Abstract: It is an object of the present invention to provide a release film which is superior in the flexibility at high temperature, the conformability to circuit patterns, the heat resistance, the releasing property and the non-contaminative property, and easily discarded after use. The present invention relates to a release film, which is used in a manufacturing process of a printed-circuit board, a flexible printed-circuit board or a multilayer printed-circuit board, having a layer comprising a resin composition comprising a resin having a polar group in a main chain as a matrix and having a halogen content of 5% by weight or less on at least one surface.

Abstract: A multi-layer sheet which has a follow-up layer being composed of a resin composition containing a resin having a melting point, which is the melting peak temperature measured by DSC, in the range of 50 to 130° C. as a primary component, and a releasing layer being composed of a resin composition containing a resin having a melting point of 200° C. or higher as a primary component and being laminated on the above follow-up layer, wherein when the two releasing layers of the above multi-layer sheets are closely contacted with each other under a condition of 170° C. and 3 MPa for 30 minutes, they exhibit a blocking force of 0.1 N/cm or less as measured in accordance with ASTM D1893. The multi-layer sheet is excellent in heat resistance, releasing characteristics and follow-up characteristics to an irregular surface, exhibits excellent non-staining characteristics and also can be easily disposed of after use.

Abstract: It is an object of the present invention to provide a release film which is superior in the flexibility at high temperature, the conformability to circuit patterns, the heat resistance, the releasing property and the non-contaminative property, and easily discarded after use. The present invention relates to a release film, which is used in a manufacturing process of a printed-circuit board, a flexible printed-circuit board or a multilayer printed-circuit board, having a layer comprising a resin composition comprising a resin having a polar group in a main chain as a matrix and having a halogen content of 5% by weight or less on at least one surface.

Abstract: The present invention presents a thermoplastic elastomer that exhibits superior moisture permeability, excellent flexibility and mechanical properties at a high temperature, particularly settling resistance at a high temperature, and excellent moisture permeability. The thermoplastic elastomer includes, as a constituting unit, a polyether component (A) and a polyester component (B), wherein the polyether component (A) includes poly-oxyalkylene groups (—CnH2nO—) having a carbon/oxygen atomic ratio in a range from 2.0 to 2.5, the polyester component (B) has a number-average molecular weight in a range from 500 to 10,000, the thermoplastic elastomer has a content of polyether component (A) in a range from 50 to 95 weight %, and the thermoplastic elastomer has a glass transition temperature of not more than ?20° C.

Abstract: The present invention has for its object to provide an ester elastomer having a high block of the hard and soft segment components, high flexibility, and good mechanical properties at high temperature, particularly high temperature creep resistance and a process for producing said ester elastomer.