Abstract: A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.

Abstract: In an adaptive equalizing transversal filter for quantizing a transmission waveform deformed because of communication line characteristics, a control circuit is provided for inhibiting the updating of mutiplication coefficients when an error signal between an equalized value and a quantized expected value is small, so as to omit the mutiplication operation required for obtaining the mutiplication coefficients, thereby reducing power consumption.