Abstract: A vehicle wheel supporting device includes a hub bearing rotatably supporting a wheel, a hub carrier supporting the hub bearing, a sensor configured to detect a rotating state of the wheel, a cap configured to prevent an entry of foreign material into an inside of the hub bearing, and a deflector configured to isolate the sensor from the foreign material. The deflector is fixed to the cap.

Abstract: A power generation device includes: a power generator, a power conversion circuit, a first interruption circuit, a second interruption circuit, a first monitoring circuit which monitors an output current from the power generator to the power conversion circuit and outputs a first interruption signal when an absolute value of the output current exceeds a first predetermined value, and a second monitoring circuit which monitors a total value of output voltages of respective phases of the power generator and outputs a second interruption signal when an absolute value of the total value exceeds a second predetermined value. The first interruption circuit interrupts a connection between the power generator and the power conversion circuit in accordance with the output of the first or second interruption signal. The second interruption circuit interrupts a connection between three-phase coils and the neutral point in accordance with the output of the first or second interruption signal.

Abstract: A hydraulic cylinder includes: a cylinder tube; a piston rod; a piston member; a rod inner passage provided within the piston rod, a rod inner passage being configured such that a first opening portion opens at an outer circumferential surface of the piston rod in the cylinder tube, and such that a second opening portion opens outside the cylinder tube; and a sensor part provided outside the cylinder tube, the sensor part being configured to detect that the working fluid is guided to the rod inner passage, the piston member is connected to the piston rod in a state in which one-side end surface is in contact with an annular step portion so as to block the first opening portion of the rod inner passage, the annular step portion being provided on the outer circumferential surface of the piston rod, and the sensor part is configured to detect that the working fluid is guided to the rod inner passage from a rod side chamber and a counter rod side chamber through a gap between the step portion and the piston membe

Abstract: An air conditioning device for a vehicle includes: a refrigeration cycle including a compressor, a condenser, an expansion valve, and an evaporator through which a refrigerant is sequentially flowed; a high-temperature heat medium circuit through which a high-temperature heat medium has exchanged heat with the refrigerant in the condenser is circulated; a low-temperature heat medium circuit through which a low-temperature heat medium has exchanged heat with the refrigerant in the evaporator is circulated; a connection line connecting the high-temperature heat medium circuit to the low-temperature heat medium circuit; vehicle interior heat exchangers allowed to be introduced the heat medium thereinto; and a switching unit which switches an operation state of the air conditioning device to a first mode allowing to connect the vehicle interior heat exchangers to the high-temperature heat medium circuit, a second mode allowing to connect the vehicle interior heat exchangers to the low-temperature heat medium circ

Abstract: Provided is a vehicular refrigeration cycle unit interposed between a vehicle-exterior heat exchanger and a vehicle-interior heat exchanger and that exchanges heat between secondary refrigerants flowing through the vehicle-exterior heat exchanger and the vehicle-interior heat exchanger, respectively, the vehicular refrigeration cycle unit being provided with a refrigeration cycle including a compressor, a condenser, an expansion valve, and an evaporator through which a primary refrigerant sequentially flows, and the distance between the compressor and the evaporator is longer than the distance between the compressor and the condenser.

Abstract: An improvement in heat radiation efficiency is achieved. A semiconductor device according to the present technology includes a substrate portion on which a semiconductor chip is mounted and in which an external connection terminal for performing electrical connection to the outside is formed on a rear surface on a side opposite to a front surface which is a surface on a side where the semiconductor chip is mounted, an outer wall portion that protrudes toward the front surface side in an outer circumferential portion of the substrate portion, a lid portion which is supported by the outer wall portion and covers the semiconductor chip, and a heat storage member which is disposed at a position further inside than the outer wall portion between the rear surface of the substrate portion and a rear surface of the lid portion.

Abstract: A neutral return mechanism includes an interlocking shaft to be pushed and pulled in an axial direction in conjunction with a swinging operation of an operation member; a housing member to support the interlocking shaft such that the interlocking shaft is movable in the axial direction and accommodate the interlocking shaft such that one of opposite end portions thereof protrudes; a neutral return spring to return the interlocking shaft from a post-movement position to an initial position, the neutral return spring being accommodated in the housing member such that the neutral return spring extends in the axial direction of the interlocking shaft, wherein the housing member includes a supported portion between a spring accommodation portion in which the neutral return spring is accommodated and a protrusion opening through which the interlocking shaft protrudes, the supported portion being supported at a bracket member.

Abstract: A hydraulic cylinder includes: a cylinder tube; a piston rod; a piston member; a rod inner passage provided within the piston rod, a rod inner passage being configured such that a first opening portion opens at an outer circumferential surface of the piston rod in the cylinder tube, and such that a second opening portion opens outside the cylinder tube; and a sensor part provided outside the cylinder tube, the sensor part being configured to detect that the working fluid is guided to the rod inner passage, the piston member is connected to the piston rod in a state in which one-side end surface is in contact with an annular step portion so as to block the first opening portion of the rod inner passage, the annular step portion being provided on the outer circumferential surface of the piston rod, and the sensor part is configured to detect that the working fluid is guided to the rod inner passage from a rod side chamber and a counter rod side chamber through a gap between the step portion and the piston membe

Abstract: A resin composition has a low styrene-based resin content and that has little impact on the environment, wherein the resin composition has good moldability and yields molded articles having excellent tensile moduli and tensile elongations at break; and a molded article composed of the resin composition. The resin composition contains an inorganic filler containing calcium carbonate and a styrene-based resin containing a diene component, wherein the inorganic filler content is 50 mass % or more relative to the overall mass of the resin composition, and as measured in accordance with ASTM-D638, the tensile modulus is 1,000-3,000 MPa, and the tensile elongation at break is 5% or higher.

Abstract: A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.

Abstract: A neutral return mechanism includes an interlocking shaft to be pushed and pulled in an axial direction in conjunction with a swinging operation of an operation member; a housing member to support the interlocking shaft such that the interlocking shaft is movable in the axial direction and accommodate the interlocking shaft such that one of opposite end portions thereof protrudes; a neutral return spring to return the interlocking shaft from a post-movement position to an initial position, the neutral return spring being accommodated in the housing member such that the neutral return spring extends in the axial direction of the interlocking shaft, wherein the housing member includes a supported portion between a spring accommodation portion in which the neutral return spring is accommodated and a protrusion opening through which the interlocking shaft protrudes, the supported portion being supported at a bracket member.

Abstract: A region of a sealing part is effectively utilized. -A semiconductor device includes a semiconductor element, a substrate, a sealing part, and a cavity region. The substrate included in this semiconductor device is disposed adjacent to a bottom surface of the semiconductor element. The sealing part included in this semiconductor device is formed in a shape that covers an upper surface that is a surface facing the bottom surface of the semiconductor element, and seals the semiconductor element. The cavity region included in this semiconductor device is a region disposed in the sealing part and formed with a cavity.

Abstract: Oil cooler is provided to include: a number of core plates each of which has three oil pass holes where oil flows and three cooling water pass holes where cooling water flows; heat-exchanging section where core plates are laminated to define inter-plate oil flow passage and inter-plate cooling water flow passage alternately between an adjacent pair of core plates, in which oil and cooling water can mutually independently flow in direction perpendicular to core plate lamination direction while changing its flow direction by U-turn thereby proceeding in core plate lamination direction as a whole; one end part located at one side of core plate lamination direction and provided with both oil inlet and oil outlet; and the other end part located at the other side of core plate lamination direction and provided with both cooling water inlet and cooling water outlet.

Abstract: In order to provide a composite object that can be produced at high quality and low cost using a 3D printer, a composite object includes: a first object obtained by assembling one or at least two assemblable toy blocks; and a second object constituted by one or at least two parts produced through 3D printing, and configured to be attached to the first object so as to cover at least a portion except for part of a surface thereof. Accordingly, it is possible to produce an object at high quality and low cost using a 3D printer.

Abstract: An improvement in heat radiation efficiency is achieved. A semiconductor device according to the present technology includes a substrate portion on which a semiconductor chip is mounted and in which an external connection terminal for performing electrical connection to the outside is formed on a rear surface on a side opposite to a front surface which is a surface on a side where the semiconductor chip is mounted, an outer wall portion that protrudes toward the front surface side in an outer circumferential portion of the substrate portion, a lid portion which is supported by the outer wall portion and covers the semiconductor chip, and a heat storage member which is disposed at a position further inside than the outer wall portion between the rear surface of the substrate portion and a rear surface of the lid portion.

Abstract: A bubble separator used in a fluid circuit for an automobile and that separates bubbles in a refrigerant may include a swirl flow formation part extending in a substantially horizontal direction, and including an internal space having a columnar shape. The bubble separator may also include a flow inlet disposed at one end of the swirl flow formation part, and being open so as to cause the refrigerant to flow in the flow inlet in a tangential direction of an inner peripheral surface of the swirl flow formation part and so as to form a swirl flow on the inner peripheral surface. The bubble separator may also include a flow outlet disposed at another end of the swirl flow formation part, and being open so as to cause the refrigerant to flow out of the flow outlet in a tangential direction from the inner peripheral surface.

Abstract: Deformation of a semiconductor chip is to be prevented in a semiconductor device in which a heat releasing plate and a circuit board are disposed. The semiconductor device includes the semiconductor chip, the circuit board, the heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.

Abstract: The separation efficiency for bubbles contained in liquid is improved. A bubble separator 20 that separates bubbles in liquid is provided.

Abstract: A method of manufacturing an imaging element having a light receiving surface curved in accordance with an aberration of an imaging lens is simplified. The imaging element includes an imaging chip, a curve forming portion, and a curve holding portion. The imaging chip includes a semiconductor chip having a rear surface on which a concave portion is formed, the rear surface being a surface different from a light receiving surface that receives light from a subject. The curve forming portion is arranged in the concave portion and forms a curved portion by curving the imaging chip at a bottom of the concave portion. The curve holding portion holds the formed curved portion.

Abstract: An electrophotographic device equipped with a negatively-charged laminated electrophotographic photoreceptor that can be charged by a scorotron charging method, and includes a conductive substrate, and a charge generation layer and a charge transport layer sequentially provided on the conductive substrate, wherein the charge generation layer contains a charge generation material and a resin binder that is a poly(vinyl butyral) resin binder, and the charge transport layer contains a charge transport material that is either or both of stilbene compounds represented by Formula (1) and Formula (2), a binder resin, and an oxidation inhibitor that is tribenzylamine represented by Formula 3, wherein the conductive substrate is cylindrical, the electrophotographic photoreceptor has a difference between a maximum value and a minimum value of a surface potential in a circumferential direction, after exposure to ozone at an exposure dose of 100 ppm·h, that is 12 V or less.