Abstract: A three-dimensional shape measurement apparatus is provided that calculates the height of solder accurately. An approximation surface of a wiring pattern is prepared for an inspection block prior to the application of solder. Furthermore, an approximation surface of lands is prepared for an inspection block prior to the application of solder. Then, based on the prepared approximation surface Sr of the wiring pattern and the approximation surface Sl of the lands, an offset, that is, the distance between the approximation surface Sr of the wiring pattern and the approximation surface Sl of the lands is calculated. Then, the calculated offset is stored in a RAM or the like. Then, after the application of solder, the stored offset is read out, and the height of the solder is calculated.

Abstract: For each teaching image, a plurality of patterns of color pickup regions each include a first region for picking up a color of a first part and a second region for picking up a color of a second part are set, the color of each pixel in the first region and the color of each pixel in the second region are mapped as a target point and an exclusion point respectively, to a color space for each of the patterns of the color pickup regions, a degree in separation between a target point distribution and an exclusion point distribution in the color space is calculated for each of the patterns of the color pickup regions, a pattern of a color pickup region having a maximum degree in separation is selected, a color range which divides the color space and has the largest difference between the number of target points and the number of exclusion points in the selected pattern therein is found, and the found color range is set as a color condition used in a board inspecting process.

Abstract: In generating inspection logic of a new component, the image of a new component is obtained, the trend data for selected characteristics of the focused region of the new component is computed; a previously inspected component having characteristics similar to that of the new component is selected by comparing the trend data of the new component with trend data of the previously inspected component, the image of the selected (previously inspected) component is read from the storage device, and inspection logic for the new component is generated using the images of the new component and images of the previously inspected component as teaching data.

Abstract: A PC board inspecting method capable of detecting deviation of an IC component at high speed with small storage capacity utilizes inspection logic particular to a component to be inspected. The inspection logic includes a color condition for specifying a color appearing in the body of the component to be inspected. The component is radiated with a plurality of color rays at different angles of incidence. An image formed by reflection light of the color rays is captured, and an inspection image including at least part of an edge of the body of the component to be inspected is captured. By using the color condition, a component body area satisfying the color condition is extracted from the inspection image by an image process.

Abstract: A cushion body is provided with a core material formed by a melamine resin foam body, and a surface layer material formed by a polyurethane resin foam body in which an expandable graphite is dispersed, and covering a periphery of the core material. A through hole extending along a thickness direction of the cushion body is formed at a predetermined position of the core material. A surface layer material fills the through hole, and the core material and the surface layer material are integrally formed. The cushion body increases a lightweight property of the cushion body by the core material formed by the melamine resin foam body, increases a fire retardant property of the cushion body by the expandable graphite, and increases cushioning and durability properties of the cushion body by the polyurethane resin foam body.

Abstract: For each teaching image, a plurality of patterns of color pickup regions each include a first region for picking up a color of a first part and a second region for picking up a color of a second part are set, the color of each pixel in the first region and the color of each pixel in the second region are mapped as a target point and an exclusion point respectively, to a color space for each of the patterns of the color pickup regions, a degree in separation between a target point distribution and an exclusion point distribution in the color space is calculated for each of the patterns of the color pickup regions, a pattern of a color pickup region having a maximum degree in separation is selected, a color range which divides the color space and has the largest difference between the number of target points and the number of exclusion points in the selected pattern therein is found, and the found color range is set as a color condition used in a board inspecting process.

Abstract: image In generating inspection logic of a new component, the image of a new component is obtained, the trend data for selected characteristics of the focused region of the new component is computed; a previously inspected component having characteristics similar to that of the new component is selected by comparing the trend data of the new component with trend data of the previously inspected component, the image of the selected (previously inspected) component is read from the storage device, and inspection logic for the new component is generated using the images of the new component and images of the previously inspected component as teaching data.

Abstract: A PC board inspecting method capable of detecting deviation of an IC component at high speed with small storage capacity utilizes inspection logic particular to a component to be inspected. The inspection logic includes a color condition for specifying a color appearing in the body of the component to be inspected. The component is radiated with a plurality of color rays at different angles of incidence. An image formed by reflection light of the color rays is captured, and an inspection image including at least part of an edge of the body of the component to be inspected is captured. By using the color condition, a component body area satisfying the color condition is extracted from the inspection image by an image process.

Abstract: A technology is provided for automatically producing an inspection logic to be used in the action of inspecting a PC board. An inspection logic setting apparatus is arranged for acquiring a plurality of first images of components to be detected by the inspection and a plurality of second images of components to be rejected by the inspection, dividing each first and second images into the plurality of blocks, calculating a color distance between the plurality of first images and the plurality of second images in each block, selecting one or more blocks from the plurality of blocks which are relatively greater in the color distance, and assigning the selected block(s) to an area condition.

Abstract: A communication device has a cut-off frequency switching unit for switching a cut-off frequency for communication data at a communication line, and a confirming unit for confirming whether or not a communication partner has the cut-off frequency switching unit, in advance of sending and receiving of communication data. The confirming unit is structured such that switching control of the cut-off frequency switching unit is carried out in accordance with results of confirmation.

Abstract: Disclosed is a communication device which has: a cut-off frequency switching means for switching a cut-off frequency for communication data at a communication line; and confirming means for confirming whether or not a communication partner has the cut-off frequency switching means, in advance of sending and receiving of communication data. The confirming means is structured such that switching control of the cut-off frequency switching means is carried out in accordance with results of confirmation.

Abstract: A polymerizable composition contains unsaturated urethane shown by Formula (1) given below, vinyl monomer which is copolymerizable with this unsaturated urethane, and an inorganic powder filler at weight ratio of (unsaturated urethane)/(vinyl monomer)=10/90-90/10, the inorganic powder filler being 30-300 weight parts with respect to 100 weight parts of the sum of the unsaturated urethane and vinyl monomer: ##STR1## where X is a residual group obtained by removing isocyanate groups from polyisocyanate; Y is a residual group obtained by removing hydroxyl groups from polyol; R.sup.1 is a residual group obtained by removing hydroxyl group from non-radical polymerizable mono-ol having aliphatic hydrocarbon group with 6-22 carbon atoms; R.sup.2 is H or CH.sub.3 ; and p, q and r are each an integer 1-3 such that 2.ltoreq.p+q.ltoreq.4 and qr.gtoreq.2. In-mold cured products obtained from such a polymerizable composition have superior external appearance and water-resistance, and their mold shrinkage is small.

Abstract: Thermosetting (meth)acrylate molding liquid resin consisting of a specified type of unsaturated oligourethane and alkyl (meth)acrylate within a specified range of ratio. Such a specified type of unsaturated oligourethane may be obtained by reaction between 2-isocyanatoalkyl (meth)acrylate and polyhydric alcohol or by reacting 2-isocyanatoalkyl (meth)acrylate with polyhydric alcohol at molar ratio of functional groups NCO/OH between 1.1 and 1.6 to form a urethane compound and reacting hydroxyalkyl (meth)acrylate with a residual portion of 2-isocyanatoalkyl (meth)acrylate at molar ratio of functional groups OH/NCO between 1.0 and 1.5. This invention also includes molding compositions containing such liquid resin and a specified type of inorganic filler and/or a certain type of thermoplastic high molecular compound as well as molded objects obtained by curing such compositions in a mold.

Abstract: A polymerizable composition contains unsaturated urethane shown by Formula (1) given below, vinyl monomer which is copolymerizable with this unsaturated urethane, and an inorganic powder filler at weight ratio of (unsaturated urethane)/(vinyl monomer)=10/90-90/10, the inorganic powder filler being 30-300 weight parts with respect to 100 weight parts of the sum of the unsaturated urethane and vinyl monomer: ##STR1## where R.sup.1 is hydrogen atom or methyl group; X is a residual group obtained by removing isocyanate groups from diisocyanate; Y is a residual group obtained by removing hydroxyl groups from non-radical polymerizable di-ol or tri-ol of a specified kind; Z is an organic group in the form of (R.sup.2 O).sub.m or R.sup.3 O, R.sup.2 being an alkylene group with 2-4 carbon atoms, R.sup.3 being an alkylene group with 2-12 carbon atoms, and m being an integer 2-10; and n is 2 or 3.

Abstract: Radical polymerizable liquid resins contain unsaturated urethane of a specified structure and vinyl monomers at weight ratio of (unsaturated urethane)/(vinyl monomers)=10/90-90/10. The unsaturated urethane has (meth)acryloyl and higher aliphatic hydrocarbon groups in its molecule, and the vinyl monomers are copolymerizable with this unsaturated urethane.

Abstract: Molded products with improved dimensional stability and surface property can be obtained by in-mold curing of a polymerizable composition containing unsaturated urethane of a specified structure, alkyl (meth)acrylate, and a thermoplastic macromolecular compound capable of dissolving in or swelling by impregnating alkyl (meth)acrylate. These components are contained at specified weight ratio. The mold is initially at temperature 30.degree..about.120.degree. C. and the curing is effected in the presence of a radical initiator.

Abstract: Unsaturated urethane having specified molecular structure shown by Formula (1) given below and vinyl monomers which are copolymerizable with such unsaturated urethane can form together polymerizable compositions which, as well as in-mold cured products therefrom, have improved characteristics such as compatibility between the constituents and water resistance: ##STR1## where X is a residual group obtained by removing the hydroxyl groups from a trihydric or tetrahydric polyol; R.sup.1 and R.sup.3 are each H or CH.sub.3 ; R.sup.2 is higher aliphatic hydrocarbon group with 5.about.21 carbon atoms; p and q are each 1 or 2; r is an integer 0.about.2 such that p+q+r=3 or 4 and p+r=2 or 3; and a is an integer 2.about.4.

Abstract: A graft copolymer, which is effective as an additive to unsaturated polyester resins, contains 10-80 weight % of a macromonomer of a specified kind, 20-89.9 weight % of a vinyl monomer of another specified kind, and 0.1-5 weight % of vinyl monomers of still other kinds. If necessary, up to 40 weight % of still another constituent of a specified kind may be contained.

Abstract: A curable unsaturated polyester resin composition contains graft copolymers each having 10-60 weight % of a first constituent given by ##STR1## 38-89.7 weight % of a second constituent given by ##STR2## and 0.3-2 weight % of a third constituent which is a vinyl monomer unit having carboxylic acid or carboxylic anhydride groups, unsaturated polyester, vinyl monomer, a filler, a curing catalyst, and reinforcing fibers, where either of R.sup.1 and R.sup.2 is H, the other being either H or CH.sub.3, R.sub.3 is ethylene group or propylene group, R.sup.4 is hydrocarbon group with 1-18 carbton atoms, R.sup.5 is alkyl group with 1-4 carbon atoms, R.sup.6 is alkyl group with 1-3 carbon atoms, m is 6-90 and n is 1-5.