a mounting surface for mounting on a substrate. Concavities are respectively provided at parts of two opposed borders in the mounting surface, and a terminal electrode is provided at the bottom part of the concavities. Since the passive component has a concavity within the mounting surface and the terminal electrode is incorporated within this concavity, the passive component can be mounted low on the substrate surface. Since the terminal electrode is incorporated in the concavity, solder is prevented from spreading fillet-like at the periphery of the inductor, thus increasing the mounting density of the passive component. There is increased freedom for mounting the passive component because the passive component is mounted on the built-in IC substrate in which the IC is embedded in the substrate.

Abstract: A ferrite substrate, a winding-embedded ferrite resin layer, and an IC-embedded ferrite resin layer are laminated, the ferrite substrate has a ferrite first protruding part that protrudes into the ferrite resin layer from the surface thereof, the winding inside the ferrite resin layer is arranged winding around the first protruding part, and the IC overlaps the first protruding part in the resin layer. According to this configuration, high integration can be achieved, and the IC is arranged at a site where the ferrite first protruding part, the height of which fluctuates little as a result of thermal expansion, overlaps the ferrite resin layer, the thickness of which is thinned by the first protruding part and varies little as a result of thermal expansion, minimizing variations in the gap between the winding and the IC as a result of thermal expansion, and achieving greater stability of electrical characteristics.

Abstract: In a DC-DC converter module, a first through-hole conductor provided in a substrate as a first lead for electrically connecting a terminal as a voltage output terminal of an IC and a first terminal of an inductor component to each other and a second through-hole conductor provided in the substrate as a second lead for electrically connecting a terminal as a switching terminal of the IC and a second terminal of the inductor component to each other oppose each other in a direction intersecting a direction in which the first and second terminals oppose each other in the inductor component (i.e., the longitudinal direction of the substrate and inductor component).

Abstract: A ferrite substrate, a winding-embedded ferrite resin layer, and an IC-embedded ferrite resin layer are laminated, the ferrite substrate has a ferrite first protruding part that protrudes into the ferrite resin layer from the surface thereof, the winding inside the ferrite resin layer is arranged winding around the first protruding part, and the IC overlaps the first protruding part in the resin layer. According to this configuration, high integration can be achieved, and the IC is arranged at a site where the ferrite first protruding part, the height of which fluctuates little as a result of thermal expansion, overlaps the ferrite resin layer, the thickness of which is thinned by the first protruding part and varies little as a result of thermal expansion, minimizing variations in the gap between the winding and the IC as a result of thermal expansion, and achieving greater stability of electrical characteristics.

Abstract: An electronic component module is configured by a passive component mounted on a built-in IC substrate. The passive component is provided with a passive element inductor, and a mounting surface for mounting on a substrate. Concavities are respectively provided at parts of two opposed borders in the mounting surface, and a terminal electrode is provided at the bottom part of the concavities. Since the passive component has a concavity within the mounting surface and the terminal electrode is incorporated within this concavity, the passive component can be mounted low on the substrate surface. Since the terminal electrode is incorporated in the concavity, solder is prevented from spreading fillet-like at the periphery of the inductor, thus increasing the mounting density of the passive component. There is increased freedom for mounting the passive component because the passive component is mounted on the built-in IC substrate in which the IC is embedded in the substrate.

Abstract: A power line communication system comprises an indoor power line and one or more power line branching apparatuses connected to the indoor power line. The power line branching apparatus comprises a communication channel that is branched off from the indoor power line and connectable to a power line communication device, and a power supply channel that is branched off from the indoor power line and connectable to electrical equipment. The power line branching apparatus further comprises an impedance matching circuit and a normal mode filter circuit. The impedance matching circuit is provided on the power supply channel, and sets the impedance of the indoor power line to a predetermined value. The normal mode filter circuit is provided on the power supply channel, and reduces normal mode noise occurring from the electrical equipment connected to the power supply channel.

Abstract: A power line communication system comprises an indoor power line and one or more power line branching apparatuses connected to the indoor power line. The power line branching apparatus comprises a communication channel that is branched off from the indoor power line and connectable to a power line communication device, and a power supply channel that is branched off from the indoor power line and connectable to electrical equipment. The power line branching apparatus further comprises an impedance matching circuit and a normal mode filter circuit. The impedance matching circuit is provided on the power supply channel, and sets the impedance of the indoor power line to a predetermined value. The normal mode filter circuit is provided on the power supply channel, and reduces normal mode noise occurring from the electrical equipment connected to the power supply channel.

Abstract: The invention has for its object to provide an organic EL display driving system and method enabling an organic EL display to be driven with neither a contrast lowering nor a false light emission phenomenon yet in simple construction. The driving system and method drive an organic EL device which comprises at least one set of scanning electrodes and data electrodes arranged in a matrix fashion and an organic material-containing organic layer located between said scanning and data electrodes and taking part in at least a light emission function, with one closed circuit formed through at least one set of electrodes. When the scanning and data electrodes are driven, a given non-selection time is provided between driving one electrode and driving the next electrode.

Abstract: An organic EL display driving system which enables even a display with a mixed matrix-and-segment portion to be driven with neither a contrast lowering nor a false light emission phenomenon, and yet which is simple in construction. To achieve this, there is provided a system and method for driving an organic EL display with a mixed matrix-and-segment portion, which includes an organic material-containing organic layer between a scanning electrode and a data electrode. When the scanning electrode and the data electrode are driven, a non-selection time during which no data is displayed is provided after driving the segment portion.