Patents by Inventor Hiroto Ohata

Hiroto Ohata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of production of semiconductor device
    Patent number: 6223429
    Abstract: To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material.
    Type: Grant
    Filed: July 30, 1998
    Date of Patent: May 1, 2001
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Aizou Kaneda, Masaaki Yasuda, Itsuo Watanabe, Tomohisa Ohta, Fumio Inoue, Yoshiaki Tsubomatsu, Toshio Yamazaki, Hiroto Ohata, Kenzo Takemura, Akira Nagai, Osamu Watanabe, Naoyuki Shiozawa, Kazuyoshi Kojima, Toshiaki Tanaka, Kazunori Yamamoto