Patents by Inventor Hirotaka HANASAKI

Hirotaka HANASAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat source system controlling device, heat source system, heat source system controlling method, and heat source system controlling program
    Patent number: 11346563
    Abstract: A superordinate controlling device for a heat source system (1) including a plurality of heat sources, the superordinate controlling device being applied to the heat source system (1) and controlling heat-pump type chillers (2a) and (2b) and absorption-type chillers (2c) and (2d) in such a manner that a heat transfer medium leaving temperature that is the temperature of a heat transfer medium supplied to an external load (6) is equal to a setting temperature. The heat-pump type chillers (2a) and (2b) each have a higher Coefficient of Performance (COP) than that of each of the absorption-type chillers (2c) and (2d).
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: May 31, 2022
    Assignees: MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD., TOKYO ELECTRIC POWER COMPANY HOLDINGS, INCORPORATED
    Inventors: Satoshi Nikaido, Koki Tateishi, Yusuke Hazui, Yutaka Takenaka, Hirotaka Hanasaki, Satoru Tanaka
  • HEAT SOURCE SYSTEM CONTROLLING DEVICE, HEAT SOURCE SYSTEM, HEAT SOURCE SYSTEM CONTROLLING METHOD, AND HEAT SOURCE SYSTEM CONTROLLING PROGRAM
    Publication number: 20200041144
    Abstract: A superordinate controlling device for a heat source system (1) including a plurality of heat sources, the superordinate controlling device being applied to the heat source system (1) and controlling heat-pump type chillers (2a) and (2b) and absorption-type chillers (2c) and (2d) in such a manner that a heat transfer medium leaving temperature that is the temperature of a heat transfer medium supplied to an external load (6) is equal to a setting temperature. The heat-pump type chillers (2a) and (2b) each have a higher Coefficient of Performance (COP) than that of each of the absorption-type chillers (2c) and (2d).
    Type: Application
    Filed: September 20, 2017
    Publication date: February 6, 2020
    Applicants: MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD., TOKYO ELECTRIC POWER COMPANY HOLDINGS, INCORPORATED
    Inventors: Satoshi NIKAIDO, Koki TATEISHI, Yusuke HAZUI, Yutaka TAKENAKA, Hirotaka HANASAKI, Satoru TANAKA