Patents by Inventor Hiroyasu Oochi

Hiroyasu Oochi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110177328
    Abstract: [Problem] To provide an ionomer resin capable of forming a polyolefin molded product having well-balanced two properties of molding processability and mechanical property, a resin composition including the ionomer resin and a molded product formed from the ionomer resin or the resin composition. [Solution to problem] An ionomer resin (X1) formed from 100 parts by weight of (A) an olefin polymer having constitutional units derived from an ?-olefin of 2 to 20 carbon atoms and having a functional group (a) and 0.01 to 100 parts by weight of (B) a metal salt having two or more functional groups (b).
    Type: Application
    Filed: August 26, 2009
    Publication date: July 21, 2011
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Hirokazu Tanaka, Takayuki Onogi, Hiroyasu Oochi, Shigenobu Ikenaga
  • Publication number: 20110028658
    Abstract: An ionomer resin composition according to the present invention is obtained by bringing a functional group-containing olefin copolymer (A) having a structural unit derived from a cyclic olefin in the range of 10 percent by mol or more and having a group derived from an acid and/or a derivative thereof as the functional group into contact with a metal compound (B). A shaped article having well-balanced two excellent properties of the optical characteristics and the moisture permeability can be formed by using the ionomer resin composition.
    Type: Application
    Filed: March 30, 2009
    Publication date: February 3, 2011
    Applicant: MITSUI CHEMICALS, INC.
    Inventors: Hirokazu Tanaka, Takayuki Onogi, Hiroyasu Oochi
  • Publication number: 20100311892
    Abstract: An object of the present invention is to provide an aid for filler-reinforced resins, a filler-reinforced resin composition comprising the aid for filler-reinforced resins, and a molded article formed from the filler-reinforced resin composition. The above aid for filler-reinforced resins is capable of improving reinforcing properties and dispersibility of the filler in the filler-reinforced resin composition, and when the filler-reinforced resin composition is formed into a molded article, the aid for filler-reinforced resins enables the molded article to have superior mechanical characteristics, such as an impact resistance and a flexural strength.
    Type: Application
    Filed: November 26, 2008
    Publication date: December 9, 2010
    Applicant: MITSUI CHEMICALS, INC
    Inventors: Akihide Mori, Hiroyasu Oochi
  • Publication number: 20100183881
    Abstract: In a coextrusion molding method, a laminate having excellent interlaminar adhesion strength with a fluorocopolymer is provided, and also a laminate which can be used more than enough even at high temperatures or in applications where the laminate comes into contact with oil, gasoline or the like by controlling various properties of the adhesive layer is provided. The laminate of the present invention is a laminate of at least two or more layers comprising a structure obtained by bonding and laminating an adhesive (A) defined by the following (i) to (iii) and a fluorocopolymer (B), wherein the adhesive (A) (i) is obtained by allowing a polyolefin (a) having a group reactive with a carbodiimide group to react with a compound (b) having a carbodiimide group, (ii) has a ratio of peak intensity at 2130 to 2140 cm?1 to peak intensity at 1470 cm?1 of 60% or lower in infrared absorption spectroscopy, and (iii) has a density of 0.870 to 0.940 g/cm3.
    Type: Application
    Filed: January 24, 2007
    Publication date: July 22, 2010
    Inventors: Shigeyuki Yasui, Setsuko Funaki, Koji Kitahara, Akihide Mori, Hiroyasu Oochi
  • Patent number: 5580918
    Abstract: A polyimide resin composition comprising 50-95 parts by weight of a polyimide resin represented by the following formula (1): ##STR1## wherein X represents a direct bond, a hydrocarbon group, a carbonyl group, a thio group or so, Y.sub.1 -Y.sub.4 individually represent a hydrogen atom, a lower alkyl group or so and R.sub.1 represents an aliphatic group, an aromatic group or so; and 50-5 parts by weight of a polyetheretherketone, said composition having been subjected to heat treatment at 250.degree.-330.degree. C. and, after the heat-treatment, having crystallization enthalpy of 0-6 cal/g.The heat treatment of the polyimide resin composition can be effected at a low temperature in a short time. The polyimide resin composition has excellent dimensional stability and high-temperature physical properties. Moreover, it has excellent moldability and peeling resistance.
    Type: Grant
    Filed: February 16, 1994
    Date of Patent: December 3, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Atsushi Morita, Yoshihisa Gotoh, Toshiaki Takahashi, Kayako Ito, Hiroyasu Oochi, Tomohito Koba, Katunori Simamura, Hiroaki Tomimoto, Nobuhiro Takizawa
  • Patent number: 5516837
    Abstract: A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.
    Type: Grant
    Filed: March 2, 1994
    Date of Patent: May 14, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Toshihiko Tsutsumi, Toshiyuki Nakakura, Toshiaki Takahashi, Atsushi Morita, Yoshihisa Gotoh, Hiroyasu Oochi
  • Patent number: 5514748
    Abstract: A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: May 7, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Toshihiko Isutsumi, Toshiyuki Nakakura, Shuichi Morikawa, Katsunori Shimamura, Toshiaki Takahashi, Atsushi Morita, Nobuhito Koga, Akihiro Yamaguchi, Masahiro Ohta, Yoshihisa Gotoh, Masaki Amano, Hiroyasu Oochi, Kayako Ito
  • Patent number: 5312866
    Abstract: A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.
    Type: Grant
    Filed: May 14, 1992
    Date of Patent: May 17, 1994
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Toshihiko Tsutsumi, Toshiyuki Nakakura, Shuichi Morikawa, Katsunori Shimamura, Toshiaki Takahashi, Atsushi Morita, Nobuhito Koga, Akihiro Yamaguchi, Masahiro Ohta, Yoshihisa Gotoh, Masaki Amano, Hiroyasu Oochi, Kayako Ito