Abstract: A circuit assembly that includes an inductor including a core; a fixation member to which the inductor is fixed; a base that is attached to the core, wherein: the fixation member is made of a first material having a coefficient of thermal expansion larger than a coefficient of thermal expansion of the core, and the base is made of a second material having a coefficient of thermal expansion larger than the coefficient of thermal expansion of the core and smaller than the coefficient of thermal expansion of the fixation member; and an adhesive layer that is disposed between the base and the fixation member, and that bonds the base and the fixation member together.

Abstract: A circuit assembly where the circuit board includes a first surface and a second surface that is opposite to the first surface and on which a plurality of bus bars are routed, the inductor includes a main body and a terminal that is led out from the main body and has a shape that is bent toward the circuit board, and a leading end of the terminal is connected through a screwing member to a bus bar of the plurality of bus bars exposed from an opening provided on the circuit board, the screwing member is held in an insulating holder housed in a housing recess provided in the heat dissipation plate, and the heat dissipation plate is overlaid so as to transfer heat on the circuit board on the second surface of the circuit board.

Abstract: A circuit assembly includes a circuit board on which a coil is mounted, a heat sink, and a heat spreading plate that is separate from this heat sink. A first insulating adhesive layer is interposed between the circuit board and the heat spreading plate, and the heat spreading plate and the heat sink are fixed by a first fixing hole for a heat sink and a bolt. Accordingly, warping of the circuit board is suppressed.

Abstract: A vehicle-mounted power distribution board includes: a circuit structure including a control circuit board including a conductive path on at least one of a front surface and a back surface, and a plurality of bus bars that is placed on the control circuit board, and that is composed of a plurality of bus bars; and a plurality of electronic components that are mounted to the circuit structure. Some of the plurality of electronic components are semiconductor elements that generate heat when current flows through it, and the other components are low heat resistant electrolytic capacitors and integrated circuits that are influenced by heat transferred from the semiconductor elements. Bus bar non-arrangement regions in which no bus bar is disposed are formed in the circuit structure, and the low heat resistant electrolytic capacitors and the integrated circuits are disposed in the bus bar non-arrangement regions.

Abstract: A circuit assembly that includes an inductor including a core; a fixation member to which the inductor is fixed; a base that is attached to the core, wherein: the fixation member is made of a first material having a coefficient of thermal expansion larger than a coefficient of thermal expansion of the core, and the base is made of a second material having a coefficient of thermal expansion larger than the coefficient of thermal expansion of the core and smaller than the coefficient of thermal expansion of the fixation member; and an adhesive layer that is disposed between the base and the fixation member, and that bonds the base and the fixation member together.

Abstract: An electrical junction box that includes a circuit board on which a coil element is installed; a partition wall that surrounds the coil element and separates an installation region on the circuit board on which the coil element is installed from a region around the installation region; a frame that is formed in one piece with the partition wall and surrounds the circuit board; a heat dissipation plate on which the circuit board and the frame are placed; and a cover that covers the circuit board from the frame side, wherein the coil element is fixed to the partition wall using a synthetic resin material, and wherein the frame and the heat dissipation plate are positioned relative to each other through a recess-projection engagement, and the cover is fixed to the heat dissipation plate using screws.

Abstract: A circuit assembly where the circuit board includes a first surface and a second surface that is opposite to the first surface and on which a plurality of bus bars are routed, the inductor includes a main body and a terminal that is led out from the main body and has a shape that is bent toward the circuit board, and a leading end of the terminal is connected through a screwing member to a bus bar of the plurality of bus bars exposed from an opening provided on the circuit board, the screwing member is held in an insulating holder housed in a housing recess provided in the heat dissipation plate, and the heat dissipation plate is overlaid so as to transfer heat on the circuit board on the second surface of the circuit board.

Abstract: An electrical junction box that includes a circuit board on which a coil element is installed; a partition wall that surrounds the coil element and separates an installation region on the circuit board on which the coil element is installed from a region around the installation region; a frame that is formed in one piece with the partition wall and surrounds the circuit board; a heat dissipation plate on which the circuit board and the frame are placed; and a cover that covers the circuit board from the frame side, wherein the coil element is fixed to the partition wall using a synthetic resin material, and wherein the frame and the heat dissipation plate are positioned relative to each other through a recess-projection engagement, and the cover is fixed to the heat dissipation plate using screws.

Abstract: A circuit assembly includes a circuit board on which a coil is mounted, a heat sink, and a heat spreading plate that is separate from this heat sink. A first insulating adhesive layer is interposed between the circuit board and the heat spreading plate, and the heat spreading plate and the heat sink are fixed by a first fixing hole for a heat sink and a bolt. Accordingly, warping of the circuit board is suppressed.

Abstract: Provided is an electrical junction box including: a circuit board that has a mounting surface on which an electronic component is mounted; and a frame in which the circuit board is accommodated. The frame is provided with a board covering portion that covers a part of the electronic component on the mounting surface side, and the board covering portion is provided with a retaining portion that retains the electronic component. Furthermore, it is also possible to provide an outer case that covers the board covering portion from a side opposite to the side on which the circuit board is arranged while overlapping the board covering portion.

Abstract: A vehicle-mounted power distribution board includes: a circuit structure including a control circuit board including a conductive path on at least one of a front surface and a back surface, and a plurality of bus bars that is placed on the control circuit board, and that is composed of a plurality of bus bars; and a plurality of electronic components that are mounted to the circuit structure. Some of the plurality of electronic components are semiconductor elements that generate heat when current flows through it, and the other components are low heat resistant electrolytic capacitors and integrated circuits that are influenced by heat transferred from the semiconductor elements. Bus bar non-arrangement regions in which no bus bar is disposed are formed in the circuit structure, and the low heat resistant electrolytic capacitors and the integrated circuits are disposed in the bus bar non-arrangement regions.

Abstract: A printing mechanism 1 including a mandrel 2, and a tubular sleeve 3; wherein the mandrel comprises a main body and sleeve support members 6, a plurality of the sleeve-support members being arranged on the main body at intervals in the axial direction; and wherein the sleeve-support member has a plurality of arm portions 7 extending radially so as to support the sleeve from an inside thereof, and moving mechanisms 8 for moving tip vicinities of the arm portions inward/outward in the radial direction; and wherein the sleeve-support member has an interlock mechanism 9 for synchronously driving each moving mechanism of the sleeve support members, the tip vicinities of the arm portions being engaged with the inner surface of the sleeve or released from the engaged inner surface of the sleeve by the synchronous motion of the tip vicinities of all arm portions inward/outward with the interlock mechanism.

Abstract: A photosensitive resin composition is provide which includes a compound for generating an acid by light irradiation and at least one polyimide precursor selected from the group consisting of a silicon-containing polyimide precursor (a) obtained from A mol of a tetracarboxylic dianhydride or its derivative formed by adding 2 mols or less of a monovalent saturated alcohol to 1 mol of the tetracarboxylic dianhydride, B mol of a diamine and C mol of an aminosilicon compound represented by the formula (1) H2N—R1—SiR23−kXk  (1) {wherein R1 is —(CH2)s—, (wherein s is an integer of from 1 to 4); R2 is independently an alkyl group having 1 to 6 carbon atoms, a phenyl group or a phenyl group substituted by an alkyl group having 7 to 12 carbon atoms; X is a hydrolytic alkoxy group; and k is 1≦k≦3} in a ratio meeting the following formulae (2) and (3) 1 ≦ C

Abstract: A photosensitive resin composition containing 0.5 to 15 parts by weight of a compound generating an acid by light irradiation in 100 parts by weight of a polyamic acid amide having an alkoxysilane having a specified structure at its terminals are provided,which composition has superior resolution properties, a small shrinkage of volume, a superior adhesion onto a substrate, and can prepare a polyimide by baking.

Abstract: The present invention provides a silicon-containing polyamic acid derivative which is represented by the formula (VI) ##STR1## and which has a logarithmic viscosity number of 0.1 to 5.0 dl/g at 30.degree. C. in N-methyl-2-pyrrolidone, said silicon-containing polyamic acid derivative being obtained by reacting A mol of a tetracarboxylic acid derivative, B mol of a diamine, and C mol of an aminosilicon compound so as to meet the relations of the equations (IV) and (V): ##EQU1## A photosensitive resin composition using this silicon-containing polyamic acid derivative can be easily manufactured, permits the formation of a negative type sharp relief pattern, can inhibit film reduction at the time of curing by baking, and is excellent in adhesive properties to substrates, heat stability and shelf stability.

Abstract: A photosensitive polyimide precursor composition of the present invention comprises a polyimide precursor represented by the formula (6)(OR.sup.5).sub.k R.sup.4.sub.3-k Si--R.sup.3 --X--Z (6)and having a logarithmic viscosity number of 0.1 to 5.0 dl/g measured in N-methyl-2-pyrrolidone at 30.degree. C. and a compound capable of generating an acid by light irradiation, said polyimide precursor being obtained by reacting A mol of a tetracarboxylic dianhydride, B mol of a diamine, and C mol of an aminosilane so as to meet the relations of the equations: ##EQU1## This composition not only has practical photosensitivity but also inhibits the reduction of film thickness due to curing and development, and it is also excellent in shelf stability in varnish and adhesive properties to a substrate such as a silicon wafer or the like.

Abstract: A method of preparing a negative type pattern of a polyimide film is provided which includes applying to a substrate a sufficient amount of a photosensitive polymer composition to form a negative type pattern, the photosensitive polymer composition comprising a mixture of a poly(amido)imide precursor containing a repeating unit represented by the following formula (I), at least one kind of quinonediazide compound and an organic solvent: ##STR1## R.sup.1 is a trivalent or a tetravalent carbocyclic aromatic group or heterocyclic group; R.sup.2 is an aliphatic group having at least two carbon atoms, an alicyclic group, an aromatic aliphatic group, a carbocyclic aromatic group, a heterocyclic group or a polysiloxane group; X is --O-- or NR.sup.5 --, where R.sup.5 is a hydrogen atom or a monovalent organic group having 10 or less carbon atoms; R.sup.3 is a divalent organic group; R.sup.

Abstract: A photosensitive cover coating agent forming an insulating, protective coating having superior compatibility, sensitivity, heat resistance, adhesion, electrical properties and flexibility is provided,which coating agent is obtained by mixing a polymer (A) of repetition units of the formula ##STR1## wherein R.sup.1 is ##STR2## R.sup.2 is a divalent organic group, a compound (B) containing two or more (meth)acryloyl groups in one molecule,a compound (C) of the formula ##STR3## wherein Z is a divalent aliphatic or alicyclic group, R.sup.3 is H, monovalent organic group or characteristic group and R.sup.4 is H or --Z--R.sup.3, in 0.01 to 0.80 mol equivalent based on compound (B), the total quantity of (B) and (C) being 20 to 200 wt. parts per 100 wt. parts of (A), anda photopolymerization initiator or a sensitizing agent (D), in 0.5 to 20 wt. parts per 100 wt. parts of (A).

Abstract: A photosensitive polymer containing a repeating unit represented by the following formula (I) and having a logarithmic viscosity number of from 0.1 to 5 dl/g as measured in a solvent at a temperature of 30.+-.0.01.degree. C. at a concentration of 0.5 g/dl: ##STR1## (wherein R.sup.1 is a trivalent or tetravalent carbocyclic aromatic group or heterocyclic group, R.sup.2 is an aliphatic group having at least two carbon atoms, an alicyclic group, an aromatic aliphatic group, a carbocyclic aromatic group, a heterocyclic group or a polysiloxane group, R.sup.3 is a divalent organic group, R.sup.4 is ##STR2## a hydrogen atom or a monovalent organic group, R.sup.5 is a hydrogen atom or a monovalent organic group, m is independently 1 or 2, n is independently 0 or 1, and m and n meet 1.ltoreq.m+n.ltoreq.2); a method for preparing the above-mentioned photosensitive polymer; a photosensitive polymer composition containing the above-mentioned photosensitive polymer; and a method for preparing a poly(amide)imide film.

Abstract: A photosensitive polymer containing a repeating unit represented by the following formula (I) and having a logarithmic viscosity number of from 0.1 to 5 dl/g as measured in a solvent at a temperature of 30.degree..+-.0.01.degree. C. at a concentration of 0.5 g/dl: ##STR1## (wherein R.sup.1 is a trivalent or tetravalent carbocyclic aromatic group or heterocyclic group, R.sup.2 is an aliphatic group having at least two carbon atoms, an alicyclic group, an aromatic aliphatic group, a carbocyclic aromatic group, a heterocyclic group or a polysiloxane group, R.sup.3 is a divalent organic group, R.sup.4 is ##STR2## a hydrogen atom or a monovalent organic group, R.sup.5 is a hydrogen atom or a monovalent organic group, m is independently 1 or 2, n is independently 0 or 1, and m and n meet 1.ltoreq.m+n.ltoreq.