Patents by Inventor Hirotoshi Oota

Hirotoshi Oota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation assembly and method for producing the same
    Patent number: 7196413
    Abstract: A heat dissipation assembly in which a heat generator and a heat dissipator are integrated via an electrically insulating and thermally conductive sheet, at least one surface of which a thermally conductive grease is applied to, in which the thermally conductive grease is incompatible with the electrically insulating and thermally conductive sheet. Heat from the heat generator such as a semiconductor device or the like can be effectively dissipated while an electrically insulating condition is maintained over a long period of time.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: March 27, 2007
    Assignees: Nissan Motor Co., Ltd., Fuji Polymer Industries Co., Ltd., Dow Corning Toray Co., Ltd.
    Inventors: Akihiro Shibuya, Motoyuki Furukawa, Mikio Naruse, Atsushi Ehira, Kazuhiro Ogawa, Hirotoshi Oota, Kazuyoshi Abe, Atsushi Ikezawa, Toru Kakehi
  • Insulation sheet and apparatus utilizing the same
    Patent number: 7081670
    Abstract: An insulation sheet is formed by a heat conductive filler of an amount of 70–93 mass % in an organopolysiloxane base material. The content of conductive impurities in the insulation sheet is 500 ppm or less. The insulation sheet according to one embodiment is interposed between a semiconductor device and a heat sink.
    Type: Grant
    Filed: August 10, 2004
    Date of Patent: July 25, 2006
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Akihiro Shibuya, Motoyuki Furukawa, Mikio Naruse, Atsushi Ehira, Kazuhiro Ogawa, Hirotoshi Oota, Kazuyoshi Abe
  • Heat dissipation assembly and method for producing the same
    Publication number: 20050205989
    Abstract: A heat dissipation assembly in which a heat generator and a heat dissipator are integrated via an electrically insulating and thermally conductive sheet, at least one surface of which a thermally conductive grease is applied to, in which the thermally conductive grease is incompatible with the electrically insulating and thermally conductive sheet. Heat from the heat generator such as a semiconductor device or the like can be effectively dissipated while an electrically insulating condition is maintained over a long period of time.
    Type: Application
    Filed: March 1, 2005
    Publication date: September 22, 2005
    Inventors: Akihiro Shibuya, Motoyuki Furukawa, Mikio Naruse, Atsushi Ehira, Kazuhiro Ogawa, Hirotoshi Oota, Kazuyoshi Abe, Atsushi Ikezawa, Toru Kakehi
  • Insulation sheet and apparatus utilizing the same
    Publication number: 20050035438
    Abstract: An insulation sheet is formed by a heat conductive filler of an amount of 70-93 mass % in an organopolysiloxane base material. The content of conductive impurities in the insulation sheet is 500 ppm or less. The insulation sheet according to one embodiment is interposed between a semiconductor device and a heat sink.
    Type: Application
    Filed: August 10, 2004
    Publication date: February 17, 2005
    Inventors: Akihiro Shibuya, Motoyuki Furukawa, Mikio Naruse, Atsushi Ehira, Kazuhiro Ogawa, Hirotoshi Oota, Kazuyoshi Abe