Patents by Inventor Hiroto Narieda

Hiroto Narieda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250179677
    Abstract: There is provided a composite material, that is a composite material in which a composite coating composed of a silver layer containing carbon particles is provided on a base material, wherein a crystallite size of silver of the composite coating is 30 nm or less; a value obtained by dividing an arithmetic average roughness Ra (?m) of the composite coating by a thickness (?m) of the composite coating is less than 0.2; and a proportion of carbon particles on a surface of the composite coating is 5% by area or more and 80% by area or less.
    Type: Application
    Filed: March 7, 2023
    Publication date: June 5, 2025
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Tatsuhiro DOI, Airi HIRAYAMA, Hiroto NARIEDA, Takao TOMIYA, Hirotaka KOTANI, Yukiya KATO, Hirotaka TAKAHASHI
  • Publication number: 20250034741
    Abstract: There is provided a composite material having a composite film on a substrate, the composite film including a silver layer that contains carbon particles, wherein a crystallite size of silver of the composite film is 30 to 100 nm and Vickers hardness Hv of the composite film is 75 or more.
    Type: Application
    Filed: December 9, 2022
    Publication date: January 30, 2025
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Hirotaka TAKAHASHI, Takao TOMIYA, Tatsuhiro DOI, Hirotaka KOTANI, Yukiya KATO, Hiroto NARIEDA
  • Publication number: 20240287699
    Abstract: There is provided a composite material in which an oxygen-containing silver-based coating layer is formed on a base material. the oxygen-containing silver-based coating layer containing silver and having oxygen present in the vicinity of its surface. and the base material comprising copper or copper alloy.
    Type: Application
    Filed: March 17, 2022
    Publication date: August 29, 2024
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Hirotaka KOTANI, Hiroto NARIEDA, Takao TOMIYA, Tatsuhiro DOI, Yukiya KATO, Hirotaka TAKAHASHI
  • Patent number: 12049690
    Abstract: There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.5% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, the total of the content of silicon and six times as much as the content of phosphorus being 1% by weight or more, the copper alloy plate having a crystal orientation wherein I{220}/I{420} in the range of from 2.5 to 8.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: July 30, 2024
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Kazuki Yoshida, Takanobu Sugimoto, Tomotsugu Aoyama, Hiroto Narieda
  • Publication number: 20240200169
    Abstract: There is provided a copper alloy sheet material, containing: 0.0005% by mass or more and 0.1% by mass or less of Ni, 0.0005% by mass or more and 0.1% by mass or less of Sn, 100 ppm or less of C, 800 ppm or less of O, 10 ppm or less of H, and 50 ppm or less of Ag, with a balance being Cu and impurities, wherein a total content of Ni and Sn is 0.001% by mass or more and 0.11% by mass or less, and when a content of the impurities is expressed as A to B (ppm) in consideration of a quantitative lower limit of each element (here, A is a total impurity content when a content of elements less than the quantitative lower limit is deemed 0 ppm, and B is a total impurity content when a content of the element less than the quantitative lower limit is deemed the quantitative lower limit of each element), A is 100 or less and B is 250 or less.
    Type: Application
    Filed: June 21, 2022
    Publication date: June 20, 2024
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Ryosuke MIYAHARA, Tomohiro KAWAKAMI, Yuta SASAI, Tomotsugu AOYAMA, Hiroto NARIEDA
  • Patent number: 11926917
    Abstract: There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: March 12, 2024
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Yukiya Kato, Hirotaka Kotani, Tatsuhiro Doi, Takao Tomiya, Hiroto Narieda
  • Patent number: 11920255
    Abstract: There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: March 5, 2024
    Assignee: Dowa Metaltech Co., Ltd.
    Inventors: Hirotaka Kotani, Yukiya Kato, Tatsuhiro Doi, Takao Tomiya, Hiroto Narieda
  • Patent number: 11876030
    Abstract: There are provided a clad material and a method for producing the same, the clad material being capable of preventing cracks from being formed and preventing the separation of layers thereof from being caused, even if it is punched by press-working (even if a high shearing force is applied thereto by thermal shock. After each of Mo—Cu layers 10, which has a metal film 10a of a metal selected from the group consisting of Co, Ti, Pd, Pt and Ni on at least one side thereof is arranged on a corresponding one of both sides of a Cu-graphite layer 12, which is obtained by sintering a graphite powder having a Cu film on the surface thereof, so as to allow the metal film 10a to contact the Cu-graphite layer 12, the layers are heated while a pressure is applied between the Cu-graphite layer 12 and the Mo—Cu layers 10.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: January 16, 2024
    Assignees: DOWA HOLDINGS CO., LTD., THE GOODSYSTEM CORPORATION
    Inventors: Tomotsugu Aoyama, Hiroto Narieda, Ilho Kim, Meoung whan Cho
  • Publication number: 20230175160
    Abstract: A composite material including a composite film formed on a base material, the composite film including a silver layer containing carbon particles, wherein a content of Sb in the composite film is 1 mass % or less, and a crystallite size of silver in the composite film is 40 nm or less.
    Type: Application
    Filed: April 21, 2021
    Publication date: June 8, 2023
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Yukiya KATO, Hirotaka TAKAHASHI, Tatsuhiro DOI, Hirotaka KOTANI, Takao TOMIYA, Hiroto NARIEDA
  • Patent number: 11591673
    Abstract: There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.0% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, wherein the total of the content of silicon and six times as much as the content of phosphorus is 1% by weight or more and wherein the copper alloy plate has a crystal orientation satisfying I{220}/I{420}?2.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: February 28, 2023
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Naota Higami, Takanobu Sugimoto, Kazuki Yoshida, Hiroto Narieda
  • Publication number: 20230046780
    Abstract: There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.
    Type: Application
    Filed: June 10, 2020
    Publication date: February 16, 2023
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Yukiya KATO, Hirotaka KOTANI, Tatsuhiro DOI, Takao TOMIYA, Hiroto NARIEDA
  • Publication number: 20220259753
    Abstract: There are provided a composite plated product wherein a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material and wherein the amount of the carbon particles dropped out of the composite plating film is small, and a method for producing the same. After a composite plating film of a composite material containing carbon particles in a silver layer is formed on a base material (of preferably copper or a copper alloy) by electroplating using a silver-plating solution to which the carbon particles are added, a treatment for removing part of the carbon particles on the surface thereof is carried out.
    Type: Application
    Filed: June 4, 2020
    Publication date: August 18, 2022
    Applicant: Dowa Metaltech Co., Ltd.
    Inventors: Hirotaka Kotani, Yukiya Kato, Tatsuhiro Doi, Takao Tomiya, Hiroto Narieda
  • Publication number: 20220162734
    Abstract: There are provided an inexpensive copper alloy plate having excellent bending workability, excellent stress corrosion cracking resistance and excellent stress relaxation resistance while maintaining the high strength thereof, and a method for producing the same. The copper alloy plate has a chemical composition which contains 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.5 to 2.5% by weight of silicon, 0.01 to 0.3% by weight of phosphorus and the balance being copper and unavoidable impurities, the total of the content of silicon and six times as much as the content of phosphorus being 1% by weight or more, the copper alloy plate having a crystal orientation wherein I{220}/I{420} in the range of from 2.5 to 8.0 assuming that the X-ray diffraction intensity on {220} crystal plane on the plate surface of the copper alloy plate is I{220} and that the X-ray diffraction intensity on {420} crystal plane thereon is I{420}.
    Type: Application
    Filed: January 30, 2020
    Publication date: May 26, 2022
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Kazuki Yoshida, Takanobu Sugimoto, Tomotsugu Aoyama, Hiroto Narieda
  • Patent number: 11293084
    Abstract: An inexpensive sheet material of a copper alloy has excellent bending workability and excellent stress corrosion cracking resistance while maintaining high strength. The sheet material is produced by a method including melting and casting raw materials of a copper alloy which has a chemical composition having 17 to 32 wt. % of zinc, 0.1 to 4.5 wt. % of tin, 0.01 to 2.0 wt. % of silicon, 0.01 to 5.0 wt. % of nickel, and the balance being copper and unavoidable impurities; hot-rolling the cast copper alloy at 900° C. to 400° C.; cooling the hot-rolled copper alloy at 1 to 15° C./min. from 400° C. to 300° C.; cold-rolling the cooled copper alloy; recrystallization-annealing the cold-rolled copper alloy at 300 to 800° C.; and then, ageing-annealing the recrystallization-annealed copper alloy at 300 to 600° C.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: April 5, 2022
    Assignee: Dowa Metaltech Co., Ltd.
    Inventors: Naota Higami, Takanobu Sugimoto, Tomotsugu Aoyama, Hiroto Narieda
  • Patent number: 11285701
    Abstract: A heat sink plate includes a first layer made of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: March 29, 2022
    Assignees: THEGOODSYSTEM CORP., DOWA METALTECH CO., LTD.
    Inventors: Meoung-whan Cho, Il-ho Kim, Seog-woo Lee, Young-suk Kim, Hiroto Narieda, Tomotsugu Aoyama
  • Patent number: 11225726
    Abstract: There are provided a composite plated product, which has little uneven appearance, a low contact resistance and good wear resistance, and a method for producing the same without the need of any silver-plating solutions containing cyanides and any silver-plating solutions containing silver nitrate as a silver salt. After carbon particles are caused to be suspended in water, an oxidizing agent is added thereto for carrying out a wet oxidation treatment of the carbon particles, and a silver-plating solution, which contains at least one sulfonic acid and the carbon particles treated by the wet oxidation treatment, is used for electroplating a base material to form a coating film of a composite material, which contains the carbon particles in a silver layer, on the base material to produce a composite plated product.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: January 18, 2022
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Tsuyoshi Ito, Yuta Sonoda, Yukiya Kato, Hiroto Narieda
  • Patent number: 11208730
    Abstract: There are provided a composite plated product, which has little uneven appearance and good wear resistance, and a method for producing the same without the need of any cyanide-containing silver-plating solutions and any silver-plating solutions containing silver nitrate as a silver salt. A sulfonic-acid-containing silver-plating solution, to which a carbon particle dispersing solution (preferably containing a silicate) is added, is used for electroplating a base material (preferably made of copper or a copper alloy) to form a composite plating film of a composite material, which contains the carbon particles in a silver layer, on the base material to produce a composite plated product.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: December 28, 2021
    Assignee: DOWA METALTECH CO., LTD.
    Inventors: Yuta Sonoda, Yukiya Kato, Hiroto Narieda
  • Patent number: 11078587
    Abstract: A tin-plated product contains: a substrate 10 of copper or a copper alloy; an underlying layer 12 of nickel which is formed on the surface of the substrate 10; and an outermost layer 14 containing tin, the outermost layer 14 being formed on the surface of the underlying layer 12, the outermost layer 14 being composed of a copper-tin alloy layer 14a of a large number of crystal grains of a copper-tin alloy, tin layers 14b of tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layers 14c of a copper-nickel-tin alloy, each of the tin layers 14b being formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layers 14c being arranged on the side of the underlying layer 12 in the copper-tin alloy layer 14a so as to be apart from each other.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: August 3, 2021
    Assignees: Dowa Metaltech Co., Ltd., Yazaki Corporation
    Inventors: Yuta Sonoda, Hiroto Narieda, Hideki Endo, Akira Sugawara, Hirotaka Kotani, Jyun Toyoizumi, Takaya Kondo, Yuya Kishibata
  • Publication number: 20210175147
    Abstract: There are provided a clad material and a method for producing the same, the clad material being capable of preventing cracks from being formed and preventing the separation of layers thereof from being caused, even if it is punched by press-working (even if a high shearing force is applied thereto by thermal shock. After each of Mo—Cu layers 10, which has a metal film 10a of a metal selected from the group consisting of Co, Ti, Pd, Pt and Ni on at least one side thereof is arranged on a corresponding one of both sides of a Cu-graphite layer 12, which is obtained by sintering a graphite powder having a Cu film on the surface thereof, so as to allow the metal film 10a to contact the Cu-graphite layer 12, the layers are heated while a pressure is applied between the Cu-graphite layer 12 and the Mo—Cu layers 10.
    Type: Application
    Filed: December 3, 2018
    Publication date: June 10, 2021
    Applicants: Dowa Holdings Co., Ltd., The Goodsystem Corporation
    Inventors: Tomotsugu Aoyama, Hiroto Narieda, Ilho Kim, Meoung whan Cho
  • Patent number: 10982345
    Abstract: After drying the surface of a tin plating layer having a thickness of 0.4 to 3 ?m which is formed on a base material of copper or a copper alloy by electroplating at a current density of 5 to 13 A/dm2 in a tin plating solution consisting of water, tin sulfate, sulfuric acid and a surfactant, the surface of the tin plating layer is heated to melt tin, and then, cooled to cause a layer of the tin plating layer on the side of the outermost surface to be a tin layer, which has a structure obtained by solidification after melting, while causing a layer of the tin plating layer between the tin layer and the base material to be a copper-tin alloy layer, to produce a tin-plated product wherein a tin layer, which has a structure obtained by solidification after melting, is formed on a copper-tin alloy layer formed on a base material of copper or a copper alloy and wherein the tin-plated product has a glossiness of 0.3 to 0.7.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: April 20, 2021
    Assignees: Dowa Metaltech Co., Ltd., Yazaki Corporation
    Inventors: Hirotaka Kotani, Hiroto Narieda, Akira Sugawara, Yuta Sonoda, Yoshitaka Ito