Patents by Inventor Hiroto Nagaishi

Hiroto Nagaishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power module structure and solid state relay using same
    Patent number: 7403395
    Abstract: A power module structure has a heat plate for contacting a heat sink, an insulating plate soldered to the heat plate, a terminal soldered to the insulating plate and a semiconductor chip having a contact point corresponding to the terminal so as to contact the terminal through this contact point. The terminal is provided with a shock absorbing part that serves to weaken the force generated due to the difference in coefficient of thermal expansion between the terminal and the insulating plate. The terminal has a force restricting part that serves to restrict this force and is locally formed as a soldering area through which the terminal is soldered to the insulating plate. Such a structure is contained inside a base and makes a surface-contact with a heat sink to form a solid state relay.
    Type: Grant
    Filed: November 30, 2006
    Date of Patent: July 22, 2008
    Assignee: OMRON Corporation
    Inventors: Takashi Fujimoto, Hiroto Nagaishi, Shoichi Konagata
  • Power module structure and solid state relay using same
    Publication number: 20070134976
    Abstract: A power module structure has a heat plate for contacting a heat sink, an insulating plate soldered to the heat plate, a terminal soldered to the insulating plate and a semiconductor chip having a contact point corresponding to the terminal so as to contact the terminal through this contact point. The terminal is provided with a shock absorbing part that serves to weaken the force generated due to the difference in coefficient of thermal expansion between the terminal and the insulating plate. The terminal has a force restricting part that serves to restrict this force and is locally formed as a soldering area through which the terminal is soldered to the insulating plate. Such a structure is contained inside a base and makes a surface-contact with a heat sink to form a solid state relay.
    Type: Application
    Filed: November 30, 2006
    Publication date: June 14, 2007
    Inventors: Takashi Fujimoto, Hiroto Nagaishi, Shoichi Konagata