Patents by Inventor Hiroto Miyazaki

Hiroto Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942176
    Abstract: A semiconductor memory device has a plastic package including an inductor, a first memory chip including a booster circuit that boosts a voltage from a first voltage to a second voltage using the inductor, and a second memory chip having a terminal supplied with the second voltage from the first memory chip.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: March 26, 2024
    Assignee: Kioxia Corporation
    Inventors: Tomoya Sanuki, Xu Li, Masayuki Miura, Takayuki Miyazaki, Toshio Fujisawa, Hiroto Nakai, Hideko Mukaida, Mie Matsuo
  • Publication number: 20210260680
    Abstract: A liquid agent supply device includes: a holder that holds a board; a supply head including a plurality of nozzles for supplying a liquid agent to a plurality of supply positions on the board held by the holder are arranged; and a supply head mover that relatively moves the board and the supply head, wherein the supply head mover relatively moves the board and the supply head according to a first movement method in which the board and the supply head relatively move along a specific direction determined regardless of supply positions among the plurality of supply positions, in a supply range including the plurality of supply positions.
    Type: Application
    Filed: July 9, 2019
    Publication date: August 26, 2021
    Inventors: Hiroto MIYAZAKI, Kazuki FUKADA, Kazunori ISHIKAWA, Wanyu TIE
  • Patent number: 9743568
    Abstract: A reel for a component mounting apparatus that pulls a carrier tape out of the reel and pitch-feeds and supplies the carrier tape by a tape feeder in a component supply part and picks up a supplied component and mounts the component in a substrate by a mounting head. The reel includes: a reel core part; and the carrier tape being wound and stored around the reel core part, wherein the carrier tape includes a distal end fixed to the reel core part, and a brittle part that is positioned in the vicinity of the distal end and is broken by action of longitudinal tension in excess of a prescribed strength on the carrier tape, and the pitch-feed separates the carrier tape from the reel core part at the brittle part.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: August 22, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kazunori Kanai, Masayuki Kuwabara, Hiroto Miyazaki
  • Publication number: 20150059171
    Abstract: A reel for a component mounting apparatus that pulls a carrier tape out of the reel and pitch-feeds and supplies the carrier tape by a tape feeder in a component supply part and picks up a supplied component and mounts the component in a substrate by a mounting head. The reel includes: a reel core part; and the carrier tape being wound and stored around the reel core part, wherein the carrier tape includes a distal end fixed to the reel core part, and a brittle part that is positioned in the vicinity of the distal end and is broken by action of longitudinal tension in excess of a prescribed strength on the carrier tape, and the pitch-feed separates the carrier tape from the reel core part at the brittle part.
    Type: Application
    Filed: September 2, 2014
    Publication date: March 5, 2015
    Inventors: Kazunori KANAI, Masayuki KUWABARA, Hiroto MIYAZAKI
  • Publication number: 20120167380
    Abstract: An electronic component mounting system formed by interlinking a plurality of electronic component mounting machines in series for enabling a machine operator to be prevented from mistaking the machine to which an operation section or a signal tower belongs for another. In each of the machines, an operation section placed to one direction side from a center in the board conveying direction of the machine on a machine side face is placed in an attitude in which the normal direction of an operation face is inclined toward the center line. A signal tower placed on one direction side from the center line on the top face of the machine is placed in an attitude in which at least one portion is inclined only at an angle ? toward the center line.
    Type: Application
    Filed: January 10, 2012
    Publication date: July 5, 2012
    Applicant: PANASONIC CORPORATION
    Inventors: Yuji Tanaka, Yuji Ogata, Toshiyuki Murakami, Hiroto Miyazaki, Youichi Tanaka
  • Publication number: 20110203106
    Abstract: An object of the invention is to provide an electronic component mounting system formed by interlinking a plurality of electronic component mounting machines in series for enabling a machine operator to be prevented from mistaking the machine to which an operation section or a signal tower belongs for another. In each of machines M1 to M5 making up an electronic component mounting system formed by interlinking a plurality of machines in series, an operation section 4 placed to one direction side from a center in the board conveying direction of the machine on a machine side face MS is placed in an attitude in which the normal direction of an operation face 4a is inclined toward the center line CL side. A signal tower 22 placed to one direction side from a center line CL on the top face of the machine is placed in an attitude in which at least one portion is inclined only at an angle ? toward the center line CL side.
    Type: Application
    Filed: August 12, 2008
    Publication date: August 25, 2011
    Applicant: PANASONIC CORPORATION
    Inventors: Yuji Tanaka, Yuji Ogata, Toshiyuki Murakami, Hiroto Miyazaki, Youichi Tanaka
  • Patent number: 7797819
    Abstract: A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a head fitting portion onto which the selected one head unit is removably loaded and which moves the head unit loaded on the head fitting portion in a direction extending generally along a surface of the board, and a head control unit which is provided for each of the head units and which performs control for component mounting operation by a head unit corresponding to the loaded head unit.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: September 21, 2010
    Assignee: Panasonic Corporation
    Inventors: Kensuke Kawasumi, Hiroto Miyazaki, Nobuhiro Nakai
  • Publication number: 20080163480
    Abstract: A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a head fitting portion onto which the selected one head unit is removably loaded and which moves the head unit loaded on the head fitting portion in a direction extending generally along a surface of the board, and a head control unit which is provided for each of the head units and which performs control for component mounting operation by a head unit corresponding to the loaded head unit.
    Type: Application
    Filed: March 6, 2008
    Publication date: July 10, 2008
    Inventors: Kensuke Kawasumi, Kunio Tanaka, Hiroto Miyazaki, Nobuhiro Nakai
  • Patent number: 7353589
    Abstract: A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a head fitting portion onto which the selected one head unit is removably loaded and which moves the head unit loaded on the head fitting portion in a direction extending generally along a surface of the board, and a head control unit which is provided for each of the head units and which performs control for component mounting operation by a head unit corresponding to the loaded head unit.
    Type: Grant
    Filed: October 6, 2004
    Date of Patent: April 8, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kensuke Kawasumi, Kunio Tanaka, Hiroto Miyazaki, Nobuhiro Nakai
  • Patent number: 7315766
    Abstract: In component mounting for executing a component feed operation and component holding and pickup operation, a recipe for the component holding and pickup operation that is an operational program for executing the component holding and pickup operation is received in a head unit, and the component holding and pickup operation is executed on the basis of the recipe. In addition, a timing signal based on this execution is transmitted from the head unit to a component feed unit, a recipe for the component feed operation for executing the component feed operation is received in the component feed unit, and the component feed operation is completed on the basis of this recipe and the timing signal transmitted from the head unit.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: January 1, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toru Chikuma, Hiroto Miyazaki, Junichi Kawashima, Youichi Tanaka, Noriaki Yoshida
  • Publication number: 20070124922
    Abstract: A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a head fitting portion onto which the selected one head unit is removably loaded and which moves the head unit loaded on the head fitting portion in a direction extending generally along a surface of the board, and a head control unit which is provided for each of the head units and which performs control for component mounting operation by a head unit corresponding to the loaded head unit.
    Type: Application
    Filed: October 6, 2004
    Publication date: June 7, 2007
    Inventors: Kensuke Kawasumi, Kunio Tanaka, Hiroto Miyazaki, Nobuhiro Nakai
  • Publication number: 20060179645
    Abstract: In component mounting for executing component feed operation and component holding and pickup operation, a recipe for the component holding and pickup operation that is an operation program for executing the component holding and pickup operation is received in a head unit, and the component holding and pickup operation is executed on the basis of the recipe. In addition, a timing signal based on the execution is transmitted to a component feed unit, the recipe for the component feed operation for executing the component feed operation is received in the component feed unit, and the component feed operation is completed on the basis of the recipe and the timing signal transmitted from the head unit.
    Type: Application
    Filed: February 20, 2004
    Publication date: August 17, 2006
    Inventors: Toru Chikuma, Hiroto Miyazaki, Junichi Kawashima, Youichi Tanaka, Noriaki Yoshida
  • Patent number: 5373438
    Abstract: In the sequence program (ladder circuit), in order to give a common address between contacts of the ladder circuit longitudinally and store states before and after the processing of the contact in the ladder circuit, two types of memories corresponding to addresses at the both ends of the contact are provided and a compiler for classifying the processing into the five types and a sequence execution unit for processing a machine language of the compiler are further provided so that execution can be made even if an output instruction is provided in an intermediate portion of the ladder circuit.
    Type: Grant
    Filed: August 26, 1993
    Date of Patent: December 13, 1994
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroto Miyazaki, Toshihiro Ide, Akiho Hirahata