Abstract: A technique is capable of preventing particles from adhering onto a wafer when a lid is attached or detached from a pod. A substrate processing apparatus includes: a placement part whereon a substrate container is placed; a guide part constituting a lid opening/closing space; a gate part separating the lid opening/closing space from a transfer chamber; a lid opening/closing mechanism provided in the lid opening/closing space and configured to attach or detach a lid of the substrate container; a gas introduction mechanism configured to supply a gas into the substrate container; a monitor part configured to monitor and adjust an inner pressure of the substrate container; and a controller configured to: (i) control the lid opening/closing mechanism; and (ii) control the monitor part to maintain the inner pressure of the substrate container higher than an inner pressure of the lid opening/closing space while the lid opening/closing mechanism detaches the lid.

Abstract: A technique is capable of preventing particles from adhering onto a wafer when a lid is attached or detached from a pod. A substrate processing apparatus includes: a placement part whereon a substrate container is placed a guide part constituting a lid opening/closing space; a gate part separating the lid opening/closing space from a transfer chamber; a lid opening/closing mechanism provided in the lid opening/closing space and configured to attach or detach a lid of the substrate container; a as introduction mechanism configured to supply a gas into the substrate container; a monitor part configured to monitor and adjust an inner pressure of the substrate container; and a controller configured to: (i) control the lid opening/closing mechanism; and (ii) control the monitor part to maintain the inner pressure of the substrate container higher than an inner pressure of the lid opening/closing space while the lid opening/closing mechanism detaches the lid.