Patents by Inventor Hirotoshi Oda

Hirotoshi Oda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat radiation packaging structure for an electric part and packaging method thereof
    Patent number: 6493228
    Abstract: A heat radiation packaging structure without getting a board itself larger, but with an excellent heat radiation ability and a low cost is provided. A bus bar 12 is fixed onto a wiring board 11, a connecting lead 15A of a relay 15 etc. being joined onto the bus bar 12, and the wiring board 11, the bus bar 12 and the relay 15 etc. are sealed all together with a heat conduction resin 23. Additionally, the bus bar 12 comprises a thermal diffusion portion 17 which is bent via a bent portion 12B and is apart from the wiring board 11. By means of such a structure, a heat radiation ability is enhanced and the heat radiation packaging structure for an electric part is realized at low cost without getting a board itself larger.
    Type: Grant
    Filed: November 6, 2000
    Date of Patent: December 10, 2002
    Assignee: Yazaki Corporation
    Inventors: Masataka Suzuki, Hirotoshi Oda, Hisafumi Maruo, Hiroyuki Ashiya, Yasutaka Nagaoka, Yayoi Maki