Patents by Inventor Hiroto Aoki

Hiroto Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal/ceramic bonding substrate and method for producing same
    Patent number: 9944565
    Abstract: After a wet blasting treatment for jetting a slurry, which contains spherical alumina as abrasive grains in a liquid, to the surface of a ceramic substrate 10 of aluminum nitride sintered body so that the ceramic substrate 10 has a residual stress of not higher than ?50 MPa and so that the surface of the ceramic substrate 10 to be bonded to the metal plate 14 has an arithmetic average roughness Ra of 0.15 to 0.30 ?m, a ten-point average roughness Rz of 0.7 to 1.1 ?m and a maximum height Ry of 0.9 to 1.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: April 17, 2018
    Assignees: DOWA METALTECH CO., LTD., TOKUYAMA CORPORATION
    Inventors: Hideyo Osanai, Yukihiro Kitamura, Hiroto Aoki, Yukihiro Kanechika, Ken Sugawara, Yasuko Takeda
  • METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
    Publication number: 20150284296
    Abstract: After a wet blasting treatment for jetting a slurry, which contains spherical alumina as abrasive grains in a liquid, to the surface of a ceramic substrate 10 of aluminum nitride sintered body so that the ceramic substrate 10 has a residual stress of not higher than ?50 MPa and so that the surface of the ceramic substrate 10 to be bonded to the metal plate 14 has an arithmetic average roughness Ra of 0.15 to 0.30 ?m, a ten-point average roughness Rz of 0.7 to 1.1 ?m and a maximum height Ry of 0.9 to 1.
    Type: Application
    Filed: November 20, 2012
    Publication date: October 8, 2015
    Applicants: TOKUYAMA CORPORATION, DOWA METALTECH CO., LTD
    Inventors: Hideyo Osanai, Yukihiro Kitamura, Hiroto Aoki, Yukihiro Kanechika, Ken Sugawara, Yasuko Takeda