Abstract: A liquid ejection head includes a print element board and an electric wiring board electrically connected to a bump of the print element board using an interconnecting wire. The bump has a first surface and a second surface. The height of the second surface from a surface of a base plate is higher than that of the first surface. The first surface has a protrusion formed therein, and the bump is connected to the interconnecting wire in the second surface.

Abstract: A liquid ejection head chip includes a liquid ejection unit having a plurality of ejection orifices for ejecting a liquid, a flow path in communication with the ejection orifices, and an energy generating element that generates energy for ejecting the liquid, the liquid ejection unit being provided on an upper surface formed of a (100) surface of a silicon single-crystal substrate. The side surfaces in at least one of two combinations of opposing side surfaces of the substrate have (111) surfaces of silicon single crystal and the angles of the (111) surfaces relative to the (100) surface are supplementary to each other.

Abstract: A method for manufacturing a liquid ejection head includes the steps of: disposing an etching mask layer on a substrate having a first face and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face; forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the support port is to be formed; providing an etching opening at the etching mask layer; performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate; comparing the line pattern with a recess generated at the substrate, thus selecting a device chip for liquid ejection; and connecting the selected device chip to a liquid supply part.

Abstract: The method of manufacturing a liquid ejection head includes: forming a first protective layer on one surface of the substrate; forming the wiring layer on another surface of the substrate; forming the insulating layer on the wiring layer, and then partially removing the insulating layer to partially expose the wiring layer; forming the electrode pad on an exposed portion of the wiring layer; forming a flow path member on the another surface of the substrate; forming a second protective layer on the one surface of the substrate after the formation of the flow path member; and partially removing at least one of the first protective layer and the second protective layer, and then forming the supply port leading from the one surface of the substrate to the another surface of the substrate.

Abstract: A liquid ejection head chip includes a liquid ejection unit having a plurality of ejection orifices for ejecting a liquid, a flow path in communication with the ejection orifices, and an energy generating element that generates energy for ejecting the liquid, the liquid ejection unit being provided on an upper surface formed of a (100) surface of a silicon single-crystal substrate. The side surfaces in at least one of two combinations of opposing side surfaces of the substrate have (111) surfaces of silicon single crystal and the angles of the (111) surfaces relative to the (100) surface are supplementary to each other.

Abstract: A method for manufacturing a liquid ejection head includes the steps of: disposing an etching mask layer on a substrate having a first face and a second face that is on an opposite side of the first face, the etching mask layer being disposed on the second face; forming a concave line pattern at a region of the etching mask layer other than a region where an opening for the support port is to be formed; providing an etching opening at the etching mask layer; performing anisotropic etching from a side of the second face using the etching mask layer provided with the etching opening as a mask, thus forming the supply port at the substrate; comparing the line pattern with a recess generated at the substrate, thus selecting a device chip for liquid ejection; and connecting the selected device chip to a liquid supply part.

Abstract: A liquid ejection head includes a print element board and an electric wiring board electrically connected to a bump of the print element board using an interconnecting wire. The bump has a first surface and a second surface. The height of the second surface from a surface of a base plate is higher than that of the first surface. The first surface has a protrusion formed therein, and the bump is connected to the interconnecting wire in the second surface.

Abstract: A manufacturing method, for a liquid discharge head substrate that includes a silicon substrate in which a liquid supply port is formed, includes the steps of: preparing the silicon substrate, on one face of which a mask layer, in which an opening has been formed, is deposited; forming a first recessed portion in the silicon substrate, so that the recessed portion is extended through the opening from the one face of the silicon substrate to the other, reverse face of the silicon substrate; forming a second recessed portion by performing wet etching for the substrate, via the first recessed portion, using the mask layer; and performing dry etching for the silicon substrate in a direction from the second recessed portion to the other face.

Abstract: A liquid ejection head includes a flow path forming member having an ejection orifice for ejecting liquid therefrom and a liquid flow path communicated with the ejection orifice, a silicon substrate including a supply port for supplying the liquid to the liquid flow path, and a protective film which is formed on a wall surface of the supply port and which is formed of an organic resin which is of the same material as that of a member forming the flow path forming member.

Abstract: A method for processing a substrate includes preparing a substrate having a first layer on a first surface side thereof, the first layer having a material capable of suppressing transmission of laser light, processing the substrate with laser light from a second surface that is opposite the first surface of the substrate toward the first surface of the substrate, and allowing the laser light to reach the first layer to form a hole in the substrate, and performing etching of the substrate from the second surface through the hole.

Abstract: The method of manufacturing a liquid ejection head includes: forming a first protective layer on one surface of the substrate; forming the wiring layer on another surface of the substrate; forming the insulating layer on the wiring layer, and then partially removing the insulating layer to partially expose the wiring layer; forming the electrode pad on an exposed portion of the wiring layer; forming a flow path member on the another surface of the substrate; forming a second protective layer on the one surface of the substrate after the formation of the flow path member; and partially removing at least one of the first protective layer and the second protective layer, and then forming the supply port leading from the one surface of the substrate to the another surface of the substrate.

Abstract: A method can produce a liquid discharge head including a liquid discharge energy generating element, a liquid discharge port, a liquid flow path, an electric circuit for driving the liquid discharge energy generating element, a first electrode pad for exchanging electrical signals with the exterior and a second electrode pad for testing the electric circuit. The method includes preparing a substrate provided with a conductive layer for forming the first electrode pad and the second electrode pad, forming a protective layer directly on the second electrode pad, after forming the protective layer, forming a metal layer by an electro less plating method on the conductive layer, removing the protective layer after the metal layer is formed, and providing a layer comprised of a resin on the second electrode pad after the protective layer is removed.

Abstract: A liquid discharge head having a liquid discharge head substrate including an element row in which a plurality of energy generating elements for generating thermal energy for use in discharging liquid are arranged, and a discharge port member corresponding to each of the plurality of energy generating elements, the discharge port members including a plurality of walls in contact with the liquid discharge head substrate to form a plurality of liquid chambers for storing liquid and a plurality of discharge ports which communicate with each of the plurality of the liquid chambers to discharge liquid with the thermal energy generated by the energy generating element. The liquid discharge head further includes a plurality of heat dissipating members corresponding to each of the plurality of the liquid chambers and having a first portion exposed to the liquid chamber and a second portion exposed to the atmosphere.

Abstract: When an insulating layer is provided in order to protect an energy generating element, there arises a possibility that the layer dissolves in a contacting liquid. Therefore, in order to eject liquid, a first protection layer containing metal is provided on the insulating layer facing a substrate for a liquid-ejection head and a second protection layer containing metal is provided on the surface of a liquid supply port to which a base containing silicon is exposed.

Abstract: There is disclosed a manufacturing method of a liquid discharge head including a substrate in which a first energy generating element and a second energy generating element that generate energy used for discharging liquid are provided, a discharge port member in which a first discharge port discharging the liquid is provided corresponding to the first energy generating element and a second discharge port discharging the liquid is provided corresponding to the second energy generating element, and a flow path wall member having a portion of the liquid flow path wall that communicates with the first discharge port and the second discharge port, in which a distance between the second energy generating element and the second discharge port is larger than that between the first energy generating element and the first discharge port.

Abstract: A manufacturing method forms an ink jet recording head including an energy generating element for generating energy for ejecting ink, wiring and electrode pad for supplying electric power to the energy generating element, and a flow path formation member in which an ink flow path is formed in fluid communication with an ink ejection outlet. The method includes steps of preparing a substrate on which the energy generating element, the wiring and the electrode pad have been formed; forming a protection layer covering edges of and around the generating element and the electrode pad; forming, with patterning, an adhesion layer for adhering the flow path formation member to a surface of the substrate through the protection layer, on a portion of the protection layer where the flow path formation member is formed and a portion surrounding the electrode pad; and forming through an electroless plating, a nickel layer covering the electrode pad and a gold layer covering the nickel layer to provide a bump.

Abstract: A liquid ejection head according to the present invention includes a heat-generating resistor layer, a first electrode layer, an insulating layer extending over the heat-generating resistive layers and the first electrode layer, and a second electrode layer that has a first portion which extending through the insulating layer and which is electrically connected to the first electrode layer and also has a second portion which is not in contact with the insulating layer. The second portion has a space or a piece of resin disposed between the insulating layer and the second electrode layer.

Abstract: A liquid discharge head includes, a substrate, a flow path wall member provided with a wall of a liquid flow path connected to a discharge port for discharging liquid, the flow path being formed by the flow path wall member and one surface of the substrate which are in contact with each other, and a coated resin member made of a cured material of a resin composition provided to cover end surfaces of the substrate, wherein a liquid repellent member having a contact angle of the resin composition larger than that of both the flow path wall member and the one surface is provided to cover at least a part of an intersection line between an outer lateral surface of the flow path wall member and the one surface.

Abstract: A method of manufacturing a substrate for a liquid discharge head having a silicon substrate in which a liquid supply port is provided includes providing the silicon substrate, an etching mask layer having an aperture being formed on one surface of the silicon substrate, forming a region comprising an amorphous silicon in the interior of the silicon substrate by irradiating the silicon substrate with laser light, forming a recess, which has an opening at a part of a portion exposed from the aperture on the one surface, from the one surface of the silicon substrate toward the region, and forming the supply port by performing etching on the silicon substrate in which the recess and the region have been formed from the one surface through the aperture of the etching mask layer.

Abstract: There is provided a substrate for an inkjet printing head and a method for manufacturing the same, in which the substrate has a structure that different kinds of metals do not come into contact with ink or moisture. For this purpose, the structure is constituted such that a diffusion preventing layer for mainly protecting a lower layer among power wiring metals is covered by a metal layer for mainly supplying power, in connection with its upper surface and at least part of a side surface. Herewith, since a single metal appears on a surface of the power wiring including up to its side surface, even circumstance occurs of coming into contact with the ink or the moisture, a battery reaction accompanied by difference of ionization tendency is not generated, and thus corrosion or short-circuit of the power wiring is suppressed.