Patents by Inventor Hiroya Okumura

Hiroya Okumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7604755
    Abstract: An electroconductive plate is prepared by molding an electroconductive resin composition comprising an electroconductive agent and a radical-polymerizable thermosetting resin system having an acid value in a specific range by a resin molding method. The electroconductive agent may be a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin and a radical-polymerizable diluent. The double bond equivalent of the radical-polymerizable resin is preferably about 200 to 1000. The glass transition temperature of the hardened product is preferably not lower than 120° C. The proportion (weight ratio) of the electroconductive agent relative to the radical-polymerizable thermosetting resin system [the former/the latter] is about 55/45 to 95/5.
    Type: Grant
    Filed: February 13, 2004
    Date of Patent: October 20, 2009
    Assignee: Japan Composite Co., Ltd.
    Inventors: Hiroya Okumura, Keizo Kimura, Shinji Tachibana, Takeshi Kusagaya
  • Publication number: 20060240303
    Abstract: An electroconductive plate is prepared by molding an electroconductive resin composition comprising an electroconductive agent and a radical-polymerizable thermosetting resin system having an acid value in a specific range by a resin molding method. The electroconductive agent may be a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin and a radical-polymerizable diluent. The double bond equivalent of the radical-polymerizable resin is preferably about 200 to 1000. The glass transition temperature of the hardened product is preferably not lower than 120° C. The proportion (weight ratio) of the electroconductive agent relative to the radical-polymerizable thermosetting resin system [the former/the latter] is about 55/45 to 95/5.
    Type: Application
    Filed: February 13, 2004
    Publication date: October 26, 2006
    Applicant: JAPAN COMPOSITE CO., LTD.
    Inventors: Hiroya Okumura, Keizo Kimura, Shinji Tachibana, Takeshi Kusagaya
  • Patent number: 7125623
    Abstract: A separator for solid polymer-type fuel cell is produced by molding the resin composition which comprises an electroconductive agent and a radical-polymerizable thermosetting resin system by a resin molding method. The electroconductive agent comprises a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin (especially, a vinyl ester-series resin) and a radical-polymerizable diluent. It is preferred that the double bond equivalent of the radical-polymerizable resin may about 200 to 1,000 and that the hardened radical-polymerizable thermosetting resin system has a glass transition temperature of 120° C. or more. The weight ratio of the electroconductive agent to the radical-polymerizable thermosetting resin system may be about 55/45 to 95/5. Such a separator is suitable for fuel cell (in particular, solid polymer-type fuel cell), and can be produced with advantageous for commercial production.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: October 24, 2006
    Assignee: Japan Composite Co., Ltd.
    Inventors: Hiroya Okumura, Takashi Shibata
  • Patent number: 6815053
    Abstract: A low thermal expansion laminated plate which has excellent heat resistance, water resistance and toughness and whose average linear expansion coefficient within the temperature ranging from 40 to 150° C. is not higher than 20×10−6/° C. can be obtained by laminating and curing fiber-reinforced layers impregnated with a resin composition consisting of a radically polymerizable resin, radically polymerizable monomer and inorganic filler combined with a specific amount of a thermoplastic resin.
    Type: Grant
    Filed: January 2, 2003
    Date of Patent: November 9, 2004
    Assignees: Japan Composite Co., Ltd., Matsushita Electric Works, Ltd.
    Inventors: Tomoko Inoue, Hiroya Okumura, Isao Hirata, Shigehiro Okada
  • Publication number: 20040096680
    Abstract: A low thermal expansion laminated plate which has excellent heat resistance, water resistance and toughness and whose average linear expansion coefficient within the temperature ranging from 40 to 150° C. is not higher than 20×10−6/° C. can be obtained by laminating and curing fiber-reinforced layers impregnated with a resin composition consisting of a radically polymerizable resin, radically polymerizable monomer and inorganic filler combined with a specific amount of a thermoplastic resin.
    Type: Application
    Filed: January 2, 2003
    Publication date: May 20, 2004
    Inventors: Tomoko Inoue, Hiroya Okumura, Isao Hirata, Shigehiro Okada
  • Publication number: 20020055030
    Abstract: A separator for solid polymer-type fuel cell is produced by molding the resin composition which comprises an electroconductive agent and a radical-polymerizable thermosetting resin system by a resin molding method. The electroconductive agent comprises a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin (especially, a vinyl ester-series resin) and a radical-polymerizable diluent. It is preferred that the double bond equivalent of the radical-polymerizable resin may about 200 to 1,000 and that the hardened radical-polymerizable thermosetting resin system has a glass transition temperature of 120° C. or more. The weight ratio of the electroconductive agent to the radical-polymerizable thermosetting resin system may be about 55/45 to 95/5. Such a separator is suitable for fuel cell (in particular, solid polymer-type fuel cell), and can be produced with advantageous for commercial production.
    Type: Application
    Filed: September 12, 2001
    Publication date: May 9, 2002
    Inventors: Hiroya Okumura, Takashi Shibata
  • Patent number: 5886205
    Abstract: A process for producing silicon-containing isocyanate compounds of the general formula II, comprising thermally induced decomposition of a silicon-containing carbamic ester of the general formula I at a pH of not higher than 8 in the presence of a catalyst of at least one metal or its compound.General Formula I: ##STR1## General Formula II: ##STR2## wherein R.sup.1 to R.sup.6 and R.sup.8 each represent a hydrocarbon group, R.sup.7 represents an alkylene group having 1 to 8 carbon atoms, n, m and l represent an integer of 0 to 3 and m+n+l=3, and a, b and c represent integers of 0 to 3, 0 to 2, and 0 to 8, respectively.
    Type: Grant
    Filed: April 10, 1997
    Date of Patent: March 23, 1999
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Takashi Uchida, Hiroya Okumura, Takashi Shibata, Masaaki Sasaki
  • Patent number: 5854313
    Abstract: Fine particles of high heat resistant polymer obtained by emulsion polymerization or seeded polymerization of at least one epoxy ester (C) having two or more unsaturated bonds in one molecule and at least one reactive monomer (D) having at least one unsaturated double bond in one molecule, in the absence of a water-insoluble inorganic material as a dispersion stabilizer, the epoxy ester (C) being obtained by adding at least one unsaturated monobasic acid (B) to at least one epoxide (A-1) having at least one glycidyl group and one monocyclic hydrocarbon group in one molecule, and/or at least one epoxide (A-2) having at least one cycloaliphatic epoxy group in one molecule. The fine polymer particles have excellent heat resistance and solvent resistance, and an aqueous or alcoholic dispersion of such fine polymer particles is produced therefrom.
    Type: Grant
    Filed: April 21, 1997
    Date of Patent: December 29, 1998
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Yoshimasa Omori, Hiroya Okumura, Takashi Shibata
  • Patent number: 5756600
    Abstract: A composition useful as a sheet or bulk molding compound comprises a urethane-modified vinyl ester resin (A), or acid-addition vinyl ester resn (A') obtained by reacting the hydroxyl groups in (A) with a polybasic acid anhydride (B), and a double bond(s)-containing monomer (C), wherein (A) is prepared by reacting a vinyl ester resin (F) derived from the reaction of an epoxy resin (D) and an unsaturated monobasic acid (E), with a polyisocyanate (H) and, optionally, a hydroxyl group(s)-containing (meth)acrylate (G) in an isocyanate:hydroxyl groups equivalent ratio of from 0.01-1.2:1.
    Type: Grant
    Filed: August 9, 1996
    Date of Patent: May 26, 1998
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Hiroya Okumura, Toshiaki Uchida, Koichi Akiyama, Kenichi Morita, Takashi Shibata