Abstract: Provided is a method for forming a multilayer coating film, said method being suitably applicable to a wet-on-wet coating process comprising: applying a first water-borne base coating material to form an uncured first water-based base coating; and then applying a second water-based base coating material without preheating the uncured first water-borne base coating. A method for forming a multilayer coating film according to a wet-on-wet coating process which comprises applying a first water-based base coating material to the surface of a substrate to be coated and then applying, without preheating the thus formed coating, a second water-based base coating material, characterized in that: the first water-borne base coating material contains a hydrophilic association-type viscous material; and the composition of the second water-based base coating material is controlled.

Abstract: A multi-layered circuit board includes a first insulating layer, a second insulating layer, and a sheet capacitor that is located between the first insulating layer and the second insulating layer. The sheet capacitor includes a pair of electrodes that sandwich a dielectric. Lead wirings continue to the electrodes, respectively. The lead wirings are disposed on an opposite side of the first or the second insulating layer with respect to the sheet capacitor to overlap the electrodes when viewed from a stacking direction of the multi-layered circuit board. Because the lead wirings are arranged to overlap the electrodes in the stacking direction of the multi-layered circuit board, an ESL of the sheet capacitor is maintained low.

Abstract: A multi-layered circuit board includes a first insulating layer, a second insulating layer, and a sheet capacitor that is located between the first insulating layer and the second insulating layer. The sheet capacitor includes a pair of electrodes that sandwich a dielectric. Lead wirings continue to the electrodes, respectively. The lead wirings are disposed on an opposite side of the first or the second insulating layer with respect to the sheet capacitor to overlap the electrodes when viewed from a stacking direction of the multi-layered circuit board. Because the lead wirings are arranged to overlap the electrodes in the stacking direction of the multi-layered circuit board, an ESL of the sheet capacitor is maintained low.

Abstract: Provided is a method for forming a multilayer coating film, said method being suitably applicable to a wet-on-wet coating process comprising: applying a first water-borne base coating material to form an uncured first water-based base coating; and then applying a second water-based base coating material without preheating the uncured first water-borne base coating. A method for forming a multilayer coating film according to a wet-on-wet coating process which comprises applying a first water-based base coating material to the surface of a substrate to be coated and then applying, without preheating the thus formed coating, a second water-based base coating material, characterized in that: the first water-borne base coating material contains a hydrophilic association-type viscous material; and the composition of the second water-based base coating material is controlled.

Abstract: A semiconductor device includes a semiconductor chip, an interposer, a surface circuit pattern, and a post array. The surface circuit pattern is formed on one surface of the interposer and includes chip side pads connected to an external connection pad of the semiconductor chip, junction pads, and interconnecting lines having an end connected to the chip side pads and another end connected to the junction pads. The interconnecting lines extend from the chip side pads toward an outer edge of the interposer. The post array includes conducting paths and insulating resin insulating the conductive paths from each other. The post array is arranged such that the conductive paths extend in a direction intersecting with the surface of the interposer. The conducting paths each have an end connected to the junction pad and another end to be connected to the printed wiring board.

Abstract: A semiconductor device includes a semiconductor chip, an interposer, a surface circuit pattern, and a post array. The surface circuit pattern is formed on one surface of the interposer and includes chip side pads connected to an external connection pad of the semiconductor chip, junction pads, and interconnecting lines having an end connected to the chip side pads and another end connected to the junction pads. The interconnecting lines extend from the chip side pads toward an outer edge of the interposer. The post array includes conducting paths and insulating resin insulating the conductive paths from each other. The post array is arranged such that the conductive paths extend in a direction intersecting with the surface of the interposer. The conducting paths each have an end connected to the junction pad and another end to be connected to the printed wiring board.

Abstract: In exposing a photocurable resin to light, the light is irradiated on the photocurable resin while a base material to which the photocurable resin is applied is immersed in a liquid. An apparatus for carrying out the exposure includes an exposure tank in which a liquid does not dissolve the photocurable resin is reserved and a light source irradiating light to the photocurable resin is immersed in the liquid reserved in the tank. The exposure tank has two opposite side walls which have exposure windows closed by transparent plates respectively. The apparatus may include a plurality of light sources disposed so as to correspond to the representative exposing window. A temperature of the liquid in which the base material is immersed is controlled.

Abstract: A method of forming solder bumps on pads formed on a surface of a base material includes the steps of supplying solder to a template having a number of through holes formed to correspond to the pads of the base material respectively so that the through holes are filled with the solder, the template having an upper side and an underside, scraping the sides of the template with doctors to remove an excessive amount of solder, and opposing the template to the base material so that the pads are aligned with the through holes respectively, covering the side of the template opposite to the base material with a pressure housing and increasing pressure in an interior of the pressure housing so that a difference in pressure between an exterior and the interior of the pressure housing extrudes the molten solder from the template to the pad side of the base material.

Abstract: In exposing a photo-curing type resin to light, the light is irradiated to the photo-curing type resin while a base material to which the photo-curing type resin is applied is impregnated in a liquid. An apparatus for carrying out the exposure includes an exposure tank in which a liquid which does not dissolve the photo-curing type resin is reserved and a light source irradiating light to the photo-curing type resin impregnated in the liquid reserved in the tank. The exposure tank has two opposite side walls which have exposure windows closed by transparent plates respectively. The apparatus may include a plurality of light sources disposed so as to correspond to the respective exposing windows. A temperature of the liquid in which the base material is impregnated is controlled.