Abstract: An inspection apparatus and an inspection method capable of performing an inspection more accurately are provided. An inspection apparatus according to the present invention includes a light source 10 that illuminates a sample 30 in which a pattern is formed, a detector 11 that detects light reflected from the sample 30 illuminated by the light source, and a processing device 50 that performs an inspection based on a correlation between a brightness value of a sample image obtained by the detector and a size in a surface shape or a size in a width direction of the pattern of the sample 30. The processing device 50 performs the inspection based on a summation value obtained by adding up brightness values of sample images with weights, the sample images being obtained under a plurality of shooting conditions.

Abstract: Provided is a phase shift amount measuring apparatus and method capable of measuring a phase shift amount and a transmittance of a phase shift mask in one measurement step by using a miniaturized monitor pattern. The phase shift amount and transmittance of the monitor pattern are simultaneously measured using a shearing interferometer. The phase shift amount is obtained from a phase difference of interference light between light passing through the monitor pattern and light passing through a non-pattern area. The transmittance of the monitor pattern is obtained using an amplitude of interference light between light passing through the monitor pattern and light passing through the non-pattern area and an amplitude of interference light between light beams passing through the non-pattern area. The use of common interference images in measuring the phase shift amount and transmittance enables measurement of both the phase shift amount and the transmittance in one measurement operation.

Abstract: Provided is a phase shift amount measuring apparatus and method capable of measuring a phase shift amount and a transmittance of a phase shift mask in one measurement step by using a miniaturized monitor pattern. The phase shift amount and transmittance of the monitor pattern are simultaneously measured using a shearing interferometer. The phase shift amount is obtained from a phase difference of interference light between light passing through the monitor pattern and light passing through a non-pattern area. The transmittance of the monitor pattern is obtained using an amplitude of interference light between light passing through the monitor pattern and light passing through the non-pattern area and an amplitude of interference light between light beams passing through the non-pattern area. The use of common interference images in measuring the phase shift amount and transmittance enables measurement of both the phase shift amount and the transmittance in one measurement operation.

Abstract: An inspection apparatus and an inspection method capable of performing an inspection more accurately are provided. An inspection apparatus according to the present invention includes a light source 10 that illuminates a sample 30 in which a pattern is formed, a detector 11 that detects light reflected from the sample 30 illuminated by the light source, and a processing device 50 that performs an inspection based on a correlation between a brightness value of a sample image obtained by the detector and a size in a surface shape or a size in a width direction of the pattern of the sample 30. The processing device 50 performs the inspection based on a summation value obtained by adding up brightness values of sample images with weights, the sample images being obtained under a plurality of shooting conditions.

Abstract: An optical module has a support board, an optical transmission path, and at least a single optical element having a light receiving function or a light emitting function provided on the support board. A light emission surface of the optical transmission path or a light incidence surface of the optical transmission path is arranged such that the optical element and the optical transmission path are optically coupled to each other, with respect to a light receiving surface or a light emitting surface of the optical element. The optical element is sealed by a sealing agent. A gap is provided between the optical transmission path and the surface of the sealing agent on the light receiving surface or the light emitting surface of the optical element.

Abstract: An integrally molding die for manufacturing a package includes a supporting portion for supporting at least one end including an incident/exit port of a light signal in a light transmission path, and a lead frame for mounting an optical element. The integrally molding die includes a recess for forming the supporting portion, a first projection, which comes into contact with an optical element mounting surface of the lead frame, and a second projection, which comes into contact with a back surface of the optical element mounting surface.

Abstract: An optical module (1) including a light receiving/emitting element (3) for transmitting or receiving an optical signal, an optical waveguide (2) having a core part made of a material with translucency and a clad part made of a material having an index of refraction different from an index of refraction of the core part for optically coupling with the light receiving/emitting element (3) and transmitting the optical signal, and a package (5) for accommodating at least one end including an entrance/exit port (2c) of the optical signal in the optical waveguide (2) and the light receiving/emitting element (3); wherein a surface on a side facing a bottom plate mounted with the light receiving/emitting element (3) in the package (5) at the end of the optical waveguide (2) accommodated in the package (5) is configured by a first region including a portion projected into a space inside the package (5), and a second region different from the first region; and the package (5) includes a supporting part (5a) for support

Abstract: An optical transmission module has a light-emitting element, a light-receiving element, and an optical path for optically coupling the light-emitting element and the light-receiving element, and transmitting a optical signal. The optical path has a core part, a clad part surrounding the core part, and a support board for supporting the optical path itself and the light-receiving element. A resin part formed of resin having a refractive index higher than air outside the optical path is arranged at a part of a surface area of the clad part along an optical transmission direction to which optical signals are transmitted. The resin part has an inclined surface in which the surface on the opposite side of the clad part is tilted relative to the optical transmission direction. The inclined surface forms an acute angle with the surface of the clad part at the opposite side of the light-receiving element in the resin part.

Abstract: An integrally molding die for manufacturing a package includes a supporting portion for supporting at least one end including an incident/exit port of a light signal in a light transmission path, and a lead frame for mounting an optical element. The integrally molding die includes a recess for forming the supporting portion, a first projection, which comes into contact with an optical element mounting surface of the lead frame, and a second projection, which comes into contact with a back surface of the optical element mounting surface.

Abstract: An optical cable module has an optical waveguide formed by surrounding a core with a clad layer and a light-receiving/emitting element, installed on a supporting substrate. A light-releasing face of the optical waveguide or a light-incident face to the optical waveguide is aligned so as to face a light-receiving face or a light-emitting face of the light-receiving/emitting element. The optical waveguide is formed into a film shape having flexibility, and provided with a reinforcing member that prevents a deflection from occurring in the optical waveguide. The optical waveguide is placed on a protruding portion from a supporting face of the optical waveguide on the supporting substrate.

Abstract: An optical module comprising has a support board, an optical transmission path, and at least a single optical element having a light receiving function or a light emitting function provided on the support board. A light emission surface of said optical transmission path or a light incidence surface of the optical transmission path is arranged such that said optical element and said optical transmission path are optically coupled to each other, with respect to a light receiving surface or a light emitting surface of said optical element. Said optical element is sealed by a sealing agent. A gap is provided between said optical transmission path and the surface of said sealing agent on the light receiving surface or the light emitting surface of said optical element.

Abstract: An optical module (1) including a light receiving/emitting element (3) for transmitting or receiving an optical signal, an optical waveguide (2) having a core part made of a material with translucency and a clad part made of a material having an index of refraction different from an index of refraction of the core part for optically coupling with the light receiving/emitting element (3) and transmitting the optical signal, and a package (5) for accommodating at least one end including an entrance/exit port (2c) of the optical signal in the optical waveguide (2) and the light receiving/emitting element (3); wherein a surface on a side facing a bottom plate mounted with the light receiving/emitting element (3) in the package (5) at the end of the optical waveguide (2) accommodated in the package (5) is configured by a first region including a portion projected into a space inside the package (5), and a second region different from the first region; and the package (5) includes a supporting part (5a) for support

Abstract: An optical cable module has an optical waveguide formed by surrounding a core with a clad layer and a light-receiving/emitting element, installed on a supporting substrate. A light-releasing face of the optical waveguide or a light-incident face to the optical waveguide is aligned so as to face a light-receiving face or a light-emitting face of the light-receiving/emitting element. The optical waveguide is formed into a film shape having flexibility, and provided with a reinforcing member that prevents a deflection from occurring in the optical waveguide. The optical waveguide is placed on a protruding portion from a supporting face of the optical waveguide on the supporting substrate.

Abstract: An optical waveguide device includes a first substrate, where the first substrate includes a first plate and an optical waveguide region disposed on the first plate, and where the optical waveguide region includes a core for transmitting light and a cladding surrounding the core. The optical waveguide device further includes a second substrate, where the second substrate includes a second plate having a spacer. Additionally, a surface including the optical waveguide region of the first substrate opposes a surface including the spacer of the second substrate, the spacer is formed the region which is out of the core of the first substrate, a top surface of the spacer is in contact with the first substrate, the first substrate and the second substrate are bound with adhesive material, and the entire surface of the core is in contact with the adhesive material.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.