Patents by Inventor Hiroto Yoshinuma

Hiroto Yoshinuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layer printed-wiring board process for producing
    Patent number: 6378199
    Abstract: A multi-layer printed-wiring board including a substrate having a plurality of wiring pattern layers sequentially transferred thereon, each wiring pattern layer containing an electrically conductive layer and an electrically insulating layer. The wiring pattern layers are attached to the substrate through an electrically insulating layer.
    Type: Grant
    Filed: December 22, 1998
    Date of Patent: April 30, 2002
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Hiroto Yoshinuma, Kenzaburo Kawai, Shinichi Kobayashi