Abstract: The vaporization type humidification unit includes a vaporization unit that evaporates moisture, a first blower that sucks humidification air humidified by the vaporization unit, a transport tube that is connected to the first blower and through which the air discharged from the first blower is transported, a second blower connected to the transport tube and discharging the humidification air discharged from the first blower side toward outside, an opening provided in a middle of the transport tube, a humidity measurement unit installed on a discharging side of the second blower, and a control unit that controls an air flow rate discharged from the first blower and the second blower, in which the control unit controls the air flow rate discharged from the second blower to a desired value and controls the air flow rate discharged from the first blower based on a humidity measured by the humidity measurement unit.

Abstract: The vaporization type humidification unit includes a vaporization unit that evaporates moisture, a first blower that sucks humidification air humidified by the vaporization unit, a transport tube that is connected to the first blower and through which the air discharged from the first blower is transported, a second blower connected to the transport tube and discharging the humidification air discharged from the first blower side toward outside, an opening provided in a middle of the transport tube, a humidity measurement unit installed on a discharging side of the second blower, and a control unit that controls an air flow rate discharged from the first blower and the second blower, in which the control unit controls the air flow rate discharged from the second blower to a desired value and controls the air flow rate discharged from the first blower based on a humidity measured by the humidity measurement unit.

Abstract: A package for an electronic component includes a first substrate and a second substrate. In the package, an interior space capable of housing the electronic component is formed between the first substrate and the second substrate, a sealing hole communicating with the interior space and an exterior is formed in at least one of the first substrate and the second substrate, the interior space can be airtightly sealed by melting a solid sealant provided in the sealing hole, and an interior wall of the sealing hole has a curved surface extending in directions of penetration and inner periphery of the sealing hole.

Abstract: A package for an electronic component includes a first substrate and a second substrate. In the package, an interior space capable of housing the electronic component is formed between the first substrate and the second substrate, a sealing hole communicating with the interior space and an exterior is formed in at least one of the first substrate and the second substrate, the interior space can be airtightly sealed by melting a solid sealant provided in the sealing hole, and an interior wall of the sealing hole has a curved surface extending in directions of penetration and inner periphery of the sealing hole.