Abstract: A bonding apparatus such as a die bonding apparatus in which a bonding tool at one end of an ultrasonic horn is given a vibration, the bonding apparatus being equipped with a Y-direction driver which has a Y-direction piezo-electric element that causes the bonding tool to vibrate in a Y-direction which is parallel to an axis of the ultrasonic horn, and an X-direction driver which has an X-direction piezo-electric element that causes the bonding tool to vibrate in an X direction which is on a plane perpendicular to the Y-direction, so that the piezo-electric elements are driven during bonding so that the bonding tool vibrates in the X- and Y-directions on the bonding plane.