Patents by Inventor Hiroto Komatsu

Hiroto Komatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060086518
    Abstract: This shielding box comprises a molded body formed like a box having a bottom wall, side walls formed to rise from the outer peripheries of the bottom wall, and an opening described by the edges of the side walls opposite the bottom wall. The side walls are connected to the bottom wall through elastic connectors formed to act as plate springs with respect to the bottom wall, and at least one of the inner surface and outer surface of the molded body is electrically conductive.
    Type: Application
    Filed: February 13, 2004
    Publication date: April 27, 2006
    Inventors: Toshiyuki Kawaguchi, Katsuhiko Seriguchi, Hiroto Komatsu, Kiyofumi Tanaka, Hiroshi Kato
  • Patent number: 6091475
    Abstract: Proposed is a novel connector for display inspection of a liquid crystal display panel, by which the display panel per se can be inspected before mounting of a driver IC chip thereon to greatly improve the productivity of the display inspection.
    Type: Grant
    Filed: December 9, 1997
    Date of Patent: July 18, 2000
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Tsutomu Ogino, Hiroto Komatsu
  • Patent number: 6078137
    Abstract: A display panel which can reduce the number of external terminals for a fluorescent display tube and has its simplified assembled structure difficult to cause conduction failure. The base substrate of the container for a fluorescent display tube protrudes partially outward. Conductors electrically connected to the electrodes inside the container are derived out from the container to electrically connect to the external electrodes on the substrate. Connection terminals are formed on the substrate. The conductive rubber connector includes a non-conductive portion 39 with a nearly L-shaped cross section in which plural conductive fine wires bent in a nearly U-shaped form are buried at predetermined intervals. The fluorescent display tube is mounted on the upper surface of the printed board. The conductive rubber connector is placed at a predetermined position. The fluorescent display tube and the conductive rubber connector are fixed by means of a fixture.
    Type: Grant
    Filed: October 22, 1997
    Date of Patent: June 20, 2000
    Assignee: Futaba Denshi Kogyo K.K.
    Inventors: Kazuhiko Tojo, Tatsuya Yoshino, Hiroto Komatsu, Kenji Fujino
  • Patent number: 5975915
    Abstract: A socket for the inspection of semiconductor devices is disclosed which has laterally extended leads. The device is mounted in a mounting seat of the socket body and results in improvement of the inspection process because difficult steps such as soldering can be omitted. The socket is composed of a socket body which is mountable on a circuit board having a mounting seat therefor, a lead frame intervening between the socket body and the circuit board and an anisotropically electroconductive elastic connector sheet.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: November 2, 1999
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Kouichi Yamazaki, Hiroto Komatsu
  • Patent number: 5960536
    Abstract: Proposed is a novel wiring circuit board for mounting of a semiconductor chip suitable for free mounting and demounting thereof. The wiring circuit board comprises: an insulating base plate provided with electrodes on one surface and having an opening for insertion of the semiconductor chip; bonding wires each connected to one of the electrodes at one end, with the other end appearing in the opening at a position just to come into contact with the electrode of a semiconductor chip inserted into the opening; and a resinous encapsulating layer covering the opening and embedding the bonding wires. A method for the preparation of this wiring circuit board is also disclosed in which accurate positioning of the ends of the bonding wires appearing in the opening of the base plate is accomplished by using a dummy chip provided with etching-resistant false electrodes and inserted into the opening followed by subsequent removal by etching after completion of the bonding work of the bonding wires.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: October 5, 1999
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Tsutomu Ogino, Hiroto Komatsu
  • Patent number: 5933018
    Abstract: A liquid crystal display panel inspection device capable of reducing a manufacturing cost and significantly reducing intervals or pitches between connection wires and a method for manufacturing the same. The device includes a panel holder formed with a mounting hole in which a liquid crystal display panel is mounted and electrodes arranged around the mounting hole on one surface of the panel holder. Also, it includes connection wires of a dog-legged shape each connected at one end thereof to one of the electrodes of the panel holder and arranged so as to extend into the mounting hole. The connection wires are each formed at the other end thereof with a terminal, which is rendered abuttable against one of the electrodes of the liquid crystal display panel. The panel holder is mounted on the other surface thereof with a holding plate for selectively closing the mounting hole.
    Type: Grant
    Filed: July 8, 1996
    Date of Patent: August 3, 1999
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventor: Hiroto Komatsu