Abstract: Provided is a resin molding material having a remarkably excellent abrasion resistance while maintaining a favorable mechanical strength. The resin molding material is improved in deterioration of the abrasion resistance caused by an abrasive powder generated from an inorganic substance, particularly from a glass fiber or the like. The resin molding material contains a resin, a carbon substance and an inorganic substance. The carbon substance contains an adhesive carbon substance.

Abstract: Provided is a resin molding material having a remarkably excellent abrasion resistance while maintaining a favorable mechanical strength. The resin molding material is improved in deterioration of the abrasion resistance caused by an abrasive powder generated from an inorganic substance, particularly from a glass fiber or the like. The resin molding material contains a resin, a carbon substance and an inorganic substance. The carbon substance contains an adhesive carbon substance.

Abstract: A resin pulley is provided in which, in particular, abrasion resistance in a dusty atmosphere and thermal shock resistance are superior and belt attacking property is suppressed. A resin composition including 35 to 55 mass % of a phenolic resin as a base resin, 1 mass % or more of an acrylonitrile butadiene rubber, 10 to 25 mass % of an inorganic fiber and 3 to 15 mass % of an inorganic powder, and further comprising a polyester acrylate, and a resin pulley formed with the use of the resin composition.

Abstract: A resin pulley according to the present invention is obtained by molding a resin composition containing a phenol resin serving as a base resin, 15 to 50% by weight of an inorganic powder having a Mohs hardness of not less than 6.5, 20 to 40% by weight of a reinforcing fiber, and 1 to 5% by weight of a lubricant and thermosetting the phenol resin, and is superior in dimensional stability and strength, is also superior in wear resistance particularly in a dust atmosphere or the like, and is superior in practicality as an alternate to a metal pulley.

Abstract: A resin pulley according to the present invention is obtained by molding a resin composition containing a phenol resin serving as a base resin, 15 to 50% by weight of an inorganic powder having a Moths hardness of not less than 6.5, 20 to 40% by weight of a reinforcing fiber, and 1 to 5% by weight of a lubricant and thermosetting the phenol resin, and is superior in dimensional stability and strength, is also superior in wear resistance particularly in a dust atmosphere or the like, and is superior in practicality as an alternate to a metal pulley.

Abstract: By forming an isolated semiconductor layer or electrode layer on a semiconductor surface between neighboring field effect transistors and element separating trenches which are deep enough to reach at least the semi-insulating substrate or the hetero junction interface on the buffer layer, low frequency oscillation of a compound semiconductor integrated circuit can be reduced. By controlling the thickness of the buffer layer having a hetero junction to at most 150 nm, the low frequency oscillation can be reduced. By forming materials separating adjacent elements with a width of at most 2 .mu.m which reach from the element region surface to the buffer layer having hetero junction so as to enclose the element regions and etched regions in the neighborhood of the elements or so as to enclose the element regions in the etched regions and by controlling the angle of the sides of the etched regions against the semiconductor layer surface to 10.degree. to 60.degree., wires can be prevented from short-circuiting.