Patents by Inventor Hiroto Mitsui

Hiroto Mitsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6548180
    Abstract: An aromatic polyimide film of polyimide composed of a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component, which has a thickness of 35 to 55 &mgr;m and is employed for manufacturing a polyimide film/metal film laminate, preferably has a linear thermal expansion coefficient of 17×10−6 to 24×10−6 cm/cm/° C. (TD) in the temperature range of 50-200° C., and a modulus of tensile elasticity of 700 kgf/mm2 or more (TD), and has a surface having been subjected to discharge treatment.
    Type: Grant
    Filed: October 2, 2001
    Date of Patent: April 15, 2003
    Assignee: Ube Industries, Ltd.
    Inventors: Tomohiko Yamamoto, Takuji Takahashi, Kohji Narui, Hiroto Mitsui, Norihisa Komoda
  • Publication number: 20020058149
    Abstract: An aromatic polyimide film of polyimide composed of a 3,3′,4,4′-biphenyltetracarboxylic acid component and a p-phenylenediamine component, which has a thickness of 35 to 55 &mgr;m and is employed for manufacturing a polyimide film/metal film laminate, preferably has a linear thermal expansion coefficient of 17×10−6 to 24×10−6 cm/cm/° C. (TD) in the temperature range of 50-200° C., and a modulus of tensile elasticity of 700 kgf/mm2 or more (TD), and has a surface having been subjected to discharge treatment.
    Type: Application
    Filed: October 2, 2001
    Publication date: May 16, 2002
    Inventors: Tomohiko Yamamoto, Takuji Takahashi, Kohji Narui, Hiroto Mitsui, Norihisa Komoda
  • Patent number: 6191305
    Abstract: A tetraester of 3,3′,4,4′-biphenyltetracarboxylic acid is advantageously prepared by a process composed of a step of dimerizing an o-phthalic diester in the presence of a catalyst comprising a powdery palladium salt having a specific surface area of at least 0.5 m2/g and a basic bidentate ligand compound and one or more steps of continuing the dimerization after supplemental addition of at least one of the powdery palladium salt and the basic bidentate ligand compound.
    Type: Grant
    Filed: October 15, 1999
    Date of Patent: February 20, 2001
    Assignee: Ube Industries, Ltd.
    Inventors: Akira Ishikawa, Hiroto Mitsui, Kiyotaka Akao, Norihisa Komoda