Abstract: The present invention relates to a method for producing a thin film substrate for forming a thin film circuit pattern on a substrate by repeating the lithography process using a photoresist and provides a method for producing a thin film having a high yield by preventing accumulation of faults at the time of thin film forming with high reliability and executing the inspection and repair process efficiently using the characteristics of the condition of generated faults. The method is constructed so as to inspect a resist pattern without exposure to light before etching the base layer in the inspection process of the lithography process using a photoresist, to particularly repair a lacking-fault part among detected fault parts, to execute inspection for an etching remnant in the thin metal film inspection and repair process after the etching ends, and to remove and repair etching remnants, if any.