Patents by Inventor Hirotaka Inomata

Hirotaka Inomata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor manufacturing equipment and manufacturing method of the same
    Patent number: 8801895
    Abstract: A semiconductor manufacturing equipment includes a first chamber that has a first connection hole, a second chamber that has a second connection hole connected to the first connection hole of the first chamber, an O-ring that is provided between the first chamber and the second chamber so as to surround the first connection hole and the second connection hole, and a cover portion that covers a space between the first chamber and the second chamber.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: August 12, 2014
    Assignee: Spansion, LLC
    Inventor: Hirotaka Inomata
  • SEMICONDUCTOR MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD OF THE SAME
    Publication number: 20080210170
    Abstract: A semiconductor manufacturing equipment includes a first chamber that has a first connection hole, a second chamber that has a second connection hole connected to the first connection hole of the first chamber, an O-ring that is provided between the first chamber and the second chamber so as to surround the first connection hole and the second connection hole, and a cover portion that covers a space between the first chamber and the second chamber.
    Type: Application
    Filed: February 5, 2008
    Publication date: September 4, 2008
    Applicant: Spansion LLC
    Inventor: Hirotaka Inomata