Patents by Inventor Hiroyasu Koto
Hiroyasu Koto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9786450Abstract: A membrane switch in which a first conductive part is formed on a first substrate, a second conductive part is formed on a second substrate, and the substrates are layered via a spacer such that the conductive parts face each other with a space therebetween, and an organic material showing piezoelectricity is filled, or disposed in the space such that an air gap is present, are useful for obtaining an output signal corresponding to an applied pressure.Type: GrantFiled: May 7, 2015Date of Patent: October 10, 2017Assignee: AJINOMOTO CO., INC.Inventors: Yoshinori Wada, Hiroyasu Koto, Yuichi Watanabe, Sei Uemura, Manabu Kitazawa, Satoru Ohashi, Toshihide Kamata
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Publication number: 20150311012Abstract: A membrane switch in which a first conductive part is formed on a first substrate, a second conductive part is formed on a second substrate, and the substrates are layered via a spacer such that the conductive parts face each other with a space therebetween, and an organic material showing piezoelectricity is filled, or disposed in the space such that an air gap is present, are useful for obtaining an output signal corresponding to an applied pressure.Type: ApplicationFiled: May 7, 2015Publication date: October 29, 2015Applicant: AJINOMOTO CO., INC.Inventors: Yoshinori WADA, Hiroyasu Koto, Yuichi Watanabe, Sei Uemura, Manabu Kitazawa, Satoru Ohashi, Toshihide Kamata
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Patent number: 7479534Abstract: The present application relates to a one-component epoxy resin composition that contains an epoxy resin containing: (1) an epoxy resin having 2 or more epoxy groups in the molecule, (2) a polythiol compound having 2 or more thiol groups in the molecule, (3) a compound that releases a basic component under a curing temperature condition and dissolves in constituent (2), and (4) a compound having Lewis acidity. The present invention also relates to a method of producing the same.Type: GrantFiled: July 24, 2006Date of Patent: January 20, 2009Assignee: Ajinomoto Co., Inc.Inventors: Hiroshi Amano, Osamu Yamabe, Hiroyasu Koto
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Patent number: 7226976Abstract: Provided are a latent curing agent that gives an epoxy resin composition with improved storage stability and low-temperature curability; and a curable epoxy resin composition prepared by mixing the said curing agent and an epoxy compound. The epoxy resin composition has improved storage stability, and cures at lower temperatures for a shorter period of time than conventional ones. The latent curing agent for epoxy resin comprises two components, (A) a radically polymerized polymer of a monomer having at least a polymerizable double bond, which has at least a tertiary amino group in the molecule, and (B) a polymer having at least a hydroxyl group in the molecule, and forms a solid solution that is solid at 25° C.Type: GrantFiled: April 21, 2005Date of Patent: June 5, 2007Assignee: Ajinomoto Co., Inc.Inventors: Hiroyasu Koto, Junji Ohashi, Hiroshi Sakamoto, Masato Kobayashi
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Publication number: 20070021582Abstract: The present application relates to a one-component epoxy resin composition that contains an epoxy resin containing: (1) an epoxy resin having 2 or more epoxy groups in the molecule, (2) a polythiol compound having 2 or more thiol groups in the molecule, (3) a compound that releases a basic component under a curing temperature condition and dissolves in constituent (2), and (4) a compound having Lewis acidity. The present invention also relates to a method of producing the same.Type: ApplicationFiled: July 24, 2006Publication date: January 25, 2007Applicant: Ajinomoto Co., Inc.Inventors: Hiroshi Amano, Osamu Yamabe, Hiroyasu Koto
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Publication number: 20050187371Abstract: Provided are a latent curing agent that gives an epoxy resin composition with improved storage stability and low-temperature curability; and a curable epoxy resin composition prepared by mixing the said curing agent and an epoxy compound. The epoxy resin composition has improved storage stability, and cures at lower temperatures for a shorter period of time than conventional ones. The latent curing agent for epoxy resin comprises two components, (A) a radically polymerized polymer of a monomer having at least a polymerizable double bond, which has at least a tertiary amino group in the molecule, and (B) a polymer having at least a hydroxyl group in the molecule, and forms a solid solution that is solid at 25° C.Type: ApplicationFiled: April 21, 2005Publication date: August 25, 2005Applicant: Ajinomoto Co., Inc.Inventors: Hiroyasu Koto, Junji Ohashi, Hiroshi Sakamoto, Masato Kobayashi
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Patent number: 6545166Abstract: In this application is disclosed a process for producing 3,9-bis(2-chloroethyl)-2,4,8,10-tetraoxaspiro[5.5]undecane comprising a step of reacting acrolein, pentaerythritol, and hydrogen chloride at one step, according to which the compound can be obtained conveniently in high yields.Type: GrantFiled: June 26, 2002Date of Patent: April 8, 2003Assignee: Ajinomoto Co., Inc.Inventors: Masao Honma, Atsushi Mashita, Hiroyasu Koto
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Publication number: 20030028037Abstract: In this application is disclosed a process for producing 3,9-bis(2-chloroethyl)-2,4,8,10-tetraoxaspiro[5.5]undecane comprising a step of reacting acrolein, pentaerythritol, and hydrogen chloride at one step, according to which the compound can be obtained conveniently in high yields.Type: ApplicationFiled: June 26, 2002Publication date: February 6, 2003Applicant: AJINOMOTO CO., INC.Inventors: Masao Honma, Atsushi Mashita, Hiroyasu Koto
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Publication number: 20030004296Abstract: Provided are a latent curing agent that gives an epoxy resin composition with improved storage stability and low-temperature curability; and a curable epoxy resin composition prepared by mixing the said curing agent and an epoxy compound. The epoxy resin composition has improved storage stability, and cures at lower temperatures for a shorter period of time than conventional ones. The latent curing agent for epoxy resin comprises two components, (A) a radically polymerized polymer of a monomer having at least a polymerizable double bond, which has at least a tertiary amino group in the molecule, and (B) a polymer having at least a hydroxyl group in the molecule, and forms a solid solution that is solid at 25° C.Type: ApplicationFiled: May 16, 2002Publication date: January 2, 2003Applicant: Ajinomoto Co., Inc.Inventors: Hiroyasu Koto, Junji Ohashi, Hiroshi Sakamoto, Masato Kobayashi
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Patent number: 5723262Abstract: An alkali soluble resin and a resin composition thereof useful as a solder resist, having good adhesive properties, solder heat resistance, and plating resistance are provided. Particular resistance to plating under alkaline conditions is provided by the invention.Type: GrantFiled: July 9, 1996Date of Patent: March 3, 1998Assignee: Ajinomoto Co., Inc.Inventors: Shigeo Nakamura, Masahiko Oshimura, Kenichi Mori, Tadahiko Yokota, Hiroyasu Koto
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Patent number: 5506321Abstract: A photosensitive resin composition or photosensitive heat-curing resin composition comprising a photocurable oligomer containing 2 or more polymerizable double bonds and a carboxyl group and a heat-curing component selected from a compound containing one polymerizable double bond and one epoxy group, a compound containing one or more polymerizable double bonds and one or more blocked isocyanate groups; a photosensitive resin composition comprising a photocurable oligomer containing a carboxyl group, a blocked isocyanate group and 2 or more polymerizable double bonds; and a novel compound containing one or more polymerizable double bonds and one or more blocked isocyanate groups are disclosed. The resin compositions have high photosensitivity, excellent developability and provide a solder resist pattern with excellent properties.Type: GrantFiled: October 29, 1993Date of Patent: April 9, 1996Assignee: Ajinomoto Co., Inc.Inventors: Hiroyasu Koto, Kiyonori Furuta, Eiko Nakao, Shigeo Nakamura