Patents by Inventor Hiroya SEIKE

Hiroya SEIKE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE
    Publication number: 20180286791
    Abstract: An electronic component module includes: a first lead frame including a mounting portion on which a chip is mounted, a relay portion connected to an electrode portion of the chip by a lead wire, and a first lead portion connected to the relay portion; a second lead frame including a second lead portion connected to the first lead portion and having a thickness larger than that of the first lead frame; a first molded portion that covers the mounting portion and the relay portion in a state where the first lead portion protrudes; and a second molded portion that covers a connecting portion between the first lead portion and the second lead portion in a state where the first lead portion and the second lead portion protrude.
    Type: Application
    Filed: March 15, 2018
    Publication date: October 4, 2018
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Minoru SHINOHARA, Hiroya SEIKE