Patents by Inventor Hiroto Akaike

Hiroto Akaike has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230081640
    Abstract: An infrared shielding film is an infrared shielding film including: an organic binder; and a plurality of tin-doped indium oxide particles (ITO particles) dispersed in the organic binder, in which the average center-to-center distance between adjacent particles of the ITO particles is in a range of 9 nm or more and 36 nm or less, the ratio of the average center-to-center distance between the adjacent particles to the average primary particle diameter of the ITO particles is in a range of 1.05 or more and 1.20 or less, and a roughness Ra of a film surface is in a range of 4 nm or more and 50 nm or less.
    Type: Application
    Filed: July 30, 2020
    Publication date: March 16, 2023
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Miho Shoji, Satoko Higano, Hiroto Akaike
  • Patent number: 11542381
    Abstract: A silver-coated resin particle having a resin particle and a silver coating layer provided on a surface of the resin particle, in which an average value of a 10% compressive elastic modulus is in a range of 500 MPa or more and 15,000 MPa or less and a variation coefficient of the 10% compressive elastic modulus is 30% or less.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: January 3, 2023
    Assignees: Mitsubishi Materials Corporation, Mitsubishi Materials Electronic Chemicals Co., Ltd.
    Inventors: Hiroto Akaike, Kazuhiko Yamasaki, Kensuke Kageyama, Hirokazu Tsukada
  • Publication number: 20210363322
    Abstract: A silver-coated resin particle having a resin particle and a silver coating layer provided on a surface of the resin particle, in which an average value of a 10% compressive elastic modulus is in a range of 500 MPa or more and 15,000 MPa or less and a variation coefficient of the 10% compressive elastic modulus is 30% or less.
    Type: Application
    Filed: January 28, 2019
    Publication date: November 25, 2021
    Inventors: Hiroto Akaike, Kazuhiko Yamasaki, Kensuke Kageyama, Hirokazu Tsukada
  • Patent number: 11015249
    Abstract: The silver-coated silicone rubber particles according to the present invention are each formed by providing a first coating layer comprising silicon or a silicon compound on the surface of a silicone rubber particle and further providing a second coating layer comprising silver on the surface of the first coating layer. In a conductive paste containing the silver-coated silicone rubber particles, the silver-coated silicone rubber particles are dispersed evenly.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: May 25, 2021
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hiroto Akaike, Kazuhiko Yamasaki
  • Patent number: 10590540
    Abstract: A silver-coated particle (P1) is provided. The silver-coated particle (P1) includes a core particle (2) made of a resin particle or an inorganic particle and a silver coating layer (1) formed on a surface of the core particle (2), wherein, an amount of silver contained in the silver coating layer (1) is 5 to 90 parts by mass with respect to 100 parts of the silver-coated particle (P1), a crystallite diameter of the silver, which is calculated from a diffraction line obtained by filling a sample holder belonging to an X-ray diffraction apparatus with the silver-coated particle (P1); and irradiating X-ray in a range of 2?/?=30 to 120 deg., is in a range of 35 nm to 200 nm.
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: March 17, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hiroto Akaike, Kazuhiko Yamasaki
  • Patent number: 10573425
    Abstract: This electrically conductive paste contains a solvent, a binder resin that does not contain unsaturated bonds within the molecules, and silver-coated resin particles as an electrically conductive filler dispersed in the binder resin. The silver-coated resin particles include resin core particles comprising silicone rubber particles, and a silver coating layer covering the surface of the resin core particles. Furthermore, the average grain diameter of the silver-coated resin particles is 0.5-20 ?m, and the silver-coated resin particles are contained at 30-75 vol. % with respect to 100 vol. % of the solids content of the electrically conductive paste.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: February 25, 2020
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hiroto Akaike, Kazuhiko Yamasaki
  • Publication number: 20190368047
    Abstract: The silver-coated silicone rubber particles according to the present invention are each formed by providing a first coating layer comprising silicon or a silicon compound on the surface of a silicone rubber particle and further providing a second coating layer comprising silver on the surface of the first coating layer. In a conductive paste containing the silver-coated silicone rubber particles, the silver-coated silicone rubber particles are dispersed evenly.
    Type: Application
    Filed: January 16, 2018
    Publication date: December 5, 2019
    Inventors: Hiroto Akaike, Kazuhiko Yamasaki
  • Patent number: 10249591
    Abstract: A resin composition is provided, including a binder resin, and silver-coated particles in which a functional group is introduced to a surface. A ratio (a/b) of Young's modulus (a) of the silver-coated particles to Young's modulus (b) of the binder resin after being cured is 0.1 to 2.0, and the Young's modulus (a) of the silver-coated particles is 0.05 to 2.0 GPa.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: April 2, 2019
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hiroto Akaike, Kazuhiko Yamasaki
  • Publication number: 20190043638
    Abstract: This electrically conductive paste contains a solvent, a binder resin that does not contain unsaturated bonds within the molecules, and silver-coated resin particles as an electrically conductive filler dispersed in the binder resin. The silver-coated resin particles include resin core particles comprising silicone rubber particles, and a silver coating layer covering the surface of the resin core particles. Furthermore, the average grain diameter of the silver-coated resin particles is 0.5-20 ?m, and the silver-coated resin particles are contained at 30-75 vol. % with respect to 100 vol. % of the solids content of the electrically conductive paste.
    Type: Application
    Filed: September 14, 2016
    Publication date: February 7, 2019
    Inventors: Hiroto Akaike, Kazuhiko Yamasaki
  • Publication number: 20180286829
    Abstract: A resin composition is provided, including a binder resin, and silver-coated particles in which a functional group is introduced to a surface. A ratio (a/b) of Young's modulus (a) of the silver-coated particles to Young's modulus (b) of the binder resin after being cured is 0.1 to 2.0, and the Young's modulus (a) of the silver-coated particles is 0.05 to 2.0 GPa.
    Type: Application
    Filed: October 17, 2016
    Publication date: October 4, 2018
    Inventors: Hiroto Akaike, Kazuhiko Yamasaki
  • Publication number: 20180016679
    Abstract: A silver-coated particle (P1) is provided. The silver-coated particle (P1) includes a core particle (2) made of a resin particle or an inorganic particle and a silver coating layer (1) formed on a surface of the core particle (2), wherein, an amount of silver contained in the silver coating layer (1) is 5 to 90 parts by mass with respect to 100 parts of the silver-coated particle (P1), a crystallite diameter of the silver, which is calculated from a diffraction line obtained by filling a sample holder belonging to an X-ray diffraction apparatus with the silver-coated particle (P1); and irradiating X-ray in a range of 2?/?=30 to 120 deg., is in a range of 35 nm to 200 nm.
    Type: Application
    Filed: January 18, 2016
    Publication date: January 18, 2018
    Inventors: Hiroto Akaike, Kazuhiko Yamasaki