Abstract: An image pickup unit is disposed so as to be able to obtain a scan projection image of an inspection subject from each of a vertical direction and a horizontal direction. An X-ray absorption coefficient of an object in the inspection subject is obtained from the vertical scan projection image and the horizontal scan projection image. It is determined whether there is a threat in the inspection subject on the basis of the X-ray absorption coefficient. Furthermore, a CT image is obtained by moving the image pickup unit around the inspection subject. It is determined whether there is a threat in the inspection subject, on the basis of the CT values of the CT image.

Abstract: In order to provide a high-speed, inexpensive inspection system that has a short development period, that is flexible, and that allow algorithms to be easily changed, a PC equipped with an image input feature is used to capture an image detected by a line image sensor, this detected image is transferred to a plurality of PCs connected by a LAN, and defects are detected using software processing on the plurality of PCs.

Abstract: An image pickup unit is disposed so as to be able to obtain a scan projection image of an inspection subject from each of a vertical direction and a horizontal direction. An X-ray absorption coefficient of an object in the inspection subject is obtained from the vertical scan projection image and the horizontal scan projection image. It is determined whether there is a threat in the inspection subject on the basis of the X-ray absorption coefficient. Furthermore, a CT image is obtained by moving the image pickup unit around the inspection subject. It is determined whether there is a threat in the inspection subject, on the basis of the CT values of the CT image.

Abstract: In an electron particle machine for observing, inspecting, processing or analyzing a semiconductor wafer as a substrate or a sample, a light source is installed in a preparation chamber. A chucking stage for chucking the semiconductor wafer with a chuck using static electricity is provided with parts for connecting to earth such that they are in contact with the chucked semiconductor wafer. After the chuck using static electricity is released after observation, inspection, process or analysis, a surface of the semiconductor wafer and the parts for connecting to earth are irradiated with light from the light source. This provides conductivity to the surface of the semiconductor wafer, so that charge accumulated on the semiconductor wafer is removed from the surface through the parts for connecting to earth.

Abstract: A three-dimensional shaped defect inspecting method including a three-dimensional shape detection region selecting step for detecting a two-dimensional picture signal by taking a two-dimensional optical picture fluorescence emitted from a detection object and selecting a three-dimensional shape detection region in respect of the detection object based on the detected two-dimensional picture signal, and a three-dimensional shape determining step for detecting a picture signal by taking an optical picture in accordance with a height by reflected light from the detection object and sampling height information with a desired two-dimensional pixel size in respect of the selected three-dimensional shape inspection region with respect to the detected picture signal, thereby calculating and determining a three-dimensional shape, whereby a defect caused by a deficiency in thickness or the like on a wiring pattern of a solid shape, formed on a detection object of a circuit board or the like, can be detected in a short

Abstract: In a micro focus X-ray imaging system using a transmission type target, a transmitted X-ray image is uniformly bright. The micro focus X-ray imaging system is structured so that (i) the fine focussed electron beam 1 is irradiated to a target in which a tungsten film 10 is deposited thinly on a beryllium foil 11, (ii) the tungsten film 10 is cooled by a circular thermoelectric cooling device 14, and (iii) an X-ray image intensifier 22 is installed other than on the prolonged line in a travel direction of the electron beam 1 and the transmitted X-ray image of a sample 7 is detected by the X-ray image intensifier 22 and the CCD camera 24.

Abstract: This invention relates to an X-ray tomography apparatus and a method therefor.

Abstract: A pattern detection apparatus based on a scanning transmission electron microscope having an electron gun for generating and accelerating an electron beam, a plurality of convergent lenses for converging the electron beam, a deflection circuit for deflecting the electron beam so that it scans an object to be inspected, such as an X-ray mask, a detection circuit which receives electrons that have been dispersed and transmitted in the object and converts the detected electrons into an electrical signal, and an image forming circuit which forms a detected image of the object under test in response to the detected signal from the detection circuit and in synchronism with the deflection signal applied to the deflection circuit.

Abstract: A method for inspecting the filled state of a plurality of via-holes which pass through a non-conductive circuit board and are filled with a conductive substance and an apparatus for carrying out the method are disclosed.The surface of the circuit board is illuminated in two directions to generate shadows depending on the concave or convex state of the fillers in a plurality of via-holes. An optical image of the illuminated surface of the circuit board is detected. Each edge of the two shadow areas, which exist in the detected optical image and are generated in one via-hole by light irradiation in two directions, is detected. Whether the filler in this one via-hole is in the concave state or convex state is identified according to the mutual position relationship of the detected edges. The length of each shadow area is detected, and whether the concave state or convex state of the filler is within a predetermined allowance is decided according to the detection results.

Abstract: An auto-focusing electron microscope used for the observation, measurement and/or checking of a circuit pattern or the like comprises an objective lens capable of changing a focal position of an electron beam, an optical system for projecting a light and shade pattern having a light-permeable portion and a light-shielding portion onto the surface of a specimen through the objective lens, and a detector for detecting the projected pattern while optically reflecting it, whereby focusing can be made while reducing any damage and/or charging of the specimen.

Abstract: In accordance with the present invention, there is provided a pattern defect detecting apparatus using a scanning and transmission electron microscope, comprising an electron gun for accelerating an electron beam with high energy enough to transmit it through a sample and for radiating the accelerated electron beam, a condenser lens for focusing the electron beam generated by said electron gun, a beam deflection coil for deflecting the electron beam focused by said condenser lens, an objective lens for further focusing the electron beam deflected by said beam deflection coil onto a fixed spot, an XY stage for disposing the sample so as to be opposed to said objective lens, said XY stage being movable in X and Y directions in a step and repeat manner, a sample chamber for housing the XY stage in vacuum, said sample chamber including at least the outlet of the electron beam of said objective lens, an electron beam detector for detecting electron beams transmitted through said sample, said electron beam detector