Patents by Inventor Hirotomo Yanagisawa

Hirotomo Yanagisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having recess with varying width and method of manufacturing the same
    Patent number: 8350392
    Abstract: A semiconductor device includes a semiconductor chip, and an encapsulation resin which covers and encapsulates the semiconductor chip, the semiconductor chip having a recess formed in the surficial portion thereof; the recess having, on the deeper side than a predetermined portion thereof, a portion having a larger width than the predetermined portion has; and the encapsulation resin being anchored in the recess.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: January 8, 2013
    Assignee: Renesas Electronics Corporation
    Inventors: Hirotomo Yanagisawa, Kinya Otani
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20100181688
    Abstract: A semiconductor device includes a semiconductor chip, and an encapsulation resin which covers and encapsulates the semiconductor chip, the semiconductor chip having a recess formed in the surficial portion thereof; the recess having, on the deeper side than a predetermined portion thereof, a portion having a larger width than the predetermined portion has; and the encapsulation resin being anchored in the recess.
    Type: Application
    Filed: January 19, 2010
    Publication date: July 22, 2010
    Inventors: Hirotomo Yanagisawa, Kinya Otani