Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin for sealing the semic

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first dip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame and a sealing resin.

Abstract: An image forming apparatus includes an image forming device to form a toner image on a sheet; a fixing device to fix the toner image on the sheet; a toner container to house the toner to be supplied to the image forming device, the toner container arranged above the fixing device; a cooling fan; a guide to guide an airflow coming from the cooling fan to an outer circumferential surface of the toner container; an outer-circumferential flow path to serve as an airflow path between the outer circumferential surface of the toner container and a wall facing the outer circumferential surface, the outer-circumferential flow path guiding the airflow coming from the guide along the outer circumferential surface; a suction fan to suck the airflow having passed through the outer-circumferential flow path; and an exhaust guide to discharge the sucked airflow.

Abstract: An image forming apparatus includes an image forming device to form a toner image on a sheet; a fixing device to fix the toner image on the sheet; a toner container to house the toner to be supplied to the image forming device, the toner container arranged above the fixing device; a cooling fan; a guide to guide an airflow coming from the cooling fan to an outer circumferential surface of the toner container; an outer-circumferential flow path to serve as an airflow path between the outer circumferential surface of the toner container and a wall facing the outer circumferential surface, the outer-circumferential flow path guiding the airflow coming from the guide along the outer circumferential surface; a suction fan to suck the airflow having passed through the outer-circumferential flow path; and an exhaust guide to discharge the sucked airflow.

Abstract: The present invention provides a multi-junction solar cell capable of increasing the degree of freedom of the selection of compound semiconductors. The multi-junction solar cell 1 includes a layered structure section 4 including compound semiconductor photovoltaic devices 2 and 3 matched in lattice constant with each other and joined to each other, and a nanopillar structure section 7 including a compound semiconductor photovoltaic device or a plurality of compound semiconductor photovoltaic devices 5 and 6 joined to each other.

Abstract: A solar cell element having improved power generation efficiency is provided. A solar cell element 100 has a substrate 110, a mask pattern 120, semiconductor nanorods 130, a first electrode 150 and a second electrode 160. The semiconductor nanorods 130 are disposed in triangular lattice form as viewed in plan on the substrate 110. The ratio p/d of the center-to-center distance p between each adjacent pair of the semiconductor nanorods 130 and the minimum diameter d of the semiconductor nanorods 130 is within the range from 1 to 7. Each semiconductor nanorod 130 has a central nanorod 131 formed of a semiconductor of a first conduction type, a first cover layer 132 formed of an intrinsic semiconductor and covering the central nanorod 131, and a second cover layer 138 formed of a semiconductor of a second conduction type and covering the first cover layer 132.

Abstract: A portable playback apparatus includes a manually operated single pushbutton and a control circuit connected to the pushbutton for selectively determining one of a plurality of operating modes of the apparatus in accordance with successive depressions of the pushbutton, or duration of each depression, or in accordance with the number of depressions. The single pushbutton may be attached to an earpiece cord or located on one end face of a housing of the apparatus which is convenient to use.