Patents by Inventor Hirotaka Taniguchi

Hirotaka Taniguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210028342
    Abstract: A printed wiring board includes a core substrate including core material and having opening, thermoelectric elements including P-type and N-type thermoelectric elements such that the thermoelectric elements are accommodated in the opening, a first build-up layer including a first resin insulating layer on first surface of the core substrate and an outermost first resin insulating layer on the first resin insulating layer, and a second build-up layer including a second resin insulating layer on second surface of the core substrate and an outermost second resin insulating layer on the second resin insulating layer. The outermost first resin insulating layer is formed to have thermal conductivity that is higher than thermal conductivities of the first resin insulating layer and the core material, and the outermost second resin insulating layer is formed to have thermal conductivity that is higher than thermal conductivities of the second resin insulating layer and the core material.
    Type: Application
    Filed: July 24, 2020
    Publication date: January 28, 2021
    Applicant: IBIDEN CO., LTD.
    Inventor: Hirotaka TANIGUCHI
  • Publication number: 20210028340
    Abstract: A printed wiring board includes a core substrate including core material and having opening such that the opening penetrates through the core substrate, thermoelectric elements including P-type and N-type thermoelectric elements such that the thermoelectric elements are accommodated in the opening of the core substrate, a first build-up layer that mounts a heat-absorbing element thereon and includes a first resin insulating layer such that the first resin insulating layer is formed on first surface of the core substrate and covering the opening of the core substrate, and a second build-up layer that mounts a heat-generating element thereon and includes a second resin insulating layer such that the formed on the second resin insulating layer is foamed on second surface of the core substrate on the opposite side and covering the opening of the core substrate and has thickness that is greater than thickness of the first resin insulating layer.
    Type: Application
    Filed: July 24, 2020
    Publication date: January 28, 2021
    Applicant: IBIDEN CO., LTD.
    Inventor: Hirotaka TANIGUCHI
  • Patent number: 10903577
    Abstract: A printed wiring board includes a laminated structure including insulating layers, and conductive layers laminated on the insulating layer, respectively, such that the conductive layers include an outermost conductive layer having a radiation slot, and an inner-side conductive layer having an excitation portion facing the radiation slot in a lamination direction. The laminated structure has a recess portion recessed from the radiation slot toward the excitation portion such that a bottom surface of the recess portion is positioned between the outermost conductive layer and the excitation portion, and the insulating layers include an insulating layer having at least a portion covering the excitation portion.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: January 26, 2021
    Assignee: IBIDEN CO., LTD.
    Inventor: Hirotaka Taniguchi
  • Patent number: 10586650
    Abstract: A coil substrate includes insulating layers, and conductive layers laminated on the insulating layers in a plate thickness direction of the insulating layers, respectively. The conductive layers include three or more conductive layers and a set of conductive layers such that the set of conductive layers includes a first outermost conductive layer on one end side in the plate thickness direction and does not include a second outermost conductive layer on the opposite end side in the plate thickness direction and that the set of conductive layers includes coil portions each having a spiral form respectively and aligned in the plate thickness direction.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: March 10, 2020
    Assignee: IBIDEN CO., LTD.
    Inventor: Hirotaka Taniguchi
  • Publication number: 20190387613
    Abstract: A method for manufacturing a printed wiring board includes laminating a first insulative resin layer including low dielectric constant material on a first surface of a base substrate, forming a first conductive layer including a metal foil on the first insulative resin layer, laminating a second insulative resin layer including prepreg material on a second surface of the base substrate on the opposite side with respect to the first surface, and forming a second conductive layer including a metal foil on the second insulative resin layer. The first insulative resin layer is formed such that a dielectric constant of the first insulative resin layer is set lower than a dielectric constant of the second insulative resin layer.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 19, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Hirotaka TANIGUCHI, Ryuzo NISHIKAWA, Haruhiko MORITA
  • Publication number: 20190373732
    Abstract: A printed wiring board includes a core substrate including core material and having opening through the core material, first electronic components in the opening each including a first electrode, second electronic components in the opening each including a third electrode, a first build-up layer formed on surface of the substrate and including a first insulating layer, a first conductor layer on the first insulating layer, first via conductors through the first insulating layer and connecting to the first conductor layer, and a third resin insulating layer on the first insulating layer. The first conductor layer includes first conductor circuit formed directly over the opening, and on-core-material first conductor circuit directly over the core material. Groups of the first via conductors connect the first electrodes to the first conductor circuit and the third electrodes to the first conductor circuit. Each first via conductor in the groups has a recessed top portion.
    Type: Application
    Filed: May 30, 2019
    Publication date: December 5, 2019
    Applicant: IBIDEN CO., LTD.
    Inventor: Hirotaka TANIGUCHI
  • Publication number: 20190373740
    Abstract: A method for manufacturing a printed wiring board includes forming an opening through a core substrate such that the opening is formed to accommodate first electronic components and second electronic components, pasting a tape on a surface of the substrate such that the tape closes the opening of the substrate on one side, mounting the first electronic components on the tape exposed in the opening of the substrate such that the first electronic components are positioned inside the opening of the substrate, mounting the second electronic components on the tape exposed in the opening of the substrate such that the second electronic components are positioned inside the opening of the substrate, filling resin in spaces formed between the first and second electronic components, spaces between the first electronic components and the substrate, and spaces between the second electronic components and the substrate, and removing the tape from the substrate.
    Type: Application
    Filed: May 30, 2019
    Publication date: December 5, 2019
    Applicant: IBIDEN CO., LTD.
    Inventor: Hirotaka TANIGUCHI
  • Publication number: 20190288398
    Abstract: A printed wiring board includes a laminated structure including insulating layers, and conductive layers laminated on the insulating layer, respectively, such that the conductive layers include an outermost conductive layer having a radiation slot, and an inner-side conductive layer having an excitation portion facing the radiation slot in a lamination direction. The laminated structure has a recess portion recessed from the radiation slot toward the excitation portion such that a bottom surface of the recess portion is positioned between the outermost conductive layer and the excitation portion, and the insulating layers include an insulating layer having at least a portion covering the excitation portion.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 19, 2019
    Applicant: IBIDEN CO., LTD.
    Inventor: Hirotaka TANIGUCHI
  • Publication number: 20180342342
    Abstract: A coil built-in substrate includes insulating layers, coil forming layers having spiral coil patterns such that each of the insulating layers is interposed between adjacent coil forming layers, connection conductors penetrating the insulating layers such that each of the connection conductors is connecting one spiral coil pattern of one coil forming layer to another spiral coil pattern of another coil forming layer, and a tubular core structure including a magnetic material and penetrates through the insulating layers such that the tubular core structure is penetrating center portions of the coil patterns in the coil forming layers.
    Type: Application
    Filed: May 24, 2018
    Publication date: November 29, 2018
    Applicant: IBIDEN CO., LTD.
    Inventor: Hirotaka TANIGUCHI
  • Publication number: 20180035534
    Abstract: A printed wiring board includes a base substrate, a first insulative resin layer laminated on first surface of the base substrate, and a first conductive layer laminated on the first insulative resin layer. The base substrate includes conductive layers and insulative resin layers, the base substrate, first insulative resin layer and first conductive layer include a high-frequency substrate portion including portion of an outermost conductive layer in the base substrate, portion of the first insulative resin layer and portion of the first conductive layer, the first conductive layer has wiring patterns including microstrip lines and the portion forming the high-frequency substrate portion, the first insulative resin layer has dielectric constant of 3.5 or lower and dielectric loss tangent of 0.005 or lower, and the wiring pattern is formed such that side surfaces of the wiring pattern are substantially parallel to a thickness direction of the first insulative resin layer.
    Type: Application
    Filed: July 27, 2017
    Publication date: February 1, 2018
    Applicant: IBIDEN CO., LTD.
    Inventors: Hirotaka TANIGUCHI, Ryuzo NISHIKAWA, Haruhiko MORITA
  • Publication number: 20180033549
    Abstract: A coil substrate includes insulating layers, and conductive layers laminated on the insulating layers in a plate thickness direction of the insulating layers, respectively. The conductive layers include three or more conductive layers and a set of conductive layers such that the set of conductive layers includes a first outermost conductive layer on one end side in the plate thickness direction and does not include a second outermost conductive layer on the opposite end side in the plate thickness direction and that the set of conductive layers includes coil portions each having a spiral form respectively and aligned in the plate thickness direction.
    Type: Application
    Filed: July 26, 2017
    Publication date: February 1, 2018
    Applicant: IBIDEN CO. , LTD.
    Inventor: Hirotaka TANIGUCHI
  • Patent number: 9717151
    Abstract: A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: July 25, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Hirotaka Taniguchi, Dongdong Wang, Michimasa Takahashi
  • Publication number: 20160095207
    Abstract: A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 31, 2016
    Applicant: IBIDEN CO., LTD.
    Inventors: Hirotaka TANIGUCHI, Dongdong WANG, Michimasa TAKAHASHI
  • Publication number: 20160066429
    Abstract: A flex-rigid wiring board includes a flexible base material structure, a rigid base material structure extending from opposite ends of the flexible base material structure, an electronic component embedded in the rigid base material structure, a first buildup layer laminated on first surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure, and a second buildup layer laminated on second surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure. The first and second buildup layers are formed such that the flexible base material structure exposed by the exposing portions of the first and second buildup layers forms a bendable portion and that the rigid base material structure and the first and second buildup layers form non-bendable portions connected to the bendable portion.
    Type: Application
    Filed: August 27, 2015
    Publication date: March 3, 2016
    Applicant: IBIDEN CO., LTD.
    Inventors: Hirotaka TANIGUCHI, Dongdong WANG, Michimasa TAKAHASHI
  • Patent number: 8347493
    Abstract: A method of manufacturing a wiring board with a built-in electronic component including providing a first base material having a support body and a first metal foil detachably adhered on the support body, forming a connection terminal for mounting an electronic component on the first metal foil of the first base material by an additive method, mounting an electronic component to the connection terminal such that the electronic component is electrically connected to the connection terminal and mounted on the first base material, covering the electronic component with an insulative material structure having a hollow portion such that the electronic component is accommodated in the hollow portion of the insulative material structure after the mounting and detaching the support body from the first metal foil such that a substrate having the first base material and the insulative material structure is formed.
    Type: Grant
    Filed: February 11, 2009
    Date of Patent: January 8, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Hirotaka Taniguchi, Toshiki Furutani, Takeshi Furusawa, Takashi Kariya
  • Publication number: 20090242255
    Abstract: A method of manufacturing a wiring board with a built-in electronic component includes providing a first base material comprising a support body and a first metal foil detachably adhered on the support body, forming a connection terminal for mounting an electronic component on the first metal foil of the first base material by an additive method, electrically connecting an electronic component and the connection terminal by arranging the electronic component on the first base material such that a surface of the electronic component on which a circuit is formed faces a surface on which the connection terminal is formed, covering the electronic component with an insulative material after the mounting, and detaching the support body and the first metal foil.
    Type: Application
    Filed: February 11, 2009
    Publication date: October 1, 2009
    Applicant: IBIDEN CO., LTD
    Inventors: Hirotaka TANIGUCHI, Toshiki Furutani, Takeshi Furusawa, Takashi Kariya