Patents by Inventor Hiroyasu Nagata

Hiroyasu Nagata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220323272
    Abstract: To provide a stretchable laminate, a locking member, and a sanitary material that can be easily extended at a low stress as well as can enhance the strength. A stretchable laminate 10 according to one embodiment includes a non-woven fabric 14, an elastomer layer 13 laminated on the non-woven fabric 14, and a knitted fabric 15 laminated on the elastomer layer 13. A locking member according to one embodiment is a locking member that is attached to a sanitary material, the locking member including a stretchable laminate 10 including a knitted fabric 15 laminated on an elastomer layer 13, and an engaging portion provided on an end portion of the stretchable laminate 10 opposite to the sanitary material.
    Type: Application
    Filed: June 16, 2020
    Publication date: October 13, 2022
    Inventors: Kioshi Kunihiro, Hiroyasu Nagata, Hirofumi Hosokawa
  • Publication number: 20200163391
    Abstract: The stretchable material according to one embodiment is a stretchable material (10) including: a core layer containing an elastomer; and a skin layer provided on a main surface of the core layer, the stretchable material (10) having a plurality of through-holes (15) passing through the core layer and the skin layer, and height (H) of protrusions (15b) formed on the outer edges of the through-holes (15) being not greater than 160 ?m.
    Type: Application
    Filed: May 10, 2018
    Publication date: May 28, 2020
    Inventors: Kenichiro Morishita, Hiroyasu Nagata, Nobuharu Arai
  • Publication number: 20200030164
    Abstract: A securing member is provided with a first, second, and third strip member, and the strip members are folded and laminated. The first strip member has a strip-shaped first substrate layer and a first adhesive layer provided on a first surface of the first substrate layer; the second strip member has a strip-shaped second substrate layer positioned between the first and third strip members, and a third adhesive layer provided on a first surface of the second substrate layer; and the third strip member has a strip-shaped third substrate layer and a third adhesive layer provided on a first surface of the third substrate layer. A portion of the first adhesive layer is detachably adhered to a second surface of the second substrate layer; a portion of the second adhesive layer is detachably adhered to a second surface of the third substrate layer; and the second substrate layer has elasticity.
    Type: Application
    Filed: January 26, 2018
    Publication date: January 30, 2020
    Inventors: Yoshihisa Matsuda, Hirofumi Hosokawa, Kioshi Kunihiro, Makoto Nagase, Hiroyasu Nagata, Masashi Sonoda
  • Publication number: 20160106633
    Abstract: A skin care sheet comprising a nonwoven fabric; the nonwoven fabric having a break elongation of at least 250%; the nonwoven fabric comprising an embossed section and a non-embossed section defined by the embossed section, the non-embossed pattern having a pitch of 1.2 to 10.0 mm; a proportion of a total area of the embossed section occupying from 5 to 30% of a total area of the nonwoven fabric on at least one surface of the nonwoven fabric; fibers present in the nonwoven fabric having a number-average fiber diameter of 0.1 to 15.0 ?m; and the fibers containing a resin having a flexural modulus of 0.5 GPa or less, as well as a skin care article comprising the sheet, are provided.
    Type: Application
    Filed: May 30, 2014
    Publication date: April 21, 2016
    Inventors: Hiroyasu Nagata, Eiichi Fujieda, Yukari Sekiya
  • Publication number: 20120279770
    Abstract: A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode.
    Type: Application
    Filed: July 20, 2012
    Publication date: November 8, 2012
    Applicant: IBIDEN CO., LTD.
    Inventor: Hiroyasu NAGATA
  • Patent number: 8261435
    Abstract: A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: September 11, 2012
    Assignee: Ibiden Co., Ltd.
    Inventor: Hiroyasu Nagata
  • Publication number: 20120058329
    Abstract: A pressure sensitive adhesive is obtained by polymerizing a mixture containing: (1) 100 mass parts of (meth)acrylic monomer comprising 98-50 mass parts of a first monomer selected from an aliphatic (meth)alkyl acrylate having a carbon number of 4-6 and an aliphatic (meth)alkyl acrylate having a carbon number of 7-12, wherein the glass transition temperature of a homo-polymer thereof is ?25 degrees C. or less; and 2-50 mass parts of a second monomer comprising one or more selected from the group consisting of: an amide group-containing ethylenic unsaturated copolymerizing monomer, a carboxylic group-containing ethylenic unsaturated copolymerizing monomer, an amino group-containing ethylenic unsaturated copolymerizing monomer, a non-tertial alkyl(meth)acrylate wherein the glass transition temperature of a homo-polymer thereof is ?25 degrees C.
    Type: Application
    Filed: November 24, 2009
    Publication date: March 8, 2012
    Inventors: Aizoh . Sakurai, Yasuhiro Mino, Hiroyasu Nagata, Kosuke Sugawa
  • Publication number: 20100163290
    Abstract: A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode.
    Type: Application
    Filed: October 27, 2009
    Publication date: July 1, 2010
    Applicant: IBIDEN CO., LTD.
    Inventor: Hiroyasu Nagata
  • Patent number: 6068675
    Abstract: A blocking plate 16 and sealing members 17 and 18 are disposed in bonnet 1 around the outer surface of a radiator 11 so as to form an intake space 1a and an exhaust space 1b both in the front and the rear of radiator 11. Recessed portion 4a extending across intake space 1a and exhaust space 1b is disposed at side panel 4 and is covered with second dustproof net 7. Opening 4b is opened at recessed portion 4a adjacent to intake space 1a.
    Type: Grant
    Filed: September 4, 1998
    Date of Patent: May 30, 2000
    Assignee: Kanzaki Kokyukoki Mfg. Co., Ltd.
    Inventors: Toshio Tsuda, Hiroyasu Nagata
  • Patent number: 6041880
    Abstract: A frame is disposed between an engine and a transmission casing and is made of three sheet metal parts; an engine mounting part, a transmitting shaft covering part and a transmission casing mounting part. The transmitting shaft covering part consists of two laterally or vertically separable halves which join each other to form a barrel. One end of each half is fixed to the engine mounting part, while the other end is fixed to the transmission casing mounting part. Reinforcing members are disposed below a transmitting shaft housed in the transmitting shaft covering part. An expanded portion is disposed at the other end of the transmitting shaft covering part. An opening edge of the expanded portion is fixed to the transmission casing mounting part.
    Type: Grant
    Filed: November 13, 1997
    Date of Patent: March 28, 2000
    Assignee: Kanzaki Kokyukoki Mfg. Co., Ltd.
    Inventors: Naoki Yamakaji, Yoshitaka Ishimaru, Takatoshi Meno, Hiroyasu Nagata, Toshio Tsuda
  • Patent number: 6030029
    Abstract: A bonnet of a vehicle, which contains an engine room, consists of a front panel and side panels mounted on a frame structure of the vehicle and a hood vertically rotatably mounted over the front and side panels. Left and right second upright frames are erected on the upper surface of a front portion of a bottom plate which is spread over left and right horizontal frames. The left and right second upright frames are provided with a forward segment having an upward pin. The upper outer side surface of the left and right second upright frames are further provided with a lateral, outward segment having an upward pin. A first upright frame, which supports a dashboard, is provided on its left and right outer portions thereof with lateral outward segments having upward pins. Left and right horizontal frames are provided on the lower outer side portions of first upright frame with respective segments having respective holes. The front portion of the bottom plate is provided with holes.
    Type: Grant
    Filed: October 1, 1998
    Date of Patent: February 29, 2000
    Assignee: Kanzaki Kokyukoki Mfg. Co., Ltd.
    Inventors: Toshio Tsuda, Shigeo Harada, Hiroyasu Nagata