Abstract: Disclosed is a notification device that reduces notifications which an occupant would find irritating. This notification device comprises: a notification unit that detects an object approaching a vehicle, and notifies an occupant of the approach of the object; and a notification control unit that is connected to a wiper of the vehicle, determines the quantity of water present in the vehicle surroundings on the basis of a wiper operation quantity, and when the quantity of water is greater than a prescribed threshold value, controls the notification unit such that the degree of notification is suppressed compared to when the quantity of water is less than or equal to the threshold value.

Abstract: A wiring electronic component of the present invention is incorporated into an electronic device package in which a circuit element including a semiconductor chip is disposed and in which the circuit element is connected to a wiring pattern on the back face and also connected, via vertical wiring, to external electrodes located on the front face opposite the wiring pattern. The wiring electronic component is composed of an electrically conductive support portion, which serves as an electroforming mother die, and a plurality of vertical wiring portions formed through electroforming such that they are integrally connected to the support portion.

Abstract: A first wiring pattern is formed on a surface of a first support plate; a semiconductor chip is disposed on the first wiring pattern; and electrode terminals of the semiconductor chip are electrically connected to the first wiring pattern at required positions. Post electrodes connected to a second wiring pattern of a wiring-added post electrode component integrally connected by a second support plate are collectively fixed and electrically connected to the first wiring pattern formed on the first support plate at predetermined positions. After sealing with resin, the first and second support plates are separated; a glass substrate is affixed on a front face side; and external electrodes connected to the second wiring pattern are formed on a back face side.

Abstract: A circuit element is disposed on an organic substrate and is connected to a wiring pattern provided on the organic substrate. Internal connection electrodes are formed on a support of a conductive material through electroforming such that the internal connection electrodes are integrally connected to the support. First ends of the internal connection electrodes integrally connected by the support are connected to the wiring pattern. After the circuit element is resin-sealed, the support is removed so as to separate the internal connection electrodes from one another. Second ends of the internal connection electrodes are used as external connection electrodes on the front face, and external connection electrodes on the back face are connected to the wiring pattern.

Abstract: A wiring electronic component of the present invention is incorporated into an electronic device package in which a circuit element including a semiconductor chip is disposed and in which the circuit element is connected to a wiring pattern on the back face and also connected, via vertical wiring, to external electrodes located on the front face opposite the wiring pattern. The wiring electronic component is composed of an electrically conductive support portion, which serves as an electroforming mother die, and a plurality of vertical wiring portions formed through electroforming such that they are integrally connected to the support portion.

Abstract: A first wiring pattern is formed on a surface of a first support plate; a semiconductor chip is disposed on the first wiring pattern; and electrode terminals of the semiconductor chip are electrically connected to the first wiring pattern at required positions. Post electrodes connected to a second wiring pattern of a wiring-added post electrode component integrally connected by a second support plate are collectively fixed and electrically connected to the first wiring pattern formed on the first support plate at predetermined positions. After sealing with resin, the first and second support plates are separated; a glass substrate is affixed on a front face side; and external electrodes connected to the second wiring pattern are formed on a back face side.

Abstract: An editing device includes a feature point detecting unit detecting a position of a feature point for specifying an operation target, a feature point projecting unit projecting into a display region the feature point positioned outside the display region, and a feature point displaying unit displaying the feature point at a position where it is projected. Therefore, even if the operation target is located outside the display region, the user can know the position of the operation target.

Abstract: A circuit element is disposed on an organic substrate and is connected to a wiring pattern provided on the organic substrate. Internal connection electrodes are formed on a support of a conductive material through electrofomiing such that the internal connection electrodes are integrally connected to the support. First ends of the internal connection electrodes integrally connected by the support are connected to the wiring pattern. After the circuit element is resin-sealed, the support is removed so as to separate the internal connection electrodes from one another. Second ends of the internal connection electrodes are used as external connection electrodes on the front face, and external connection electrodes on the back face are connected to the wiring pattern.

Abstract: In an insertion operation for combined use of contents in a content editing device such as a portable phone, if content without being combined is authorized content, all restriction conditions that have been added to content to be inserted and existing content are initially extracted. The restriction condition refers to information restricting combination with other content or information restricting combination with specific content. The content editing device investigates whether or not the restriction condition described above is satisfied with respect to all contents, and allows insertion of the content in the existing content only when the restriction condition is satisfied.

Abstract: There is provided a data processing device capable of easily creating a message based on a received message by the same procedure or configuration used when the message was created. Template data includes a display area and a creation area. When the data processing device displays a message from the template data, the display area is extracted and used. When the data processing device creates a message based on the template data, the creation area is extracted and used. The display area, the creation area and the message are transmitted to another device. On the reception side of the message, an operation area is extracted, and another message data can be easily created with the same operation used when the received message was created.

Abstract: In an insertion operation for combined use of contents in a content editing device such as a portable phone, if content without being combined is authorized content, all restriction conditions that have been added to content to be inserted and existing content are initially extracted. The restriction condition refers to information restricting combination with other content or information restricting combination with specific content. The content editing device investigates whether or not the restriction condition described above is satisfied with respect to all contents, and allows insertion of the content in the existing content only when the restriction condition is satisfied.

Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.

Abstract: An animation data producing method of producing second animation data by replacing specific element data of first animation data with different data, includes the steps of extracting element data included in the different data and a tag for determining the element data, replacing the specific element data included in the first animation data with the element data corresponding to the extracted tag matching with the tag for determining the element data, and producing the second animation data.

Abstract: In order to select a desired object, a plurality of object choices serving as candidates for a desired object are first decided (S201). Then, a plurality of object choices are ordered on a predetermined criterion that can arbitrarily be changed (S202). The object choices are displayed one by one while being switched according to the ordering, with their brightness or colors changed or using a selection mark (S203). By entering a predetermined input when the desired object is displayed as an object choice (S204-S206), the user can select the desired object (S207). Since the order of presenting object choices is decided on the criterion that can arbitrarily be changed according to their attributes or the like, the appearance of the desired object can be advanced, as compared with the case where the order is fixed.

Abstract: An editing device includes a feature point detecting unit (S81) detecting a position of a feature point for specifying an operation target, a feature point projecting unit (S83) projecting into a display region the feature point positioned outside the display region, and a feature point displaying unit (S84) displaying the feature point at a position where it is projected. Therefore, even if the operation target is located outside the display region, the user can know the position of the operation target.

Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.

Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.

Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.