Abstract: A gate driver includes: driver boards mountable on an IGBT module which is a driving-target external device; gate driver circuits which are formed on the driver boards and each apply a drive signal generated using power and a signal which are externally input through an input connector, to semiconductor elements of the IGBT module; and an insulating surrounding member disposed to surround a peripheral edge of the input-side driver board.

Abstract: A thermal analysis model includes an intermediate node that imitates an intermediate portion and a first thermal resistance connecting to the intermediate node, and imitates the terminal portions on both sides. A terminal portion inside node connected to the first thermal resistance is configured to imitate an inside area adjacent to the intermediate portion and serves as a starting point of a first heat dissipation path to the substrate. A terminal outside node is configured to imitate an outside area separated from the intermediate portion and adjacent to the inside area in the terminal portions and serves as a starting point of a second heat dissipation path to the substrate. A second thermal resistance connects the terminal portion inside node and the terminal portion outside node and is arranged parallel to a different element imitating a thermal resistance of an electrode layer in a surface of the substrate.

Abstract: A gate driver includes: driver boards mountable on an IGBT module which is a driving-target external device; gate driver circuits which are formed on the driver boards and each apply a drive signal generated using power and a signal which are externally input through an input connector, to semiconductor elements of the IGBT module; and an insulating surrounding member disposed to surround a peripheral edge of the input-side driver board.