Patents by Inventor Hiroya TSUCHIDA

Hiroya TSUCHIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250188267
    Abstract: An object of the present invention is to provide an epoxy resin composition having excellent viscosity stability and having a high compression property and high fracture toughness at the time of wet heating, and to provide a fiber-reinforced composite material obtained by using, as a matrix resin, a cured resin obtained by curing the epoxy resin composition. An epoxy resin composition including a component [A] and a component [B] and satisfying Condition 1 and Condition 2 described below: [A]: a tetrafunctional glycidyl amine type epoxy resin, [B]: dimethylthiotoluenediamine, Condition 1: in the epoxy resin composition, a content of the component [A] is 20 parts by mass or more and 80 parts by mass or less with respect to 100 parts by mass of a total epoxy resin, Condition 2: in the epoxy resin composition, a value (E82/E23) obtained by dividing a flexural modulus (82° C. under wet condition) by a flexural modulus (at 23° C. and 50% RH) is 0.75 or more.
    Type: Application
    Filed: March 16, 2023
    Publication date: June 12, 2025
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Ko MATSUKAWA, Daisuke KONISHI, Noriyuki HIRANO, Hiroya TSUCHIDA
  • Publication number: 20230416448
    Abstract: A purpose of the present invention is to provide a thermosetting epoxy resin composition that manifests latency at a temperature at which the thermosetting resin cures and has an excellent curing rate, and molded articles obtained by thermosetting the same. A further purpose is to provide a fiber-reinforced composite material obtained by blending with reinforcing fibers, a molding material for a fiber-reinforced composite material, and a method for producing a fiber-reinforced composite material. To achieve the above, the thermosetting epoxy resin composition of the present invention is a thermosetting epoxy resin composition including the following constituent elements [a], [b], and [c], wherein the relationship between the curing time (Tc) and the induction time (Ti) satisfies 1<Tc/Ti?9.
    Type: Application
    Filed: December 16, 2021
    Publication date: December 28, 2023
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Hiroya TSUCHIDA, Daisuke KONISHI, Nobuyuki TOMIOKA