Patents by Inventor Hirotaka Nonaka

Hirotaka Nonaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Curing accelerator, epoxy resin composition, and semiconductor device
    Patent number: 7074738
    Abstract: A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: July 11, 2006
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Akiko Okubo, Yoshiyuki Goh, Yoshihito Akiyama, Hiroshi Hirose, Hirotaka Nonaka, Maki Sugawara
  • Polycyclic polymers containing pendant ion conducting moieties
    Publication number: 20050019638
    Abstract: A polymer comprising polycyclic repeating units having recurring ion conducting groups and optional crosslinkable groups is disclosed. The present invention provides the capability of tailoring polymers to impart unique properties to membranes fabricated from the polymers. Membranes comprising the polymers and methods for preparing the membranes and their use in ion conducting membranes, particularly in fuel cells, are also provided.
    Type: Application
    Filed: June 4, 2004
    Publication date: January 27, 2005
    Inventors: R. Ravikiran, Xiaoming Wu, Larry Rhodes, Robert Shick, Hiroko Nakano, Hirotaka Nonaka, Huabin Wang, Saikumar Jayaraman, Robert Duff, John-Henry Lipian
  • Curing accelerator, epoxy resin composition, and semiconductor device
    Publication number: 20040039154
    Abstract: A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).
    Type: Application
    Filed: June 4, 2003
    Publication date: February 26, 2004
    Inventors: Akiko Okubo, Yoshiyuki Goh, Yoshihito Akiyama, Hiroshi Hirose, Hirotaka Nonaka, Maki Sugawara