Abstract: Provided as toners for developing electrostatically charged images capable of preventing a sticking and curling phenomenon even with an increase in number of printed sheets and processes for producing the same, with the use of a cyclic polyolefinic resin, are a toner for developing electrostatically charged images contains a cyclic polyolefinic resin and a polar resin wherein 10 to 50 parts by weight of the polar resin is present in relation to 100 parts by weight of the cyclic polyolefinic resin, and a process for producing a toner for developing electrostatically charged images comprises a step of melt-kneading at least a cyclic polyolefinic resin and a coloring agent to obtain a kneaded product, a step of grinding the kneaded product to obtain colored particles, and a step of melt-kneading, grinding and classifying the colored particles and a polar resin to obtain the toner.

Abstract: A device for measuring electrostatic charge amount of toner is provided. The device comprises a hollow toner suction port for sucking the toner from a toner substrate and a means for measuring electrostatic charge amount of the sucked toner. The toner suction port forms a hermetically sealed space with the toner substrate.

Abstract: A solid electrolyte type carbon dioxide gas sensor element has a solid electrolyte layer, a work electrode layer formed on one side of the solid electrolyte layer and containing an electron conducting material and an auxiliary electrode material, and a reference electrode layer formed on the same side or the other side of the solid electrolyte layer and containing an electron conducting material. The work electrode layer further contains a rare earth metal oxide or at least part of the auxiliary electrode material of the work electrode layer is a rare metal oxide carbonate.

Abstract: There is proposed an electrolytic solution having a low specific resistance, a high sparking voltage and a stable sparking property. This electrolytic solution contains a quaternary ammonium salt of cyanic acid, at least one phosphorus compound selected from an organic phosphorus acid compound, phosphoric acid and salts thereof, water and an organic solvent.

Abstract: An epoxy resin composition for sealing, and a resin-sealed type semiconductor device in which this composition is used, of outstanding heat cycle resistance, humidity resistance and laser marking characteristics, can be obtained by using a combination of an organic phosphine compound and a metal complex dye. The epoxy resin composition, characterized in that it consists of epoxy resin, a curing agent having at least 2 phenolic hydroxyl groups per molecule, an organic phosphine compound and a metal complex dye; and to a resin-sealed type semiconductor device characterized in that it is sealed with this composition.

Abstract: A resin encapsulation type semiconductor device having a semiconductor element and a resinous encapsulating material for encapsulating said semiconductor element therein, said resinous encapsulating material comprising a cured product of an epoxy resin composition for encapsulation of semiconductor, comprising:(a) 100 parts by weight of an epoxy resin;(b) 5 to 500 parts by weight of a curing agent having at least two phenolic hydroxyl groups in one molecule;(c) 0.01 to 20 parts by weight of an organic phosphine compound; and(d) 0.1 to 100 parts by weight of at least one antimony oxide selected from the group consisting of diantimony tetroxide, hexaantimony tridecaoxide and diantimony pentoxide high reliability in terms of thermal cycle resistance, humidity resistance and the like.

Abstract: There is disclosed a highly reliable resin encapsulation type semiconductor device excellent humidity resistance as well as high temperature electric characteristics. The specific feature consists in the epoxy resin composition employed for encapsulation. This composition comprises a novolac type epoxy resin, a novolac type phenol resin, an organic phosphine compound and an organic phosphorus acid compound.The resin encapsulation type semiconductor device is markedly small in leak current under hot an humid conditions and has a prolonged life due to difficult deterioration through corrosion of electrodes and aluminum wiring, as compared with those of prior art.

Abstract: There is presented a highly reliable resin encapsulation type semiconductor device excellent in humidity resistance as well as high temperature electrical characteristics. The specific feature consists in the epoxy resin composition employed for encapsulation. This composition comprises an epoxy resin, a novolac resin as curing agent and an organic tertiary phosphine compound as curing accelerator. The resin encapsulation type semiconductor device is markedly small in leak current under hot and humid conditions and has a prolonged life due to difficult deterioration through corrosion of electrodes and aluminum wiring, as compared with those of prior art.

Abstract: A semiconductor device sealed in a resin composition, wherein the resin composition contains the prescribed percentages of inorganic fillers having extremely small amounts of impurities, epoxy resin having an epoxy equivalent of 250 or less and a softening point of 120.degree. C. or less, hardening agent, hardening promoter and low melting paraffins.