Patents by Inventor Hirotaka Kotani
Hirotaka Kotani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11926917Abstract: There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.Type: GrantFiled: June 10, 2020Date of Patent: March 12, 2024Assignee: DOWA METALTECH CO., LTD.Inventors: Yukiya Kato, Hirotaka Kotani, Tatsuhiro Doi, Takao Tomiya, Hiroto Narieda
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Patent number: 11920255Abstract: There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.Type: GrantFiled: June 4, 2020Date of Patent: March 5, 2024Assignee: Dowa Metaltech Co., Ltd.Inventors: Hirotaka Kotani, Yukiya Kato, Tatsuhiro Doi, Takao Tomiya, Hiroto Narieda
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Publication number: 20230175160Abstract: A composite material including a composite film formed on a base material, the composite film including a silver layer containing carbon particles, wherein a content of Sb in the composite film is 1 mass % or less, and a crystallite size of silver in the composite film is 40 nm or less.Type: ApplicationFiled: April 21, 2021Publication date: June 8, 2023Applicant: DOWA METALTECH CO., LTD.Inventors: Yukiya KATO, Hirotaka TAKAHASHI, Tatsuhiro DOI, Hirotaka KOTANI, Takao TOMIYA, Hiroto NARIEDA
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Publication number: 20230046780Abstract: There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.Type: ApplicationFiled: June 10, 2020Publication date: February 16, 2023Applicant: DOWA METALTECH CO., LTD.Inventors: Yukiya KATO, Hirotaka KOTANI, Tatsuhiro DOI, Takao TOMIYA, Hiroto NARIEDA
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Publication number: 20220259753Abstract: There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.Type: ApplicationFiled: June 4, 2020Publication date: August 18, 2022Applicant: Dowa Metaltech Co., Ltd.Inventors: Hirotaka Kotani, Yukiya Kato, Tatsuhiro Doi, Takao Tomiya, Hiroto Narieda
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Patent number: 11162745Abstract: A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.Type: GrantFiled: October 29, 2019Date of Patent: November 2, 2021Assignee: DOWA METALTECH CO., LTD.Inventors: Satoru Ideguchi, Hideyo Osanai, Hirotaka Kotani
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Patent number: 11078587Abstract: A tin-plated product contains: a substrate 10 of copper or a copper alloy; an underlying layer 12 of nickel which is formed on the surface of the substrate 10; and an outermost layer 14 containing tin, the outermost layer 14 being formed on the surface of the underlying layer 12, the outermost layer 14 being composed of a copper-tin alloy layer 14a of a large number of crystal grains of a copper-tin alloy, tin layers 14b of tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layers 14c of a copper-nickel-tin alloy, each of the tin layers 14b being formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layers 14c being arranged on the side of the underlying layer 12 in the copper-tin alloy layer 14a so as to be apart from each other.Type: GrantFiled: August 23, 2016Date of Patent: August 3, 2021Assignees: Dowa Metaltech Co., Ltd., Yazaki CorporationInventors: Yuta Sonoda, Hiroto Narieda, Hideki Endo, Akira Sugawara, Hirotaka Kotani, Jyun Toyoizumi, Takaya Kondo, Yuya Kishibata
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Patent number: 10982345Abstract: After drying the surface of a tin plating layer having a thickness of 0.4 to 3 ?m which is formed on a base material of copper or a copper alloy by electroplating at a current density of 5 to 13 A/dm2 in a tin plating solution consisting of water, tin sulfate, sulfuric acid and a surfactant, the surface of the tin plating layer is heated to melt tin, and then, cooled to cause a layer of the tin plating layer on the side of the outermost surface to be a tin layer, which has a structure obtained by solidification after melting, while causing a layer of the tin plating layer between the tin layer and the base material to be a copper-tin alloy layer, to produce a tin-plated product wherein a tin layer, which has a structure obtained by solidification after melting, is formed on a copper-tin alloy layer formed on a base material of copper or a copper alloy and wherein the tin-plated product has a glossiness of 0.3 to 0.7.Type: GrantFiled: April 18, 2017Date of Patent: April 20, 2021Assignees: Dowa Metaltech Co., Ltd., Yazaki CorporationInventors: Hirotaka Kotani, Hiroto Narieda, Akira Sugawara, Yuta Sonoda, Yoshitaka Ito
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Patent number: 10829862Abstract: In a tin-plated product wherein a surface of a substrate 10 of copper or a copper alloy is plated with tin, an underlying layer 12 of at least one of nickel and a copper-nickel alloy is formed on the surface of the substrate 10, and an outermost layer formed on the surface of the underlying layer 12 is composed of a copper-tin alloy layer 14 and tin layers 16, the copper-tin alloy 14 being formed of a large number of crystal grains of a copper-tin alloy, each of the tin layers 16 being arranged in a corresponding one of recessed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on the outermost surface of the outer most layer, the area ratio occupied by the tin layers 16 on the outermost surface being 20 to 80%, and the maximum thickness of the tin layers 16 being smaller than the average particle diameter of the crystal grains of the copper-tin alloy.Type: GrantFiled: February 25, 2015Date of Patent: November 10, 2020Assignees: DOWA METALTECH CO., LTD., YAZAKI CORPORATIONInventors: Tatsunori Murata, Hirotaka Kotani, Hideki Endo, Akira Sugawara, Yuta Sonoda, Tetsuo Kato, Hideki Ohsumi, Jyun Toyoizumi
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Patent number: 10676835Abstract: There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer 16 is formed on a substrate 10 of copper or a copper alloy so as to have a thickness of 0.1 to 1.5 ?m by electroplating, a tin-copper plating layer 12 containing tin 12b mixed with a copper-tin alloy 12a is formed thereon so as to have a thickness of 0.6 to 10 ?m by electroplating using a tin-copper plating bath which contains 5 to 35% by weight of copper with respect to the total amount of tin and copper, and then, a tin layer 14 is formed thereon so as to have a thickness of 1 ?m or less by electroplating if necessary.Type: GrantFiled: April 20, 2016Date of Patent: June 9, 2020Assignees: Dowa Metaltech Co., Ltd., Yazaki CorporationInventors: Hirotaka Kotani, Hiroto Narieda, Hideki Endo, Akira Sugawara, Yuta Sonoda, Takaya Kondo, Jyun Toyoizumi, Yuya Kishibata
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Patent number: 10619948Abstract: A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.Type: GrantFiled: September 25, 2013Date of Patent: April 14, 2020Assignee: DOWA METALTECH CO., LTD.Inventors: Satoru Ideguchi, Hideyo Osanai, Hirotaka Kotani
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Publication number: 20200064087Abstract: A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.Type: ApplicationFiled: October 29, 2019Publication date: February 27, 2020Applicant: DOWA METALTECH CO., LTD.Inventors: Satoru Ideguchi, Hideyo Osanai, Hirotaka Kotani
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Publication number: 20190136398Abstract: After drying the surface of a tin plating layer having a thickness of 0.4 to 3 ?m which is formed on a base material of copper or a copper alloy by electroplating at a current density of 5 to 13 A/dm2 in a tin plating solution consisting of water, tin sulfate, sulfuric acid and a surfactant, the surface of the tin plating layer is heated to melt tin, and then, cooled to cause a layer of the tin plating layer on the side of the outermost surface to be a tin layer, which has a structure obtained by solidification after melting, while causing a layer of the tin plating layer between the tin layer and the base material to be a copper-tin alloy layer, to produce a tin-plated product wherein a tin layer, which has a structure obtained by solidification after melting, is formed on a copper-tin alloy layer formed on a base material of copper or a copper alloy and wherein the tin-plated product has a glossiness of 0.3 to 0.7.Type: ApplicationFiled: April 18, 2017Publication date: May 9, 2019Applicants: DOWA METALTECH CO., LTD., Yazaki CorporationInventors: Hirotaka Kotani, Hiroto Narieda, Akira Sugawara, Yuta Sonoda, Yoshitaka Ito
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Publication number: 20180245230Abstract: A tin-plated product contains: a substrate 10 of copper or a copper alloy; an underlying layer 12 of nickel which is formed on the surface of the substrate 10; and an outermost layer 14 containing tin, the outermost layer 14 being formed on the surface of the underlying layer 12, the outermost layer 14 being composed of a copper-tin alloy layer 14a of a large number of crystal grains of a copper-tin alloy, tin layers 14b of tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layers 14c of a copper-nickel-tin alloy, each of the tin layers 14b being formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layers 14c being arranged on the side of the underlying layer 12 in the copper-tin alloy layer 14a so as to be apart from each other.Type: ApplicationFiled: August 23, 2016Publication date: August 30, 2018Applicants: Dowa Metaltech Co., Ltd., Yazaki CorporationInventors: Yuta SONODA, Hiroto NARIEDA, Hideki ENDO, Akira SUGAWARA, Hirotaka KOTANI, Jyun TOYOIZUMI, Takaya KANDO, Yuya KISHIBATA
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Publication number: 20180080135Abstract: There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer 16 is formed on a substrate 10 of copper or a copper alloy so as to have a thickness of 0.1 to 1.5 ?m by electroplating, a tin-copper plating layer 12 containing tin 12b mixed with a copper-tin alloy 12a is formed thereon so as to have a thickness of 0.6 to 10 ?m by electroplating using a tin-copper plating bath which contains 5 to 35% by weight of copper with respect to the total amount of tin and copper, and then, a tin layer 14 is formed thereon so as to have a thickness of 1 ?m or less by electroplating if necessary.Type: ApplicationFiled: April 20, 2016Publication date: March 22, 2018Applicants: Dowa Metaltech Co., Ltd., Yazaki CorporationInventors: Hirotaka Kotani, Hiroto Narieda, Hideki Endo, Akira Sugawara, Yuta Sonoda, Takaya Kondo, Jyun Toyoizumi, Yuya Kishibata
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Patent number: 9713253Abstract: A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.Type: GrantFiled: March 29, 2011Date of Patent: July 18, 2017Assignee: DOWA METALTECH CO., LTD.Inventors: Hideyo Osanai, Takayuki Takahashi, Satoru Ideguchi, Hirotaka Kotani
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Publication number: 20170088965Abstract: In a tin-plated product wherein a surface of a substrate 10 of copper or a copper alloy is plated with tin, an underlying layer 12 of at least one of nickel and a copper-nickel alloy is formed on the surface of the substrate 10, and an outermost layer formed on the surface of the underlying layer 12 is composed of a copper-tin alloy layer 14 and tin layers 16, the copper-tin alloy 14 being formed of a large number of crystal grains of a copper-tin alloy, each of the tin layers 16 being arranged in a corresponding one of recessed portions, each of which is formed between adjacent crystal grains of the large number of crystal grains of the copper-tin alloy, the adjacent crystal grains being adjacent to each other on the outermost surface of the outer most layer, the area ratio occupied by the tin layers 16 on the outermost surface being 20 to 80%, and the maximum thickness of the tin layers 16 being smaller than the average particle diameter of the crystal grains of the copper-tin alloy.Type: ApplicationFiled: February 25, 2015Publication date: March 30, 2017Applicants: DOWA METALTECH CO., LTD., YAZAKI CORPORATIONInventors: Tatsunori Murata, Hirotaka Kotani, Hideki Endo, Akira Sugawara, Yuta Sonoda, Tetsuo Kato, Hideki Ohsumi, Jyun Toyoizumi
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Publication number: 20140083671Abstract: A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.Type: ApplicationFiled: September 25, 2013Publication date: March 27, 2014Applicant: DOWA METALTECH CO., LTD.Inventors: Satoru Ideguchi, Hideyo Osanai, Hirotaka Kotani
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Publication number: 20140057131Abstract: A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.Type: ApplicationFiled: March 29, 2011Publication date: February 27, 2014Applicant: DOWA METALTECH CO., LTD.Inventors: Hideyo Osanai, Takayuki Takahashi, Satoru Ideguchi, Hirotaka Kotani