Abstract: A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is formed on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material, in which, when a viscoelastic characteristic is measured after curing the ultraviolet curable adhesive resin material by irradiating with an ultraviolet ray, a storage elastic modulus at 5° C. E? (5° C.) is 2.0×106 to 2.0×109 Pa, and a storage elastic modulus 100° C. E? (100° C.) is 1.0×106 to 3.0×107 Pa.

Abstract: A back grinding adhesive film used to protect a surface of a wafer. This adhesive film includes a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. The ultraviolet curable adhesive resin material has a loss tangent tan ? at ?5° C. of 0.25 to 0.85.

Abstract: A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. Here, regarding the ultraviolet curable adhesive resin material, when a storage elastic modulus at ?15° C. is defined as E? (?15° C.) and a storage elastic modulus at 100° C. is defined as E? (100° C.) in a case where a viscoelastic characteristic is measured, E? (100° C.) is 1.0×106 to 3.5×107 Pa, and E?) (100° C./E? (?15° C.) is 2.0×10?3 to 1.5×10?2.

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer. The adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material. The adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray has a storage elastic modulus at 5° C. of 2.0×106 to 2.0×109 Pa, and a storage elastic modulus at 100° C. of 1.0×106 to 3.0×107 Pa.

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. This adhesive film includes a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. In the step (C), regarding the adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray, a storage elastic modulus at 100° C. is 2.0×10?3 to 1.5×10?2.

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. The adhesive film includes a base material layer, and an ultraviolet curable adhesive resin layer provided on one surface side of the base material layer using an ultraviolet curable adhesive resin material. In addition, a loss tangent tan ? at ?5° C. of a cured film of the ultraviolet curable adhesive resin material is 0.25 to 0.85.

Abstract: A method for manufacturing an electronic device includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer. The adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material. The ultraviolet curable adhesive resin material has a storage elastic modulus at 5° C. E? (5° C.) after curing of 2.0×106 to 2.0×109 Pa, and a storage elastic modulus at 100° C. E? (100° C.) of 1.0×106 to 3.0×107 Pa.

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer, in which the adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material, provided on one surface side of the base material layer, regarding the ultraviolet curable adhesive resin material, a storage elastic modulus (100° C.) at 100° C. is 1.0×106 to 3.5×107 Pa, and E? (100° C.)/E? (?15° C.) is 2.0×10?3 to 1.5×10?2.

Abstract: A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. The adhesive film includes a base material layer, and an ultraviolet curable adhesive resin layer provided on one surface side of the base material layer using an ultraviolet curable adhesive resin material. In addition, in the step (C), a loss tangent tan ? at ?5° C. of the adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray, is 0.25 to 0.85.

Abstract: A wireless power transfer system includes a power transmission device and a power reception device. The power transmission device includes a power transmission circuit and a power transmission coil. The power reception device includes a power reception circuit and a power reception coil. The power reception device is arranged relative to the power transmission device such that the power reception coil electromagnetically couples with the power transmission coil. The power transmission circuit and the power reception circuit each set a power exclusive-use period and a signal insertion period. The power exclusive-use period is set as a main part of a repetition cycle of power transmission and reception, during which an interrupt signal for power transmission authentication is not used. The signal insertion period is set as a localized part of the repetition cycle of power transmission and reception, during which the interrupt signal for power transmission authentication is inserted.

Abstract: Provided is an optical system including, in order from an object side to an image side, a front lens unit, an aperture stop, and a rear lens unit. The front lens unit consists of a positive lens and a diffractive optical element, which are arranged in order from the object side to the image side. The diffractive optical element consists of a plurality of lenses that are cemented to each other, and at least one of cemented surfaces of the plurality of lenses is a diffractive surface. An interval on an optical axis between the positive lens and the diffractive optical element is the largest among intervals on the optical axis between two lenses that are adjacent in the optical system.

Abstract: Provided is an optical system including a front unit, an aperture stop and a rear unit which are arranged in order from an object side to an image side. The front unit includes a diffractive optical element, at least one first refractive optical element having a power in the same sign as a sign of a power at a diffractive surface of the diffractive optical element, and at least one second refractive optical element having a power in a different sign from the sign of the power at the diffractive surface. A partial dispersion ratio between a d-line and a C-line and a partial dispersion ratio between a g-line and the d-line of the at least one first refractive optical element and the at least one second refractive optical element are appropriately set.

Abstract: Provided is an optical system including, in order from an object side to an image side, a front lens unit, an aperture stop, and a rear lens unit. The front lens unit consists of a positive lens and a diffractive optical element, which are arranged in order from the object side to the image side. The diffractive optical element consists of a plurality of lenses that are cemented to each other, and at least one of cemented surfaces of the plurality of lenses is a diffractive surface. An interval on an optical axis between the positive lens and the diffractive optical element is the largest among intervals on the optical axis between two lenses that are adjacent in the optical system.

Abstract: An optical system includes a diffractive surface and at least one aspherical surface, an aspherical surface of at least one aspherical surface closest to the diffractive surface is referred to as a first aspherical surface, a phase function ?(r) and an aspherical function X(r) of the first aspherical surface increase with different signs from each other in a height direction with increasing a distance from an optical axis, and a condition below is satisfied: - 0.10 ? ? i = 1 p ? ( Ci ? ( f / Fno ) 2 ? i - 1 ) / ? j = 1 q ? ( Aj ? ( f / Fno ) 2 ? j + 1 ) ? - 0.01 where f is a focal length of the optical system when focusing on an infinite object, and Fno is an F number of the optical system.

Abstract: Provided is an optical system including a front unit, an aperture stop and a rear unit which are arranged in order from an object side to an image side. The front unit includes a diffractive optical element, at least one first refractive optical element having a power in the same sign as a sign of a power at a diffractive surface of the diffractive optical element, and at least one second refractive optical element having a power in a different sign from the sign of the power at the diffractive surface. A partial dispersion ratio between a d-line and a C-line and a partial dispersion ratio between a g-line and the d-line of the at least one first refractive optical element and the at least one second refractive optical element are appropriately set.

Abstract: An optical system includes a diffractive surface and at least one aspherical surface, an aspherical surface of at least one aspherical surface closest to the diffractive surface is referred to as a first aspherical surface, a phase function ?(r) and an aspherical function X(r) of the first aspherical surface increase with different signs from each other in a height direction with increasing a distance from an optical axis, and a condition below is satisfied: - 0.10 ? ? i = 1 p ? ( Ci ? ( f / Fno ) 2 ? i - 1 ) / ? j = 1 q ? ( Aj ? ( f / Fno ) 2 ? j + 1 ) ? - 0.01 where f is a focal length of the optical system when focusing on an infinite object, and Fno is an F number of the optical system.

Abstract: It is an object of the present invention to provide adhesive compositions having excellent flexibility, rubber elasticity, mechanical properties, heat resistance and low-temperature properties. An adhesive composition of the invention includes 10 to 70 parts by weight of a soft polypropylene resin composition (X) which includes 40 to 98 wt % of a propylene copolymer (A) satisfying the following requirements (A1) to (A8) and 2 to 60 wt % of a crystalline isotactic polypropylene (B) satisfying the following requirements (B1) to (B3), and 30 to 90 parts by weight of a tackifier (C) (wherein the total of the component (X) and the component (C) is 100 parts by weight), wherein (A1) Shore A hardness: 20 to 90; (A2) the copolymer comprises a copolymer with C3 units at 51 to 90 mol %, C2 units at 7 to 24 mol % and C4-20 ?-olefin units at 3 to 25 mol %; (A3) Mw/Mn: 1.2 to 3.5; (A4) mm: 85 to 99.9%; (A5) value B: 0.8 to 1.3; (A6) 2,1-insertion ratio: less than 1%; (A7) Tg: ?10° C. to ?50° C.; (A8) MFR (230° C.): 0.

Abstract: The optical system includes, in order from an object side, a front lens unit LF, an aperture stop S, a rear lens unit LR. The front lens unit includes a diffraction optical element Ldoe. A stop side positive lens Lsp disposed closest to the aperture stop among the rear lens unit satisfies 1.55?Ndsp?1.70, 30.0??dsp?50.0, and 5.0×10?4???dCsp?5.0×10?3. Ndsp and ?dsp repectively represent a refractive index and an Abbe number of the stop side positive lens for a d-line, and ??dCsp is represents a value defined by ??dCsp=?dCsp?(?0.17041×?gdsp+0.513577) where Ngsp, NCsp and NFsp respectively represent refractive indices of the stop side positive lens for a g-line, a C-line and an F-line. ?dCsp and ?gdsp are respectively defined by ?dCsp=(Ndsp?NCsp)/(NFsp?NCsp) and ?gdsp=(Ngsp?Ndsp)/(NFsp?NCsp).

Abstract: The optical system includes, in order from an object side, a front lens unit LF, an aperture stop S, a rear lens unit LR. The front lens unit includes a diffraction optical element Ldoe. A stop side positive lens Lsp disposed closest to the aperture stop among the rear lens unit satisfies 1.55?Ndsp?1.70, 30.0??dsp?50.0, and 5.0×10?4???dCsp?5.0×10?3. Ndsp and ?dsp repectively represent a refractive index and an Abbe number of the stop side positive lens for a d-line, and ??dCsp is represents a value defined by ??dCsp=?dCsp?(?0.17041×?gdsp+0.513577) where Ngsp, NCsp and NFsp respectively represent refractive indices of the stop side positive lens for a g-line, a C-line and an F-line. ?dCsp and ?gdsp are respectively defined by ?dCsp=(Ndsp?NCsp)/(NFsp?NCsp) and ?gdsp=(Ngsp?Ndsp)/(NFsp?NCsp).

Abstract: Provided is an adhesive resin composition having improved heat resistance without deteriorations in adhesive strength and flexibility. The adhesive resin composition comprises 30 to 98 wt % of an ethylene/vinyl acetate copolymer (a) and 70 to 2 wt % of a propylene resin composition (P), wherein the total of the component (a) and the component (P) is 100 wt %. The propylene resin composition (P) comprises 60 to 0 wt % of a propylene polymer (b) having a melting point of 120 to 170° C. and a melt flow rate of 0.1 to 500 g/10 min, and 40 to 100 wt % of a propylene polymer (c) having a melting point of less than 120° C. or showing no melting points and having a melt flow rate of 0.1 to 500 g/10 min, wherein the total of the component (b) and the component (c) is 100 wt %.