Patents by Inventor Hiroya Okumura
Hiroya Okumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7604755Abstract: An electroconductive plate is prepared by molding an electroconductive resin composition comprising an electroconductive agent and a radical-polymerizable thermosetting resin system having an acid value in a specific range by a resin molding method. The electroconductive agent may be a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin and a radical-polymerizable diluent. The double bond equivalent of the radical-polymerizable resin is preferably about 200 to 1000. The glass transition temperature of the hardened product is preferably not lower than 120° C. The proportion (weight ratio) of the electroconductive agent relative to the radical-polymerizable thermosetting resin system [the former/the latter] is about 55/45 to 95/5.Type: GrantFiled: February 13, 2004Date of Patent: October 20, 2009Assignee: Japan Composite Co., Ltd.Inventors: Hiroya Okumura, Keizo Kimura, Shinji Tachibana, Takeshi Kusagaya
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Publication number: 20060240303Abstract: An electroconductive plate is prepared by molding an electroconductive resin composition comprising an electroconductive agent and a radical-polymerizable thermosetting resin system having an acid value in a specific range by a resin molding method. The electroconductive agent may be a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin and a radical-polymerizable diluent. The double bond equivalent of the radical-polymerizable resin is preferably about 200 to 1000. The glass transition temperature of the hardened product is preferably not lower than 120° C. The proportion (weight ratio) of the electroconductive agent relative to the radical-polymerizable thermosetting resin system [the former/the latter] is about 55/45 to 95/5.Type: ApplicationFiled: February 13, 2004Publication date: October 26, 2006Applicant: JAPAN COMPOSITE CO., LTD.Inventors: Hiroya Okumura, Keizo Kimura, Shinji Tachibana, Takeshi Kusagaya
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Patent number: 7125623Abstract: A separator for solid polymer-type fuel cell is produced by molding the resin composition which comprises an electroconductive agent and a radical-polymerizable thermosetting resin system by a resin molding method. The electroconductive agent comprises a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin (especially, a vinyl ester-series resin) and a radical-polymerizable diluent. It is preferred that the double bond equivalent of the radical-polymerizable resin may about 200 to 1,000 and that the hardened radical-polymerizable thermosetting resin system has a glass transition temperature of 120° C. or more. The weight ratio of the electroconductive agent to the radical-polymerizable thermosetting resin system may be about 55/45 to 95/5. Such a separator is suitable for fuel cell (in particular, solid polymer-type fuel cell), and can be produced with advantageous for commercial production.Type: GrantFiled: September 12, 2001Date of Patent: October 24, 2006Assignee: Japan Composite Co., Ltd.Inventors: Hiroya Okumura, Takashi Shibata
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Patent number: 6815053Abstract: A low thermal expansion laminated plate which has excellent heat resistance, water resistance and toughness and whose average linear expansion coefficient within the temperature ranging from 40 to 150° C. is not higher than 20×10−6/° C. can be obtained by laminating and curing fiber-reinforced layers impregnated with a resin composition consisting of a radically polymerizable resin, radically polymerizable monomer and inorganic filler combined with a specific amount of a thermoplastic resin.Type: GrantFiled: January 2, 2003Date of Patent: November 9, 2004Assignees: Japan Composite Co., Ltd., Matsushita Electric Works, Ltd.Inventors: Tomoko Inoue, Hiroya Okumura, Isao Hirata, Shigehiro Okada
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Publication number: 20040096680Abstract: A low thermal expansion laminated plate which has excellent heat resistance, water resistance and toughness and whose average linear expansion coefficient within the temperature ranging from 40 to 150° C. is not higher than 20×10−6/° C. can be obtained by laminating and curing fiber-reinforced layers impregnated with a resin composition consisting of a radically polymerizable resin, radically polymerizable monomer and inorganic filler combined with a specific amount of a thermoplastic resin.Type: ApplicationFiled: January 2, 2003Publication date: May 20, 2004Inventors: Tomoko Inoue, Hiroya Okumura, Isao Hirata, Shigehiro Okada
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Publication number: 20020055030Abstract: A separator for solid polymer-type fuel cell is produced by molding the resin composition which comprises an electroconductive agent and a radical-polymerizable thermosetting resin system by a resin molding method. The electroconductive agent comprises a carbon powder. The radical-polymerizable thermosetting resin system may comprise a radical-polymerizable resin (especially, a vinyl ester-series resin) and a radical-polymerizable diluent. It is preferred that the double bond equivalent of the radical-polymerizable resin may about 200 to 1,000 and that the hardened radical-polymerizable thermosetting resin system has a glass transition temperature of 120° C. or more. The weight ratio of the electroconductive agent to the radical-polymerizable thermosetting resin system may be about 55/45 to 95/5. Such a separator is suitable for fuel cell (in particular, solid polymer-type fuel cell), and can be produced with advantageous for commercial production.Type: ApplicationFiled: September 12, 2001Publication date: May 9, 2002Inventors: Hiroya Okumura, Takashi Shibata
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Patent number: 5886205Abstract: A process for producing silicon-containing isocyanate compounds of the general formula II, comprising thermally induced decomposition of a silicon-containing carbamic ester of the general formula I at a pH of not higher than 8 in the presence of a catalyst of at least one metal or its compound.General Formula I: ##STR1## General Formula II: ##STR2## wherein R.sup.1 to R.sup.6 and R.sup.8 each represent a hydrocarbon group, R.sup.7 represents an alkylene group having 1 to 8 carbon atoms, n, m and l represent an integer of 0 to 3 and m+n+l=3, and a, b and c represent integers of 0 to 3, 0 to 2, and 0 to 8, respectively.Type: GrantFiled: April 10, 1997Date of Patent: March 23, 1999Assignee: Takeda Chemical Industries, Ltd.Inventors: Takashi Uchida, Hiroya Okumura, Takashi Shibata, Masaaki Sasaki
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Patent number: 5854313Abstract: Fine particles of high heat resistant polymer obtained by emulsion polymerization or seeded polymerization of at least one epoxy ester (C) having two or more unsaturated bonds in one molecule and at least one reactive monomer (D) having at least one unsaturated double bond in one molecule, in the absence of a water-insoluble inorganic material as a dispersion stabilizer, the epoxy ester (C) being obtained by adding at least one unsaturated monobasic acid (B) to at least one epoxide (A-1) having at least one glycidyl group and one monocyclic hydrocarbon group in one molecule, and/or at least one epoxide (A-2) having at least one cycloaliphatic epoxy group in one molecule. The fine polymer particles have excellent heat resistance and solvent resistance, and an aqueous or alcoholic dispersion of such fine polymer particles is produced therefrom.Type: GrantFiled: April 21, 1997Date of Patent: December 29, 1998Assignee: Takeda Chemical Industries, Ltd.Inventors: Yoshimasa Omori, Hiroya Okumura, Takashi Shibata
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Patent number: 5756600Abstract: A composition useful as a sheet or bulk molding compound comprises a urethane-modified vinyl ester resin (A), or acid-addition vinyl ester resn (A') obtained by reacting the hydroxyl groups in (A) with a polybasic acid anhydride (B), and a double bond(s)-containing monomer (C), wherein (A) is prepared by reacting a vinyl ester resin (F) derived from the reaction of an epoxy resin (D) and an unsaturated monobasic acid (E), with a polyisocyanate (H) and, optionally, a hydroxyl group(s)-containing (meth)acrylate (G) in an isocyanate:hydroxyl groups equivalent ratio of from 0.01-1.2:1.Type: GrantFiled: August 9, 1996Date of Patent: May 26, 1998Assignee: Takeda Chemical Industries, Ltd.Inventors: Hiroya Okumura, Toshiaki Uchida, Koichi Akiyama, Kenichi Morita, Takashi Shibata