Patents by Inventor Hirotaka Kobayashi
Hirotaka Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240218889Abstract: A hydraulic cylinder includes: a cylinder tube; a piston rod; a piston member; a rod inner passage provided within the piston rod, a rod inner passage being configured such that a first opening portion opens at an outer circumferential surface of the piston rod in the cylinder tube, and such that a second opening portion opens outside the cylinder tube; and a sensor part provided outside the cylinder tube, the sensor part being configured to detect that the working fluid is guided to the rod inner passage, the piston member is connected to the piston rod in a state in which one-side end surface is in contact with an annular step portion so as to block the first opening portion of the rod inner passage, the annular step portion being provided on the outer circumferential surface of the piston rod, and the sensor part is configured to detect that the working fluid is guided to the rod inner passage from a rod side chamber and a counter rod side chamber through a gap between the step portion and the piston membeType: ApplicationFiled: April 25, 2022Publication date: July 4, 2024Applicant: KYB CorporationInventors: Tatsuya ITOU, Nobuyuki KOBAYASHI, Hirotaka KOBAYASHI
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Publication number: 20240124697Abstract: A resin composition has a low styrene-based resin content and that has little impact on the environment, wherein the resin composition has good moldability and yields molded articles having excellent tensile moduli and tensile elongations at break; and a molded article composed of the resin composition. The resin composition contains an inorganic filler containing calcium carbonate and a styrene-based resin containing a diene component, wherein the inorganic filler content is 50 mass % or more relative to the overall mass of the resin composition, and as measured in accordance with ASTM-D638, the tensile modulus is 1,000-3,000 MPa, and the tensile elongation at break is 5% or higher.Type: ApplicationFiled: March 24, 2022Publication date: April 18, 2024Applicant: DENKA COMPANY LIMITEDInventors: Eri KAMIMAKI, Daisuke MOTOI, Hirotaka KOBAYASHI
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Patent number: 11942495Abstract: A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.Type: GrantFiled: June 21, 2019Date of Patent: March 26, 2024Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Daisuke Chino, Hiroyuki Shigeta, Shigekazu Ishii, Koyo Hosokawa, Hirohisa Yasukawa, Mitsuhito Kanatake, Kosuke Hareyama, Yutaka Ootaki, Kiyohisa Sakai, Atsushi Tsukada, Hirotaka Kobayashi, Ninao Sato, Yuki Yamane
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Publication number: 20230324944Abstract: A neutral return mechanism includes an interlocking shaft to be pushed and pulled in an axial direction in conjunction with a swinging operation of an operation member; a housing member to support the interlocking shaft such that the interlocking shaft is movable in the axial direction and accommodate the interlocking shaft such that one of opposite end portions thereof protrudes; a neutral return spring to return the interlocking shaft from a post-movement position to an initial position, the neutral return spring being accommodated in the housing member such that the neutral return spring extends in the axial direction of the interlocking shaft, wherein the housing member includes a supported portion between a spring accommodation portion in which the neutral return spring is accommodated and a protrusion opening through which the interlocking shaft protrudes, the supported portion being supported at a bracket member.Type: ApplicationFiled: June 2, 2023Publication date: October 12, 2023Applicants: KUBOTA CORPORATION, KYB CORPORATIONInventors: Hiroshi HORII, Tetsuya AOKI, Hirotaka KOBAYASHI
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Publication number: 20230298955Abstract: A region of a sealing part is effectively utilized. -A semiconductor device includes a semiconductor element, a substrate, a sealing part, and a cavity region. The substrate included in this semiconductor device is disposed adjacent to a bottom surface of the semiconductor element. The sealing part included in this semiconductor device is formed in a shape that covers an upper surface that is a surface facing the bottom surface of the semiconductor element, and seals the semiconductor element. The cavity region included in this semiconductor device is a region disposed in the sealing part and formed with a cavity.Type: ApplicationFiled: March 5, 2021Publication date: September 21, 2023Applicants: SONY GROUP CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Shigekazu ISHII, Bernadette ELLIOTT-BOWMAN, Christopher WRIGHT, Timothy BEARD, Matthew LAWRENSON, Hirotaka KOBAYASHI, Hiroyuki SHIGETA
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Patent number: 11668530Abstract: Oil cooler is provided to include: a number of core plates each of which has three oil pass holes where oil flows and three cooling water pass holes where cooling water flows; heat-exchanging section where core plates are laminated to define inter-plate oil flow passage and inter-plate cooling water flow passage alternately between an adjacent pair of core plates, in which oil and cooling water can mutually independently flow in direction perpendicular to core plate lamination direction while changing its flow direction by U-turn thereby proceeding in core plate lamination direction as a whole; one end part located at one side of core plate lamination direction and provided with both oil inlet and oil outlet; and the other end part located at the other side of core plate lamination direction and provided with both cooling water inlet and cooling water outlet.Type: GrantFiled: March 11, 2020Date of Patent: June 6, 2023Assignees: MAHLE INTERNATIONAL GMBH, MAHLE JAPAN LTD.Inventors: Hirotaka Kobayashi, Yasuaki Suzuki, Masahiro Ariyama
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Patent number: 11472112Abstract: In order to provide a composite object that can be produced at high quality and low cost using a 3D printer, a composite object includes: a first object obtained by assembling one or at least two assemblable toy blocks; and a second object constituted by one or at least two parts produced through 3D printing, and configured to be attached to the first object so as to cover at least a portion except for part of a surface thereof. Accordingly, it is possible to produce an object at high quality and low cost using a 3D printer.Type: GrantFiled: June 24, 2016Date of Patent: October 18, 2022Assignee: ANALYTICWARE, INC.Inventors: Kimio Momose, Hirotaka Kobayashi
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Publication number: 20220139979Abstract: An improvement in heat radiation efficiency is achieved. A semiconductor device according to the present technology includes a substrate portion on which a semiconductor chip is mounted and in which an external connection terminal for performing electrical connection to the outside is formed on a rear surface on a side opposite to a front surface which is a surface on a side where the semiconductor chip is mounted, an outer wall portion that protrudes toward the front surface side in an outer circumferential portion of the substrate portion, a lid portion which is supported by the outer wall portion and covers the semiconductor chip, and a heat storage member which is disposed at a position further inside than the outer wall portion between the rear surface of the substrate portion and a rear surface of the lid portion.Type: ApplicationFiled: January 5, 2020Publication date: May 5, 2022Inventors: TSUYOSHI WATANABE, HIROKAZU NAKAYAMA, HIROYUKI SHIGETA, HITOSHI SHIBUE, HIROTAKA KOBAYASHI, KOSUKE HAREYAMA
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Patent number: 11311822Abstract: A bubble separator used in a fluid circuit for an automobile and that separates bubbles in a refrigerant may include a swirl flow formation part extending in a substantially horizontal direction, and including an internal space having a columnar shape. The bubble separator may also include a flow inlet disposed at one end of the swirl flow formation part, and being open so as to cause the refrigerant to flow in the flow inlet in a tangential direction of an inner peripheral surface of the swirl flow formation part and so as to form a swirl flow on the inner peripheral surface. The bubble separator may also include a flow outlet disposed at another end of the swirl flow formation part, and being open so as to cause the refrigerant to flow out of the flow outlet in a tangential direction from the inner peripheral surface.Type: GrantFiled: December 24, 2020Date of Patent: April 26, 2022Inventors: Yoshikazu Endo, Tsuyoshi Hagiwara, Hirotaka Kobayashi
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Publication number: 20210233949Abstract: Deformation of a semiconductor chip is to be prevented in a semiconductor device in which a heat releasing plate and a circuit board are disposed. The semiconductor device includes the semiconductor chip, the circuit board, the heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.Type: ApplicationFiled: June 21, 2019Publication date: July 29, 2021Inventors: DAISUKE CHINO, HIROYUKI SHIGETA, SHIGEKAZU ISHII, KOYO HOSOKAWA, HIROHISA YASUKAWA, MITSUHITO KANATAKE, KOSUKE HAREYAMA, YUTAKA OOTAKI, KIYOHISA SAKAI, ATSUSHI TSUKADA, HIROTAKA KOBAYASHI, NINAO SATO, YUKI YAMANE
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Publication number: 20210220757Abstract: The separation efficiency for bubbles contained in liquid is improved. A bubble separator 20 that separates bubbles in liquid is provided.Type: ApplicationFiled: December 24, 2020Publication date: July 22, 2021Inventors: Joshikazu Endo, Tsuyoshi Hagiwara, Hirotaka Kobayashi
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Publication number: 20210210540Abstract: A method of manufacturing an imaging element having a light receiving surface curved in accordance with an aberration of an imaging lens is simplified. The imaging element includes an imaging chip, a curve forming portion, and a curve holding portion. The imaging chip includes a semiconductor chip having a rear surface on which a concave portion is formed, the rear surface being a surface different from a light receiving surface that receives light from a subject. The curve forming portion is arranged in the concave portion and forms a curved portion by curving the imaging chip at a bottom of the concave portion. The curve holding portion holds the formed curved portion.Type: ApplicationFiled: August 9, 2019Publication date: July 8, 2021Inventor: HIROTAKA KOBAYASHI
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Patent number: 10983435Abstract: An electrophotographic device equipped with a negatively-charged laminated electrophotographic photoreceptor that can be charged by a scorotron charging method, and includes a conductive substrate, and a charge generation layer and a charge transport layer sequentially provided on the conductive substrate, wherein the charge generation layer contains a charge generation material and a resin binder that is a poly(vinyl butyral) resin binder, and the charge transport layer contains a charge transport material that is either or both of stilbene compounds represented by Formula (1) and Formula (2), a binder resin, and an oxidation inhibitor that is tribenzylamine represented by Formula 3, wherein the conductive substrate is cylindrical, the electrophotographic photoreceptor has a difference between a maximum value and a minimum value of a surface potential in a circumferential direction, after exposure to ozone at an exposure dose of 100 ppm·h, that is 12 V or less.Type: GrantFiled: August 23, 2019Date of Patent: April 20, 2021Assignee: FUJI ELECTRIC CO., LTD.Inventor: Hirotaka Kobayashi
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Patent number: 10868066Abstract: A solid-state imaging apparatus includes: a solid-state imaging device photoelectrically converting light taken by a lens; and a light shielding member shielding part of light incident on the solid-state imaging device from the lens, wherein an angle made between an edge surface of the light shielding member and an optical axis direction of the lens is larger than an incident angle of light to be incident on an edge portion of the light shielding member.Type: GrantFiled: October 3, 2019Date of Patent: December 15, 2020Assignee: Sony CorporationInventors: Toshiaki Iwafuchi, Masahiko Shimizu, Hirotaka Kobayashi
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Publication number: 20200363739Abstract: An electrophotographic photoreceptor having sufficient solvent resistance and crack resistance in a liquid developer and having excellent electrical characteristics, a process for producing the photoreceptor, and an electrophotographic device are provided at low cost. The electrophotographic photoreceptor includes a conductive base; and a charge generation layer and a charge transport layer sequentially provided on the conductive base.Type: ApplicationFiled: August 3, 2020Publication date: November 19, 2020Applicant: FUJI ELECTRIC CO., LTD.Inventors: Masaru TAKEUCHI, Hirotaka KOBAYASHI, Fengqiang ZHU
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Patent number: 10732527Abstract: An electrophotographic photoreceptor of a negatively-chargeable laminate-type includes a conductive substrate; a charge generation layer provided on the conductive substrate and including a charge generating material; and a charge transport layer provided on the charge generation layer and containing, as a binder resin, a copolymerized polycarbonate resin having a repeating unit represented by Formula (1); as a hole transporting substance, a compound having a structure represented by Formula (2); as an electron transporting substance, a compound having a structure represented by Formula (3), and, as an antioxidant, a compound represented by Structural Formula (4), where a mass ratio H/(B+H) represents a ratio of mass (H) of the hole transporting substance with respect to a sum of mass (B) of the binder resin and the mass (H) of the hole transporting substance, and satisfies Formula (5), 0.20 by mass?H/(B+H)?0.Type: GrantFiled: January 31, 2019Date of Patent: August 4, 2020Assignee: FUJI ELECTRIC CO., LTD.Inventors: Masaru Takeuchi, Hirotaka Kobayashi, Toshiki Obinata, Fengqiang Zhu
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Publication number: 20200208917Abstract: Oil cooler is provided to include: a number of core plates each of which has three oil pass holes where oil flows and three cooling water pass holes where cooling water flows; heat-exchanging section where core plates are laminated to define inter-plate oil flow passage and inter-plate cooling water flow passage alternately between an adjacent pair of core plates, in which oil and cooling water can mutually independently flow in direction perpendicular to core plate lamination direction while changing its flow direction by U-turn thereby proceeding in core plate lamination direction as a whole; one end part located at one side of core plate lamination direction and provided with both oil inlet and oil outlet; and the other end part located at the other side of core plate lamination direction and provided with both cooling water inlet and cooling water outlet.Type: ApplicationFiled: March 11, 2020Publication date: July 2, 2020Applicant: MAHLE FILTER SYSTEMS JAPAN CORPORATIONInventors: Hirotaka KOBAYASHI, Yasuaki SUZUKI, Masahiro ARIYAMA
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Patent number: 10698140Abstract: An image display that is to be transferred from a support onto a substrate and displays an image including personal information, according to a possible embodiment, includes: a base layer releasably supported by the support, having a light-transmitting property, a first pattern including a hologram and/or diffraction grating and transferred onto a main surface of the base layer, the first pattern displaying a first image including at least a piece of the personal information, the first pattern including dot-shaped portions, each center of the dot-shaped portions being located on a lattice point of a virtual planer lattice; and a second pattern displaying a second image, comprising an ink, and transferred onto the main surface of the base layer. At least a part of the first pattern and at least a part of the second pattern are juxtaposed on a same plane parallel to the main surface of the base layer.Type: GrantFiled: June 8, 2018Date of Patent: June 30, 2020Assignee: TOPPAN PRINTING CO., LTD.Inventors: Koichi Shinoda, Hirotaka Kobayashi
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Patent number: 10642174Abstract: An electrically conductive support for use in an electrophotographic photoreceptor includes a cylindrical main body having a first end and a second end opposite to the first end in an axial direction of the main body. The main body contains an aluminum alloy and has an internal stress in a range of ?30 MPa to 5 MPa. A method of producing the electrically conductive support includes preparing a substrate containing an aluminum alloy obtained at least through an extrusion step, and heat treating the substrate to obtain the electrically conductive support. The heat treating is carried out such that, when a temperature of the heat treating is defined as T (° C.) and a time of the heat treating is defined as H (hours), an amount of the heat treating Q defined by Q=T×H is 800 or less.Type: GrantFiled: August 23, 2019Date of Patent: May 5, 2020Assignee: FUJI ELECTRIC CO., LTD.Inventor: Hirotaka Kobayashi
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Patent number: 10619935Abstract: Oil cooler is provided to include: a number of core plates each of which has three oil pass holes where oil flows and three cooling water pass holes where cooling water flows; heat-exchanging section where core plates are laminated to define inter-plate oil flow passage and inter-plate cooling water flow passage alternately between an adjacent pair of core plates, in which oil and cooling water can mutually independently flow in direction perpendicular to core plate lamination direction while changing its flow direction by U-turn thereby proceeding in core plate lamination direction as a whole; one end part located at one side of core plate lamination direction and provided with both oil inlet and oil outlet; and the other end part located at the other side of core plate lamination direction and provided with both cooling water inlet and cooling water outlet.Type: GrantFiled: December 17, 2015Date of Patent: April 14, 2020Assignee: MAHLE FILTER SYSTEMS JAPAN CORPORATIONInventors: Hirotaka Kobayashi, Yasuaki Suzuki, Masahiro Ariyama