Patents by Inventor Hirotsugu Iwasaki

Hirotsugu Iwasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12128482
    Abstract: A diamond joined body is a diamond joined body including a hard substrate and a polycrystalline diamond layer arranged on the hard substrate, wherein an area ratio of carbon grains in a region of the hard substrate is less than 0.03%, the region being a region enclosed by an interface between the hard substrate and the polycrystalline diamond layer and an imaginary line x in a cross section parallel to a normal direction of the interface, the imaginary line x being parallel to the interface on the hard substrate side and having a distance of 500 ?m from the interface.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: October 29, 2024
    Assignee: SUMITOMO ELECTRIC HARDMETAL CORP.
    Inventors: Hirotsugu Iwasaki, Jinning Li, Tadashi Yamaguchi, Shinichiro Yurugi
  • Patent number: 11975392
    Abstract: A cutting tool includes: a base metal provided with a seat portion; a blade edge member that is a polycrystalline diamond sintered material containing polycrystalline diamond and a binder; and a brazing material that fixes the blade edge member to the seat portion of the base metal. The blade edge member has a thickness of greater than or equal to 0.3 mm. The brazing material is disposed between a blade edge bottom face of the blade edge member and a seat bottom face of the seat portion and is in contact with the blade edge bottom face and the seat bottom face. The flank face is located outside of the base metal with respect to the lateral face of the base metal.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: May 7, 2024
    Assignee: SUMITOMO ELECTRIC HARDMETAL CORP.
    Inventors: Hideki Tomimoto, Hirotsugu Iwasaki, Satoru Kukino, Takashi Harada, Naoki Watanobe, Mayuka Segawa
  • Publication number: 20240091862
    Abstract: A sintered material includes diamond grains and a binder. A boron concentration in the diamond grains is more than or equal to 0.001 mass % and less than or equal to 0.9 mass %. A boron concentration in the binder is more than or equal to 0.5 mass % and less than or equal to 40 mass %.
    Type: Application
    Filed: November 29, 2021
    Publication date: March 21, 2024
    Applicant: SUMITOMO ELECTRIC HARDMETAL CORP.
    Inventors: Hirotsugu IWASAKI, Akihiko UEDA, Satoru KUKINO
  • Publication number: 20240001453
    Abstract: A cutting tool includes a rake face, a flank face, and a cutting edge ridge line connecting the rake face and the flank face. A portion of the rake face and a portion of the flank face adjacent to the cutting edge ridge line are made of a diamond sintered body including diamond grains. A dislocation density in the portion of the flank face is 8×1015/m2 or less. The diamond grains have an average grain size of 0.1 ?m to 50 ?m. A content ratio of the diamond grains in the diamond sintered body is 80% by volume to 99% by volume.
    Type: Application
    Filed: November 29, 2021
    Publication date: January 4, 2024
    Applicant: SUMITOMO ELECTRIC HARDMETAL CORP.
    Inventors: Hirotsugu IWASAKI, Akihiko UEDA, Naoki WATANOBE, Takashi HARADA, Satoru KUKINO
  • Publication number: 20230383387
    Abstract: A diamond sintered material includes diamond grains, wherein a content ratio of the diamond grains is more than or equal to 80 volume % and less than or equal to 99 volume % with respect to the diamond sintered material, an average grain size of the diamond grains is more than or equal to 0.1 ?m and less than or equal to 50 ?m, and a dislocation density of the diamond grains is more than or equal to 8.1×1013 m?2 and less than 1.0×1016 m?2.
    Type: Application
    Filed: October 5, 2021
    Publication date: November 30, 2023
    Applicants: SUMITOMO ELECTRIC HARDMETAL CORP., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hirotsugu IWASAKI, Akihiko UEDA, Michiko MATSUKAWA, Satoru KUKINO, Kei HIRAI
  • Publication number: 20230203624
    Abstract: A diamond sintered material includes diamond grains, wherein a content ratio of the diamond grains is more than or equal to 80 volume % and less than or equal to 99 volume % with respect to the diamond sintered material, an average grain size of the diamond grains is more than or equal to 0.1 ?m and less than or equal to 50 ?m, and a dislocation density of the diamond grains is more than or equal to 1.2×1016 m?2 and less than or equal to 5.4×1019 m?2.
    Type: Application
    Filed: October 22, 2020
    Publication date: June 29, 2023
    Inventors: Hirotsugu IWASAKI, Akihiko UEDA, Michiko MATSUKAWA, Satoru KUKINO
  • Publication number: 20230191500
    Abstract: A cutting tool includes: a base metal provided with a seat portion; a blade edge member that is a polycrystalline diamond sintered material containing polycrystalline diamond and a binder; and a brazing material that fixes the blade edge member to the seat portion of the base metal. The blade edge member has a thickness of greater than or equal to 0.3 mm. The brazing material is disposed between a blade edge bottom face of the blade edge member and the a seat bottom face of the seat portion and is in contact with the blade edge bottom face and the seat bottom face. The flank face is located outside of the base metal with respect to the lateral face of the base metal.
    Type: Application
    Filed: December 22, 2020
    Publication date: June 22, 2023
    Inventors: Hideki TOMIMOTO, Hirotsugu IWASAKI, Satoru KUKINO, Takashi HARADA, Naoki WATANOBE, Mayuka SEGAWA
  • Publication number: 20210237164
    Abstract: A diamond joined body is a diamond joined body including a hard substrate and a polycrystalline diamond layer arranged on the hard substrate, wherein an area ratio of carbon grains in a region of the hard substrate is less than 0.03%, the region being a region enclosed by an interface between the hard substrate and the polycrystalline diamond layer and an imaginary line x in a cross section parallel to a normal direction of the interface, the imaginary line x being parallel to the interface on the hard substrate side and having a distance of 500 ?m from the interface.
    Type: Application
    Filed: March 27, 2019
    Publication date: August 5, 2021
    Inventors: Hirotsugu IWASAKI, Jinning LI, Tadashi YAMAGUCHI, Shinichiro YURUGI
  • Patent number: 4278442
    Abstract: A method for reducing the caking property of coal, by contacting coal with sulfur dioxide in an amount at least 0.5 times the amount of the coal on a weight basis, at a temperature of at least 120.degree. C. under a pressure of at least 10 Kg/cm.sup.2, and separating the treated coal from the sulfur dioxide, whereby to reduce the caking property of the coal and to render the coal more easily pulverizable.
    Type: Grant
    Filed: November 29, 1979
    Date of Patent: July 14, 1981
    Inventors: Minoru Matsuda, Hirotsugu Iwasaki, Yasukatsu Tamai, Masashi Iino, Hiroshi Fukutome