Abstract: A resin molded product is provided which exhibits a higher level of electrical conductivity and particularly a lower level of surface resistance than those generally expected from the content of an electrically conductive filler. The resin molded product comprises a matrix of a resin material and an electrically conductive filler dispersed in the matrix, wherein a content of the electrically conductive filler is lower than 20 wt %, and the resin molded product has been subjected to a voltage application process employing a voltage of not lower than 20 kV and lower than a dielectric breakdown voltage of the matrix. The electrically conductive filler is, for example, a fibrous filler such as a fibrous carbon filler or a fibrous graphite filler, and has an average fiber diameter of, for example, 0.002 to 15 ?m. The resin molded product typically contains a coloring material dispersed in the matrix together with the electrically conductive filler, and exhibits a color corresponding to the coloring material.

Abstract: A resin molded product is provided which exhibits a higher level of electrical conductivity and particularly a lower level of surface resistance than those generally expected from the content of an electrically conductive filler. The resin molded product comprises a matrix of a resin material and an electrically conductive filler dispersed in the matrix, wherein a content of the electrically conductive filler is lower than 20 wt %, and the resin molded product has been subjected to a voltage application process employing a voltage of not lower than 20 kV and lower than a dielectric breakdown voltage of the matrix. The electrically conductive filler is, for example, a fibrous filler such as a fibrous carbon filler or a fibrous graphite filler, and has an average fiber diameter of, for example, 0.002 to 15 ?m. The resin molded product typically contains a coloring material dispersed in the matrix together with the electrically conductive filler, and exhibits a color corresponding to the coloring material.

Abstract: This invention provides: (1) a hinder composition for friction materials, characterized in that it comprises a thermosetting resin and a specific organic silicon compound having phenyl groups, and (2) a friction material having as a binder composition shown in the above item (1). When used for manufacturing friction materials in the brakes and clutches for various kinds of vehicles such as automobiles, it can remarkably improve the facing and abrasion resistances of the friction material.

Abstract: An adhesive made from a thermosetting resin composition consisting of (a) a condensed polycyclic aromatic compound, (b) an aromatic crosslinking agent and (c) an acid catalyst is applied to each surface of adherends treated with a particular surface treating agent and heated at a temperature of 100.degree.-400.degree. C. in an oxidizing or non-oxidizing atmosphere to produce an adhesion structure. In order to provide a conductive adhesion structure, a conductive promotion catalyst is included in the adhesive. Further, a carbonaceous or graphitic adhesion structure is obtained by carbonization or graphitization of the adhesion structure.

Abstract: An adhesive made from a thermosetting resin composition consisting of (a) a condensed polycyclic aromatic compound, (b) an aromatic crosslinking agent and (c) an acid catalyst is applied to each surface of adherends treated with a particular surface treating agent and heated at a temperature of 100.degree.-400.degree. C. in an oxidizing or non-oxidizing atmosphere to produce an adhesion structure. In order to provide a conductive adhesion structure, a conductive promotion catalyst is included in the adhesive. Further, a carbonaceous or graphitic adhesion structure is obtained by carbonization or graphitization of the adhesion structure.