Abstract: A manufacturing method of a semiconductor element includes forming a plurality of islands, each including a semiconductor layer containing a nitride semiconductor and a support formed on the semiconductor layer, on a sapphire substrate, joining the support to a retention substrate via an adhesive member, peeling off the semiconductor layer from the sapphire substrate by irradiating the semiconductor layer with laser light, and polishing a surface of the semiconductor layers peeled off from the sapphire substrate.

Abstract: A manufacturing method of a semiconductor element includes forming a plurality of semiconductor layers on a sapphire substrate, each of the semiconductor layers having a first surface on the sapphire substrate side and a second surface on the opposite side, joining the second surfaces of the plurality of semiconductor layers to a retention member via an adhesive member, peeling off the plurality of semiconductor layers from the sapphire substrate by irradiating the first surfaces of the plurality of semiconductor layers with laser light, and polishing the first surfaces of the plurality of semiconductor layers. At least one semiconductor layer among the plurality of semiconductor layers includes a polishing indication part extending from the second surface toward the first surface. The polishing is executed until the polishing indication part is exposed to the polished surface.

Abstract: A semiconductor memory device has a plastic package including an inductor, a first memory chip including a booster circuit that boosts a voltage from a first voltage to a second voltage using the inductor, and a second memory chip having a terminal supplied with the second voltage from the first memory chip.

Abstract: A robot includes a base having an interior space and a first opening portion, a turning drum supported and rotatable around a predetermined rotation axis, a cable distributing board capable of being detachably fixed at a position for closing the first opening portion which is placed at a position on an extending line of the rotation axis, and an inside cable one end of which is provided with a connector fixed to the cable distributing board. The turning drum has a through hole which penetrates through the turning drum in a direction along the rotation axis. A part of the inside cable between a first cable clamp and a second cable clamp is fixed in such a manner that bending deformation and twisting deformation due to rotation of the turning drum with respect to the base are caused in the part of the inside cable.

Abstract: A holder for holding a display device is divided into a first holder (5) and a second holder (6), and a light source housing chamber (10) for housing a light source (1) is also divided so that a work for mounting the light source (1) to the light source housing chamber (10) becomes easy. A first reflector (55) and a second reflector (65) integrally formed with the holder and having a reflecting surface corresponding to a light emitting part of the light source (1) are provided in the light source housing chamber (10), thus a certain space is secured around the light source, the light is efficiently incident to a light guide plate, and a separately formed reflector becomes unnecessary.

Abstract: The invention is directed to a method and a mold for forming a zinc collar on an insulator metal cap. The zinc collar forming mold is composed of a setting section for setting the metal cap in position on the mold and an upwardly opening cavity defined around the periphery of the setting section. For molding a zinc collar, the metal cap is immersed in a molten zinc, and the metal cap is set upright on the setting section of the mold with the lower half thereof being still in the molten state. Subsequenctly, a molten zinc is poured from the upper opening of the mold, and upon solidification of the molten zinc, a zinc collar can be formed around the external circumference of the metal cap.

Abstract: Disclosed is a method and a mold for forming a zinc collar on an insulator metal cap. The zinc collar forming mold comprises a setting section for setting the metal cap in position on the mold and an upwardly opening cavity defined around the periphery of the setting section. For molding a zinc collar, the metal cap is immersed in a molten zinc, and the metal cap is set upright on the setting section of the mold with the lower half thereof being still in the molten state. Subsequently, a molten zinc is poured from the upper opening of the mold, and upon solidification of the molten zinc, a zinc collar can be formed around the external circumference of the metal cap.

Abstract: The disclosed method forms a zinc sleeve on an insulator pin by dipping the insulator pin in molten zinc at about 450.degree.-650.degree. C. to heat and wet the insulator pin with the molten zinc, setting the hot and wetted insulator pin in a die having an open-top cavity in such a manner that an annular open-top molding cavity is defined around the insulator, the die being at about 50.degree.-300.degree. C. when receiving the insulator pin, pouring molten zinc in the annular molding cavity through its open top, and solidifying the zinc thus poured.