Patents by Inventor Hiroyasu MIYAKAWA

Hiroyasu MIYAKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LAMINATION MOLDING APPARATUS, MOLDING STATE ESTIMATION SYSTEM, MOLDING STATE ESTIMATION METHOD, MOLDING STATE ESTIMATION PROGRAM, AND LEARNING METHOD OF LEARNING MODEL FOR MOLDING STATE ESTIMATION
    Publication number: 20220118520
    Abstract: The present invention provides a system capable of estimating a molding state in a manufacturing process of the lamination molded object. According to the present invention, provided is a system for estimating a molding state in a manufacturing process of the lamination molded object including an image acquisition unit and an analysis unit. The lamination molded object is manufactured by repeating a material layer forming step of forming a material layer by supplying material powder onto a molding region and a solidified layer forming step of forming a solidified layer by irradiating the material layer with a laser beam. The image acquisition unit is configured to acquire image data of a spatter generated around a molten pool formed by irradiation with the laser beam. The analysis unit is configured to analyze the image data to estimate a parameter representing the molding state.
    Type: Application
    Filed: September 21, 2021
    Publication date: April 21, 2022
    Applicant: Sodick Co., Ltd.
    Inventors: Masahiro TAKANO, Yuta YOSHIDA, Hiroyasu MIYAKAWA, Shuji OKAZAKI, Ichiro ARAIE, Yasuyuki MIYASHITA