Patents by Inventor Hiroto Ootake

Hiroto Ootake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayered wiring structure, and method for manufacturing multilayered wiring
    Patent number: 7999391
    Abstract: Provided is a wiring of the Damascene structure for preventing the TDDB withstand voltage degradation and for keeping the planarity to prevent the degradation of a focus margin. A trench wiring (213) is formed in an interlayer insulating film, which is composed of a silicon carbide-nitride film (205), a SiOCH film (206) and a silicon oxide film (207) [(e)]. The silicon oxide film (207) is etched at a portion adjacent to the wiring of a polished surface by dry etching or wet etching [(f)]. A silicon carbide-nitride film (SiCN) (214) is formed as a Cu cap film [(g)]. An interlayer insulating film is further formed thereon to form a conductive plug, a trench wiring and so on.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: August 16, 2011
    Assignee: NEC Corporation
    Inventors: Hiroto Ootake, Masayoshi Tagami, Munehiro Tada, Yoshihiro Hayashi
  • MULTILAYERED WIRING STRUCTURE, AND METHOD FOR MANUFACTURING MULTILAYERED WIRING
    Publication number: 20100219533
    Abstract: Provided is a wiring of the Damascene structure for preventing the TDDB withstand voltage degradation and for keeping the planarity to prevent the degradation of a focus margin. A trench wiring (213) is formed in an interlayer insulating film, which is composed of a silicon carbide-nitride film (205), a SiOCH film (206) and a silicon oxide film (207) [(e)]. The silicon oxide film (207) is etched at a portion adjacent to the wiring of a polished surface by dry etching or wet etching [(f)]. A silicon carbide-nitride film (SiCN) (214) is formed as a Cu cap film [(g)]. An interlayer insulating film is further formed thereon to form a conductive plug, a trench wiring and so on.
    Type: Application
    Filed: February 6, 2007
    Publication date: September 2, 2010
    Applicant: NEC Corporation
    Inventors: Hiroto Ootake, Masayoshi Tagami, Munehiro Tada, Yoshihiro Hayashi